公开(公告)号：US20150351242A1

公开(公告)日：2015-12-03

申请号：US14715943

申请日：2015-05-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ANDREAS C. DOERING ,  RALPH HELLER ,  RONALD P. LUIJTEN ,  MARTIN L. SCHMATZ

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/73

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

Abstract translation: 印刷电路板（PCB）组件包括基本上平行且彼此相对设置的第一PCB和第二PCB，使得第一PCB的第二面与第二PCB的第一侧相对; 其中所述第二PCB在其第一侧上具有第一组侧连接器，在其第二侧上具有第二组侧连接器，其被配置用于与所述第二PCB的电力供应和信号通信; 第二PCB经由第一弹性体连接器电连接和机械地连接到第一PCB的第二侧; 并且所述第二PCB经由其第二组侧连接器电连接到所述第一PCB，以及电连接到所述第二组侧连接器和所述第一PCB的柔性电连接器。

公开(公告)号：US20150277503A1

公开(公告)日：2015-10-01

申请号：US14626723

申请日：2015-02-19

Applicant: Google, Inc.

Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

IPC: G06F1/16 ,  H04M1/02 ,  H04W88/02

CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

Abstract translation: 本文的示例包括用于耦合到计算设备的模块的模块和连接。 示例性模块包括壳体，其包括耦合到计算设备的端部，多个电容焊盘，每个电容焊盘包括用于实现数据传输的数据触点，功率接触焊盘以提供或接收电力，以及接地触点焊盘以耦合到地。 接地焊盘的尺寸大于电源接触焊盘，并且接地焊盘定位成比电源接触焊盘更接近配置成耦合到计算设备的壳体的端部。

公开(公告)号：US09130329B1

公开(公告)日：2015-09-08

申请号：US14199663

申请日：2014-03-06

Applicant: Telebox Industries Corp.

Inventor： Fu-Wen Wu ,  Su-Hui Huang ,  Ching-Yi Hsu

IPC: H01R24/00 ,  H01R24/64 ,  H01R13/6466 ,  H05K3/30

CPC classification number: H01R24/64 ,  H01R13/6466 ,  H05K1/0218 ,  H05K1/141 ,  H05K2201/0311 ,  H05K2201/041 ,  H05K2201/10303 ,  Y10T29/49147

Abstract: A connector includes an insulated housing having a slot and a transmission assembly located inside the insulated housing. The transmission assembly includes a main circuit board, an expanded circuit board, a plurality of first terminals and at least one second terminal. The expanded circuit board is stacked on the main circuit board and a first lateral side and a second lateral side of the expanded circuit board which are opposite to each other has a plurality of first electrical contacts and at least one second electrical contact, respectively. The first terminals and the at least one second terminal are plugged in the main circuit board. One ends of the first terminals are in electrical contact with the first electrical contacts respectively. The other ends of the first terminals bend and extend towards the second lateral side of the expanded circuit board.

Abstract translation: 连接器包括具有狭槽的绝缘壳体和位于绝缘壳体内部的传动组件。 传动组件包括主电路板，扩展电路板，多个第一端子和至少一个第二端子。 扩展电路板堆叠在主电路板上，并且彼此相对的扩展电路板的第一横向侧和第二横向侧分别具有多个第一电触点和至少一个第二电接触。 第一端子和至少一个第二端子插入主电路板。 第一端子的一端分别与第一电触点电接触。 第一端子的另一端朝向扩展电路板的第二侧面弯曲并延伸。

公开(公告)号：US20150243609A1

公开(公告)日：2015-08-27

申请号：US14190745

申请日：2014-02-26

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H01L23/64 ,  H01L23/367 ,  H01L23/498 ,  H01L23/36 ,  H01L23/552 ,  H01L23/50

CPC classification number: H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1624 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H02J7/0042 ,  H02J7/0052 ,  H02J7/345 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/0999 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/014 ,  H01L2924/00

Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

Abstract translation: 封装组件包括管芯堆叠和相关使用方法。 包装组件包括具有第一表面，第二表面和与从第一表面延伸到第二表面的通孔邻接的第三表面的基底。 组件还包括管芯叠层，导电层和盖。 芯片堆叠包括位于衬底中的通孔内的芯片。 导电层的一部分设置在基板的第三表面上。 盖的一部分设置在第一芯片和导电层的部分之间。 导电层被配置为与电力耦合，并且盖被配置为与地耦合。 盖的部分可以用作电容器的第一板，并且导电层的部分可以用作电容器的第二板。

公开(公告)号：US09032617B2

公开(公告)日：2015-05-19

申请号：US13326845

申请日：2011-12-15

Applicant: David J. Braun ,  Mark G. Clark ,  John R. Dangler ,  Matthew S. Doyle ,  Thomas D. Kidd ,  Jason T. Stoll

Inventor： David J. Braun ,  Mark G. Clark ,  John R. Dangler ,  Matthew S. Doyle ,  Thomas D. Kidd ,  Jason T. Stoll

IPC: H01R12/61 ,  H01R12/79 ,  H05K3/36 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01R12/52 ,  H01R12/77

CPC classification number: H01R43/01 ,  H01R12/52 ,  H01R12/613 ,  H01R12/778 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/058 ,  H05K2201/09181 ,  H05K2201/09618 ,  H05K2201/10189 ,  Y10T29/49174 ,  Y10T29/49194 ,  Y10T29/4922

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract translation: 一种电缆组件，用于通过连接到每个电路板的连接器组件将多个电路板互连在一起。 电缆组件包括具有第一端部的第一电缆和具有第二端部的第二电缆。 第一端部的第一周边具有沿着连接器组件的宽度方向共同形成列的多个第一半通孔。 第二端部的第二周边具有沿着连接器组件的宽度方向共同形成列的多个第二半通孔。 第一和第二端部联接在一起以形成连接单元，使得第一半通孔和第二半通孔连接在一起以形成完整的通孔。

公开(公告)号：US20150098191A1

公开(公告)日：2015-04-09

申请号：US14507779

申请日：2014-10-06

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K1/02 ,  H05K1/11 ,  H05K7/20

CPC classification number: H01L21/4882 ,  H01L21/4803 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/02327 ,  H01L31/024 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H01S5/02469 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/00

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract translation: 描述了用于紧凑型电子设备的硅散热封装的实施例。 在一个方面，一种装置包括第一和第二硅覆盖板。 第一硅覆盖板具有与第一初级侧相对的第一初级侧和第二初级侧。 第二硅覆盖板具有与第一初级侧相对的第一初级侧和第二初级侧。 第二硅覆盖板的第一初级侧包括构造成在其中容纳电子器件的凹陷。 当第一硅覆盖板和第二硅覆盖板与夹在其间的电子器件接合在一起时，第二硅覆盖板的第一初级侧被配置为与第一硅覆盖板的第二初级侧配合。

公开(公告)号：US20150060124A1

公开(公告)日：2015-03-05

申请号：US14473235

申请日：2014-08-29

Applicant: IBIDEN CO., LTD.

Inventor： Makoto TERUI ,  Takashi KARIYA ,  Yoshinori SHIZUNO ,  Masatoshi KUNIEDA

IPC: H05K1/11 ,  H05K3/20 ,  H05K3/40 ,  H05K1/02

CPC classification number: H05K1/111 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2924/15313 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/041 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/09827 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/0465 ,  Y02P70/611 ,  Y10T29/49128

Abstract: A combined printed wiring board includes a multilayer printed wiring board having an outermost insulation layer, and a wiring film fixed to a portion of the outermost insulation layer of the multilayer printed wiring board. The wiring film includes dense-pitch pads formed on a semiconductor-mounting surface of the wiring film, the multilayer printed wiring board has sparse-pitch pads formed on a semiconductor-mounting surface of the multilayer printed wiring board, the dense-pitch pads are formed to facilitate electrical connection between a first semiconductor element and a second semiconductor element, and the sparse-pitch pads are formed to facilitate electrical connection between the multilayer printed wiring board and the first semiconductor element and/or the second semiconductor element.

Abstract translation: 组合印刷线路板包括具有最外绝缘层的多层印刷布线板和固定到多层印刷线路板的最外层绝缘层的一部分的布线膜。 布线膜包括形成在布线膜的半导体安装表面上的密集垫片，多层印刷布线板具有形成在多层印刷布线板的半导体安装表面上的稀疏间距衬垫，密集衬垫是 形成为促进第一半导体元件和第二半导体元件之间的电连接，并且形成稀疏间距焊盘以便于多层印刷线路板与第一半导体元件和/或第二半导体元件之间的电连接。

公开(公告)号：US20140375908A1

公开(公告)日：2014-12-25

申请号：US14320034

申请日：2014-06-30

Applicant: SYNAPTICS INCORPORATED

Inventor： Joseph Kurth Reynolds ,  Shawn P. Day

IPC: H05K1/18 ,  G06F3/044 ,  G06F3/041 ,  H05K1/02

CPC classification number: G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04107 ,  H03K17/962 ,  H03K2217/960765 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

Abstract translation: 提供一种触摸传感器装置，其使用柔性电路基板来提供改进的输入装置。 具体地说，本发明使用固定在柔性电路基板上的触摸传感器控制器，其耦合到传感器部件，以提供适用于各种应用的柔性，可靠和成本有效的触摸传感器。 在一个实施例中，触摸传感器使用提供相对高耐温性的柔性电路基板。 这允许使用可靠的技术来粘贴触摸传感器控制器，例如各种类型的焊接。 传感器组件可以包括相对低温的衬底，其可以提供成本有效的解决方案。 综合起来，触摸传感器的这个实施例以相对低的成本提供可靠性和灵活性。

公开(公告)号：US20140374145A1

公开(公告)日：2014-12-25

申请号：US14314540

申请日：2014-06-25

Applicant: Medtronic, Inc.

Inventor： Paul F. Gerrish ,  Geoffrey D. Batchelder ,  Andreas Armin Fenner ,  Lary R. Larson ,  Anna J. Malin ,  Michael F. Mattes ,  Tyler Mueller ,  David A. Ruben ,  Larry E. Tyler

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/3185 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/80 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/818 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/11 ,  H05K2201/041 ,  Y10T29/49117 ,  Y10T29/49147 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.

Abstract translation: 气密密封电路装置和使用一个或多个密封部分构造这种装置的方法。

公开(公告)号：US20140284805A1

公开(公告)日：2014-09-25

申请号：US14178244

申请日：2014-02-11

Applicant: Huan Wang ,  Aipeng Shu ,  Shu An Yao

Inventor： Huan Wang ,  Aipeng Shu ,  Shu An Yao

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0652 ,  H01L24/80 ,  H01L25/50 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/041 ,  H05K2201/09027 ,  Y02P70/611 ,  H01L2924/00

Abstract: A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.

Abstract translation: 三维包装包括具有包括侧壁的柱状部分的基板和沿着柱状部分的侧壁以沿着柱状部分扭转的多个螺旋形的形式布置的台阶或台阶。 半导体集成电路（IC管芯）安装在楼梯的一个或两个支撑面上。 柱状部分，楼梯和IC模具可以用模具化合物包封。