公开(公告)号：US5509599A

公开(公告)日：1996-04-23

申请号：US194018

申请日：1994-02-09

Applicant: Hans-Bodo Laue

Inventor： Hans-Bodo Laue

IPC: H05K1/14 ,  H05K1/16 ,  H05K3/34 ,  H05K3/36 ,  B23K31/02

CPC classification number: H05K3/363 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K2201/09772 ,  H05K2201/10666 ,  H05K2201/10689 ,  H05K2203/0455 ,  H05K3/3436 ,  H05K3/368

Abstract: Hybrid circuits are usually secured with contact pins (combs) on printed circuit boards by undergoing a flow solder bath. Further, surface-mountable components are soldered on the printed circuit board in a furnace. Two soldering processes are necessary for this purpose. The method of the invention avoids one of the soldering processes by applying through-contacted bores on the carrier substrate of the hybrid circuit. These through-contacted bores are put in place onto solder surfaces of the printed circuit board having a paste solder and the overall arrangement is soldered in a furnace.

Abstract translation: 混合电路通常通过经受流动焊锡浴的方式用印刷电路板上的接触针（梳子）固定。 此外，可表面安装的部件在炉中焊接在印刷电路板上。 为此，需要两个焊接工艺。 本发明的方法通过在混合电路的载体衬底上施加通孔来避免焊接过程之一。 将这些通孔连接到具有糊状焊料的印刷电路板的焊接表面上，并且整体布置被焊接在炉中。

公开(公告)号：US5435732A

公开(公告)日：1995-07-25

申请号：US289338

申请日：1994-08-11

Applicant: Christopher G. Angulas ,  Patrick T. Flynn ,  Joseph Funari ,  Thomas E. Kindl ,  Randy L. Orr

Inventor： Christopher G. Angulas ,  Patrick T. Flynn ,  Joseph Funari ,  Thomas E. Kindl ,  Randy L. Orr

IPC: H01L23/498 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K1/11 ,  H01R9/09

CPC classification number: H01L23/49816 ,  H01L23/4985 ,  H01R12/52 ,  H05K3/363 ,  H01L2224/16 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/141 ,  H05K2201/0394 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144

Abstract: A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circuitized substrate being secured thereto.

Abstract translation: 一种柔性电路构件，包括其中具有多个孔的电介质材料的电路化基底。 位于和/或桥接选定的孔中的是电导体，导体具有固定到其上的焊料构件。 还使用框架，电路化基板被固定到其上。

公开(公告)号：US5378314A

公开(公告)日：1995-01-03

申请号：US77298

申请日：1993-06-15

Applicant: Walter Schmidt ,  Marco Martinelli

Inventor： Walter Schmidt ,  Marco Martinelli

IPC: C23F1/00 ,  H05K1/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B44C1/22 ,  B29C37/00

CPC classification number: H05K3/42 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/4084 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652

Abstract: A method for producing aligned passages through substrate materials, in which the projection of the inlet and outlet openings does not coincide, uses displaced application of etching windows on opposite sides and corresponding pronounced under-etching of these windows. By applying displaced etching windows on both sides of the substrate and through-etching the substrate through these windows, `oblique` passages are obtained through the substrate. By a suitable location of the windows it is also possible to produce branched passages with more than one outlet opening.

Abstract translation: 用于产生通过基底材料的对准的通道的方法，其中入口和出口的突出部不重合，使用在相对侧上移动施加蚀刻窗口并且对应于这些窗口的相当明显的下蚀刻。 通过在基板的两面上施加位移蚀刻窗口，并通过这些窗口对基板进行蚀刻，通过基板获得“倾斜”通道。 通过窗口的合适位置，也可以产生具有多于一个出口开口的分支通道。

公开(公告)号：US4875862A

公开(公告)日：1989-10-24

申请号：US287085

申请日：1988-12-21

Applicant: Yukio Sakamoto ,  Takeshi Tanabe ,  Iwao Fukutani ,  Toshio Hori

Inventor： Yukio Sakamoto ,  Takeshi Tanabe ,  Iwao Fukutani ,  Toshio Hori

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  C07G17/00

CPC classification number: H05K1/141 ,  H01R12/716 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/10189 ,  H05K2201/10666 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/368

Abstract: A surface mountable connector to be mounted on a printed substrate has a plurality of connector pins projecting from the rear surface to be connected with wiring patterns on the printed substrate through a connector pin holder. The connector pin holder has a plurality of through holes at a pitch equal to that of the connector pins and a plurality of conductive patterns on the outside thereof corresponding to the through holes. The connector pins are inserted into the through holes in the connector holder and electrically connected to the conductive patterns corresponding to the through holes respectively, and the connector pin holder is placed on the wiring patterns on the printed substrate with the conductive patterns on the outer surface connected to the wiring patterns on the surface of the printed substrate by soldering, thereby electrically connecting the tip of each connector pin to a corresponding wiring pattern on the surface of the printed substrate.

Abstract translation: 要安装在印刷基板上的可表面安装的连接器具有从后表面突出的多个连接器销，以通过连接器销座与印刷基板上的布线图形连接。 连接器针保持器具有多个通孔，其间距等于连接器销的间距，并且在其外侧的多个导电图案对应于通孔。 连接器插头插入连接器保持器的通孔中，并分别电连接到与通孔对应的导电图案，并且连接器针座被放置在印刷基板上的布线图案上，导体图案位于外表面 通过焊接连接到印刷基板的表面上的布线图案，从而将每个连接器针的末端电连接到印刷基板的表面上的相应布线图案。

公开(公告)号：US4499524A

公开(公告)日：1985-02-12

申请号：US549112

申请日：1983-11-07

Applicant: Lewis J. Shioleno

Inventor： Lewis J. Shioleno

IPC: H01G2/06 ,  H01G4/38 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/06

CPC classification number: H01G2/06 ,  H01G2/065 ,  H01G4/38 ,  H05K1/141 ,  H05K1/0231 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10666 ,  H05K3/3442 ,  H05K3/368 ,  Y02P70/611

Abstract: A high value surface mounted capacitor assembled from a ganged assembly of multilayer ceramic capacitors adapted to fit within a package which may be either surface mounted or pin mounted, said package being shaped for handling by automatic insertion equipment.

Abstract translation: 一种高价值的表面安装电容器，其由多层陶瓷电容器的组合组件组成，适合于装配在可以被表面安装或销安装的封装内，所述封装形状适于通过自动插入设备进行处理。

公开(公告)号：US4288840A

公开(公告)日：1981-09-08

申请号：US77760

申请日：1979-09-21

Applicant: Kaoru Konishikawa ,  Shunsuke Sasaki ,  Kouichi Higuchi ,  Fuminori Hirose

Inventor： Kaoru Konishikawa ,  Shunsuke Sasaki ,  Kouichi Higuchi ,  Fuminori Hirose

IPC: H05K1/11 ,  H01R12/51 ,  H01R31/08 ,  H05K1/00 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K3/222 ,  H05K1/0289 ,  H05K1/141 ,  H05K2201/09181 ,  H05K2201/10212 ,  H05K2201/10363 ,  H05K2201/10666 ,  H05K3/3442 ,  H05K3/368

Abstract: An improved printed circuit board for use in electrical and electronic appliances includes an electronic part for a jumper having crossover wiring and disposed on an electrically insulative substrate or base plate for the printed circuit board provided with a cross pattern of conductors in which sets of separated or cut-off conductive layers are arranged to confront each other on X-Y cross coordinates for connecting the cross pattern portions on the substrate to each other by the jumper electronic part.

Abstract translation: 用于电气和电子设备的改进的印刷电路板包括用于具有交叉布线的跳线的电子部件，并且设置在用于印刷电路板的电绝缘基板或基板上，该印刷电路板设置有导体的交叉图案，其中分离的或 切断导电层被布置为在XY十字坐标上彼此面对，以通过跳线电子部件将基板上的交叉图案部分彼此连接。

公开(公告)号：US20240324101A1

公开(公告)日：2024-09-26

申请号：US18678263

申请日：2024-05-30

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Guy Nesher

IPC: H05K1/11 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

公开(公告)号：US11877398B2

公开(公告)日：2024-01-16

申请号：US17249217

申请日：2021-02-24

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Guy Nesher

IPC: H05K1/11 ,  H05K13/04 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

公开(公告)号：US20150264810A1

公开(公告)日：2015-09-17

申请号：US14636356

申请日：2015-03-03

Applicant: FUJITSU LIMITED

Inventor： Shunji BABA ,  Manabu WATANABE ,  Kenji FUKUZONO ,  Satoshi OHSAWA ,  Tetsuro YAMADA ,  Akihiro WAKABAYASHI ,  Yasushi MASUDA ,  Yohei MIURA

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/10 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0263 ,  H05K1/11 ,  H05K1/144 ,  H05K1/184 ,  H05K1/185 ,  H05K3/22 ,  H05K3/325 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.

Abstract translation: 电路板包括：基板; 形成在基板中的通孔; 以及设置在通孔中的连接端子; 其中，所述连接端子包括设置在所述通孔内的基座部分和设置在所述基座部分的中心并且从所述基座部朝向所述基板的第一表面延伸的销，使得所述第一端部从所述第一端部突出， 表面。

公开(公告)号：US20130107468A1

公开(公告)日：2013-05-02

申请号：US13720849

申请日：2012-12-19

Applicant: STEC, INC.

Inventor： Mark MOSHAYEDI

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L23/50 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/0949 ,  H05K2201/10515 ,  H05K2201/10666 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that signals, which are common to the chips, are connected in the stack and signals, which are accessed individually, are separated within the stack.

Abstract translation: 多芯片堆叠模块为给定的表面芯片占用空间提供了增加的电路密度。 支撑结构与标准表面贴装型芯片交替形成堆叠，其中支撑结构将芯片电互连。 一个方面是用于在垂直堆叠中互连多个大致平面的芯片的结构和方法，使得在堆叠中共同连接的芯片的信号和单独访问的信号在堆栈内分离。