公开(公告)号：US09876298B2

公开(公告)日：2018-01-23

申请号：US14450361

申请日：2014-08-04

Applicant: Tyco Electronics Corporation

Inventor： Jeffery W. Mason ,  Wayne Stewart Alden, III ,  Chuan Yue

IPC: H01R12/78 ,  H01R12/77 ,  H05K1/18 ,  H05K3/32 ,  H05K1/02

CPC classification number: H01R12/78 ,  H01R12/777 ,  H05K1/028 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/0367

Abstract: A flexible connector includes a flexible substrate having a plurality of conductive pads and a plurality of conductive polymer springfingers. Each conductive polymer springfinger extends between a first end and a second end. The conductive polymer springfingers are mechanically and electrically connected to corresponding conductive pads at the corresponding second ends and the conductive polymer springfingers are configured to be mechanically and electrically connected to conductors of an electrical component at the corresponding first ends. The conductive polymer springfingers are internally conductive and compressible between the first and second ends. The conductive polymer springfingers are discrete and separated by gaps. The flexible substrate is flexible to allow the second ends of the conductive polymer springfingers to be non-coplanar and to allow the first ends of the conductive polymer springfingers to be non-coplanar for electrical connection with the electrical component.

公开(公告)号：US20180014426A1

公开(公告)日：2018-01-11

申请号：US15358742

申请日：2016-11-22

Applicant: Ku Yong KIM

Inventor： Ku Yong KIM

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K5/00 ,  H05K1/14

CPC classification number: H05K7/205 ,  H05K1/0204 ,  H05K1/144 ,  H05K1/181 ,  H05K1/182 ,  H05K3/4608 ,  H05K5/0008 ,  H05K7/20472 ,  H05K2201/0367 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10242

Abstract: A PCB module having a multi-surface heat dissipation structure is provided. The PCB module includes: a multi-layer PCB assembly which includes a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively; an upper case for covering a top surface of the multi-layer PCB assembly; and a lower case for covering a bottom surface of the multi-layer PCB assembly, and the heat dissipation plate includes; a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

公开(公告)号：US20180013251A1

公开(公告)日：2018-01-11

申请号：US15545703

申请日：2015-03-20

Applicant: Unid Co., Ltd.

Inventor： Yeong Uk SEO ,  Yeong Joo MOON ,  Chong Kwang YOON ,  Young Soo KIM

IPC: H01R43/00 ,  H01R12/58 ,  H01R12/59 ,  H01R13/24

CPC classification number: H01R43/007 ,  H01L23/498 ,  H01L23/49811 ,  H01L24/00 ,  H01R12/58 ,  H01R12/59 ,  H01R12/73 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/1059 ,  H05K2203/308

Abstract: Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.

公开(公告)号：US09795034B2

公开(公告)日：2017-10-17

申请号：US14404938

申请日：2013-05-30

Applicant: KYOCERA Corporation

Inventor： Yukio Fujihara ,  Kenjirou Fukuda

IPC: H05K1/00 ,  H05K1/11 ,  H01L33/62 ,  H05K1/18 ,  H05K7/12 ,  H05K1/02 ,  H01L33/48

CPC classification number: H05K1/111 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/181 ,  H05K1/02 ,  H05K1/112 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/0939 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: There is provided a wiring board capable of strengthening the bonding between an external terminal and a wiring of an external circuit board. A wiring board includes an insulating substrate having two main surfaces facing each other, side surfaces connecting to the two main surfaces and concave portions concave from the side surfaces and connecting to at least one of the two main surfaces; and external terminals disposed from one of the main surfaces to inner surfaces of the respective concave portions, each of the external terminals having a convex-shaped section disposed on one main surface side along each of the concave portions.

公开(公告)号：US20170245365A1

公开(公告)日：2017-08-24

申请号：US15441540

申请日：2017-02-24

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/28 ,  H05K3/02 ,  H05K3/20 ,  H05K3/30 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K1/115 ,  H01L23/49534 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/113 ,  H05K3/0061 ,  H05K3/025 ,  H05K3/205 ,  H05K3/243 ,  H05K3/284 ,  H05K3/303 ,  H05K3/388 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09527 ,  H05K2201/10674 ,  H01L2924/00012

Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.

公开(公告)号：US20170042026A1

公开(公告)日：2017-02-09

申请号：US14820572

申请日：2015-08-07

Applicant: Unimicron Technology Corp.

Inventor： Kuan-Hsi Wu ,  Pi-Te Pan ,  Chang-Fu Chen

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/119 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/113 ,  H05K1/116 ,  H05K3/0023 ,  H05K3/0097 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0367 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2203/0562 ,  H05K2203/1536 ,  Y02P70/611

Abstract: A circuit board including a substrate, a photo imageable dielectric layer and a plurality of conductive bumps is provided. The substrate has a first surface and a first circuit layer, wherein the first surface has a chip disposing area and an electrical connection area, and the first circuit layer is embedded in the first surface. The photo imageable dielectric layer is disposed on the electrical connection area and has a plurality of openings, wherein parts of the first circuit layer is exposed by the openings. The conductive bumps are disposed at the openings respectively and connected to the first circuit layer, wherein a side surface of each of the conductive bumps is at least partially covered by the photo imageable dielectric layer. In addition, a manufacturing method of the circuit board is also provided.

Abstract translation: 提供了包括基板，可光致成像介电层和多个导电凸块的电路板。 基板具有第一表面和第一电路层，其中第一表面具有芯片布置区域和电连接区域，并且第一电路层嵌入在第一表面中。 可光致成像介电层设置在电连接区域上并具有多个开口，其中第一电路层的部分被开口露出。 导电凸块分别设置在开口处并连接到第一电路层，其中每个导电凸块的侧表面至少部分被可光致成像介电层覆盖。 此外，还提供了电路板的制造方法。

公开(公告)号：US09521755B2

公开(公告)日：2016-12-13

申请号：US14271959

申请日：2014-05-07

Applicant: Invensas Corporation

Inventor： Tomoo Iijima ,  Yoshitaka Fukuoka

IPC: H05K1/14 ,  H05K1/00 ,  H05K1/18 ,  H01L23/498 ,  H05K1/16 ,  H01L23/00 ,  H05K1/03 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4007 ,  H01L23/498 ,  H01L23/49833 ,  H01L24/19 ,  H01L2924/14 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/182 ,  H05K1/187 ,  H05K1/189 ,  H05K3/06 ,  H05K3/205 ,  H05K3/46 ,  H05K3/4614 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49155 ,  H01L2924/00

Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.

Abstract translation: 公开了一种电子组件，其包括柔性绝缘膜，厚度小于50微米的半导体部件，延伸穿过柔性绝缘膜的导电互连，邻近的第二图案化金属布线膜和第三图案化金属布线膜 。 第二图案化金属布线膜通过导电互连与第三图案化金属布线膜电耦合。 半导体元件耦合到第一图案化金属布线膜和第二图案化金属布线膜或第三图案化金属布线膜中的至少一个。

公开(公告)号：US20160316558A1

公开(公告)日：2016-10-27

申请号：US15084992

申请日：2016-03-30

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke SAKAI ,  Toshiki FURUTANI ,  Kosuke IKEDA ,  Takema ADACHI ,  Takayuki KATSUNO

IPC: H05K1/11 ,  H05K3/18 ,  H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/11 ,  H01L21/486 ,  H01L23/12 ,  H01L23/145 ,  H01L23/49861 ,  H05K3/205 ,  H05K3/382 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0307

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

Abstract translation: 印刷布线板包括树脂绝缘层，布置在绝缘层中的布线导体层，使得布线层具有从绝缘层露出的第一表面，以及形成在绝缘层中的导体柱和布线层的第二表面 在相对于布线层的第一表面的相对侧，使得导体柱具有被绝缘层覆盖的侧表面和相对于布线层的相对侧上的绝缘层暴露的端面。 导体柱形成为使得导体柱的侧表面是具有第一粗糙度R1的表面粗糙度的粗糙化侧表面，导体柱的端面是具有第二粗糙度R2的表面粗糙度的粗糙化端面，并且第一 第二粗糙度R1，R2满足R1> R2。

公开(公告)号：US09363883B2

公开(公告)日：2016-06-07

申请号：US13997420

申请日：2011-12-23

Applicant: Sung Wuk Ryu ,  Seong Bo Shim ,  Seung Yul Shin

Inventor： Sung Wuk Ryu ,  Seong Bo Shim ,  Seung Yul Shin

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K3/40 ,  H05K3/34

CPC classification number: H05K1/02 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/40 ,  H05K3/4007 ,  H05K2201/0367

Abstract: A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.

Abstract translation: 根据本发明的实施例的印刷电路板包括绝缘层，形成在绝缘层上并通过阻焊剂的开口部分暴露的焊盘，通过从焊料的顶部填充阻焊剂的开口部而形成的凸块 该焊盘的宽度比阻焊剂的开口宽。

公开(公告)号：US09318820B2

公开(公告)日：2016-04-19

申请号：US14227574

申请日：2014-03-27

Applicant: Molex, LLC

Inventor： Toshihiro Niitsu ,  Motohisa Haga

IPC: H01R13/62 ,  H01R12/52 ,  H01R12/79 ,  H05K1/11 ,  H05K3/36 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01R12/523 ,  H01R12/79 ,  H05K1/117 ,  H05K3/326 ,  H05K3/365 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0367 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09863 ,  H05K2201/10303 ,  H05K2201/10386

Abstract: A connector for a multilayered board to connect a flat cable to a middle layer of a multilayered board while minimizing the impact due to variations in the dimensional precision and strength of multilayered boards and/or preventing deformation of the multilayered board and improving contact stability. The connector includes a board-side connecting portion and a cable-side connecting portion. The board-side connecting portion includes a column-shaped terminal, and the cable-side connecting portion includes flat terminals. The column-shaped terminal protrudes from the middle layer of the multilayered board in the thickness direction. The flat terminals include resilient contact portions, contacting a side surface portion of the column-shaped terminal from the width direction of the insertion slot in response to insertion of the cable-side connecting portion into the insertion slot.

Abstract translation: 一种用于多层板的连接器，用于将扁平电缆连接到多层板的中间层，同时最小化由于多层板的尺寸精度和强度的变化引起的冲击和/或防止多层板的变形并提高接触稳定性。 连接器包括板侧连接部和电缆侧连接部。 板侧连接部包括柱状端子，电缆侧连接部包括扁平端子。 柱状端子在厚度方向从多层板的中间层突出。 扁平端子包括弹性接触部分，其响应于电缆侧连接部分插入到插槽中而从插入槽的宽度方向接触到柱状端子的侧表面部分。