公开(公告)号：US20150211698A1

公开(公告)日：2015-07-30

申请号：US14326521

申请日：2014-07-09

Applicant: Radiant Opto-Electronics Corporation

Inventor： Hsiu-Hung YEH ,  Chih-Hsien CHUNG

IPC: F21S4/00 ,  F21V23/00 ,  F21V8/00 ,  F21V23/06 ,  H05K1/18

CPC classification number: F21V23/008 ,  F21S4/28 ,  F21V23/009 ,  F21V23/06 ,  F21V2200/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0083 ,  G02B6/0085 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/056

Abstract: A light bar structure, a light source module and a lamp are provided. The light bar structure includes a substrate, an electrical unit and light-emitting diodes. The substrate includes a first surface. The electrical unit includes a light-source disposing portion, at least one flexible connector and at least one electrical connection end. The light light-source disposing portion is connected to the first surface of the substrate. One end of the flexible connector is connected to the light-source disposing portion. The electrical connection end is correspondingly connected to the other end of the flexible connector. The electrical connection end is disposed on a position of the flexible connector away from the first surface of the substrate. The light-emitting diodes are disposed on the light-source disposing portion.

Abstract translation: 提供了一种灯条结构，光源模块和灯。 光棒结构包括基板，电单元和发光二极管。 基板包括第一表面。 电气单元包括光源设置部分，至少一个柔性连接器和至少一个电连接端。 光源设置部分连接到基板的第一表面。 柔性连接器的一端连接到光源设置部分。 电连接端相应地连接到柔性连接器的另一端。 电连接端设置在柔性连接器远离基板的第一表面的位置。 发光二极管配置在光源配置部上。

公开(公告)号：US20150187845A1

公开(公告)日：2015-07-02

申请号：US14498738

申请日：2014-09-26

Applicant: Samsung Display Co., Ltd.

Inventor： Tae Sik KIM

IPC: H01L27/32

CPC classification number: H01L27/323 ,  H01L27/3272 ,  H01L51/5237 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/10128

Abstract: An organic light-emitting diode (OLED) display is disclosed. In one aspect, the OLED display includes a display substrate including first and second surfaces opposing each other. The OLED display further includes a touch sensing layer formed over the encapsulation substrate and configured to sense a touch input, a display flexible printed circuit board electrically attached to the second surface of the display substrate, and a touch flexible printed circuit board electrically connected to the touch sensing layer and attached to the second surface of the display substrate. An impact absorbing layer is formed over the second surface of the display substrate and attaches the display flexible printed circuit board and the touch flexible printed circuit board to the second surface of the display substrate. The impact absorbing layer includes a metal layer electrically connected to the display flexible printed circuit board and the touch flexible printed circuit board.

Abstract translation: 公开了一种有机发光二极管（OLED）显示器。 一方面，OLED显示器包括显示基板，该显示基板包括彼此相对的第一和第二表面。 OLED显示器还包括形成在封装基板上并被配置为感测触摸输入的触摸感测层，电连接到显示基板的第二表面的显示柔性印刷电路板，以及电连接到显示基板的触摸柔性印刷电路板 触摸感测层并附接到显示基板的第二表面。 在显示基板的第二表面上形成冲击吸收层，并将显示器柔性印刷电路板和触摸柔性印刷电路板连接到显示基板的第二表面。 冲击吸收层包括电连接到显示器柔性印刷电路板和触摸柔性印刷电路板的金属层。

公开(公告)号：US20150136837A1

公开(公告)日：2015-05-21

申请号：US14404285

申请日：2013-03-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akira Maeda ,  Kennan Mou ,  Toshihiko Nagaya

IPC: H05K13/08 ,  B23K3/06 ,  B23K1/00 ,  H05K3/34

CPC classification number: H05K13/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/341 ,  H05K3/3484 ,  H05K13/0815 ,  H05K2201/053 ,  H05K2201/083 ,  H05K2203/163

Abstract: A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.

Abstract translation: 对于每个单个基板，检测预定特定位置的变形状态，作为单个基板的位置，其中电极易于由于变形而位置偏离。 在用于拾取电子部件的组件安装操作和将电子部件安装在单个基板上的情况下，基于单个基板的检测结果确定电子部件在单片基板的特定位置的安装是否合适 每个单个基板的变形状态。 将所有电子部件安装在具有确定为不适合安装的特定部位的单片基板上的操作被取消。

公开(公告)号：US20140347870A1

公开(公告)日：2014-11-27

申请号：US14246902

申请日：2014-04-07

Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

Inventor： Yu-Chi CHO ,  Jung-Nan CHIEN ,  Shao-Wen CHIEN ,  Chieh-Hsiung LEE ,  Ching-Mei KUO

IPC: H05K1/02 ,  F21V21/14

CPC classification number: H05K1/189 ,  H05K1/147 ,  H05K3/0026 ,  H05K3/005 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2203/167

Abstract: A circuit board assembly includes a substrate, a flexible printed circuit board and an electrical component. The substrate includes a first electrically connecting port. The flexible printed circuit board includes a main body and a branch body. The main body includes two second electrically connecting ports opposite to each other. One of the two second electrically connecting ports is electrically connected to the first electrically connecting port. One end of the branch body is connected to the main body. Another end of the branch body is disposed with an additional electrically connecting port. The electrical component is disposed on and electrically connected to the additional electrically connecting port. The electrical component is electrically connected to the substrate via the flexible printed circuit board.

Abstract translation: 电路板组件包括基板，柔性印刷电路板和电气部件。 基板包括第一电连接端口。 柔性印刷电路板包括主体和分支体。 主体包括彼此相对的两个第二电连接端口。 两个第二电连接端口中的一个电连接到第一电连接端口。 分支体的一端连接到主体。 分支体的另一端设置有附加的电连接端口。 电气部件设置在附加的电连接端口上并与其电连接。 电气部件通过柔性印刷电路板电连接到基板。

公开(公告)号：US08897894B1

公开(公告)日：2014-11-25

申请号：US13556896

申请日：2012-07-24

Applicant: William G. Orinski

Inventor： William G. Orinski

IPC: A61N1/00

CPC classification number: A61N1/0541 ,  B23K26/035 ,  B23K26/0624 ,  B23K26/0846 ,  B23K26/22 ,  B23K26/38 ,  B23K37/0408 ,  B23K37/0443 ,  B23K2101/16 ,  B23K2101/38 ,  H05K1/118 ,  H05K3/027 ,  H05K2201/051 ,  H05K2201/053 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

Abstract: A microcircuit integrated cochlear electrode array and a process for the manufacture thereof, the electrode array comprising a multiconductor tail portion with longitudinally spaced outwardly exposed electrode receiving pads and a flat multiconductor head portion connected to the tail portion and having spaced outwardly exposed circuit attachment pads, the tail and head portions being laminated between a nonconductive film substrate and an insulating cover and the tail portion being helically wrapped into a helix with the electrode receiving circuit attachment pads exposed and carrying ring electrodes overmolded with a suitable polymeric material.

Abstract translation: 一种微电路集成耳蜗电极阵列及其制造方法，所述电极阵列包括具有纵向间隔开的向外暴露的电极接收垫的多导体尾部和连接到尾部并具有间隔开的向外暴露的电路连接垫的扁平多导体头部， 尾部和头部层压在非导电膜基底和绝缘盖之间，并且尾部被螺旋地缠绕成螺旋，电极接收电路附接垫暴露并携带用合适的聚合物材料包覆成型的环形电极。

公开(公告)号：US20140254109A1

公开(公告)日：2014-09-11

申请号：US13787438

申请日：2013-03-06

Applicant: ALLIANT TECHSYSTEMS INC.

Inventor： James D. Lucas ,  Christopher A. McKellips

IPC: H05K1/14

CPC classification number: H05K1/148 ,  F42C15/40 ,  F42C19/02 ,  F42C19/06 ,  H05K1/144 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/053 ,  H05K2201/2036

Abstract: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.

Abstract translation: 一种电子封装，包括多个相互平行的垂直间隔的电路板，其大致为圆形，并通过柔性电路电连接，该柔性电路包括围绕电路板周向延伸的导体，并具有延伸到每个电路板的分支。 还公开了电子封装前体结构和从前体结构配置电子封装的方法。

公开(公告)号：US08680402B2

公开(公告)日：2014-03-25

申请号：US13178081

申请日：2011-07-07

Applicant: Jong-Hun An ,  Hyun-Sik Min

Inventor： Jong-Hun An ,  Hyun-Sik Min

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H05K2201/053 ,  H05K2201/097

Abstract: A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.

Abstract translation: 一种用于电子设备的多层柔性印刷电路板（FPCB），其中多个部件交替地设置在基层的顶表面和底表面上，并且将部件从另一区域移除。 多层FPCB包括基层，设置在基层顶面的侧面区域的第一电路图案，设置在第一电路图案中的第一粘合剂层，设置在第一电路图案的底面上的第二电路图案 基底层和与侧面区域相反的另一侧区域，设置在第二电路图案中的第二粘合剂层，设置在第一粘合剂层的顶表面上的第一绝缘/保护层和第二绝缘/保护层 设置在第二粘合剂层的底表面上。

公开(公告)号：US20130319743A1

公开(公告)日：2013-12-05

申请号：US13875896

申请日：2013-05-02

Applicant: NITTO DENKO CORPORATION

Inventor： Jun ISHII ,  Saori KANAZAKI

IPC: H05K1/02 ,  H05K3/06

CPC classification number: H05K1/0296 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/189 ,  H05K3/06 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/053 ,  H05K2201/09072 ,  H05K2201/10083

Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Abstract translation: 布线电路板包括线，以及在布线电路板的厚度方向上在其一个表面上电连接到电线以电连接到电子元件的端子。 端子在其厚度方向的一个表面上包括在厚度方向上朝向其一侧突出的突出部分和覆盖突出部分在厚度方向上的一个端部的覆盖层。

公开(公告)号：US08481855B2

公开(公告)日：2013-07-09

申请号：US12959842

申请日：2010-12-03

Applicant: Koji Shinoda ,  Hiroshi Nakagawa

Inventor： Koji Shinoda ,  Hiroshi Nakagawa

IPC: H01R4/00

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2203/0195 ,  H05K2203/1572 ,  H05K2203/166 ,  H05K2203/167

Abstract: A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part (18) is formed in a peripheral edge (13a) between the protruding substrate portions (12) in the wiring substrate (10).

Abstract translation: 多个突出基板部分（12）沿着布线基板（10）的周缘彼此间隔设置的位置延伸。 每个突出基板部分（12）设置有电连接到设置在电气仪器基板上的多个电极端子中的布线端子（15），（16）。 在配线基板（10）的突出基板部（12）之间的周缘部（13a）上形成切口部（18）。

公开(公告)号：US20120323098A1

公开(公告)日：2012-12-20

申请号：US13526136

申请日：2012-06-18

Applicant: Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: A61B5/1468 ,  H05K3/32

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

Abstract translation: 提供将分析物传感器（例如分析物传感器的导电构件）连接到诸如传感器电子单元（例如传感器控制单元）的其它设备的分析物传感器连接器。 还提供了包括分析物传感器，分析物传感器连接器和分析物传感器电子单元的系统，以及建立和维持分析物传感器和分析物传感器电子单元之间的连接的方法以及分析物监测/检测的方法。 还提供了使分析物传感器连接器和包括分析物传感器连接器的系统的方法。