公开(公告)号：US20180242454A1

公开(公告)日：2018-08-23

申请号：US15900031

申请日：2018-02-20

Applicant: LG CHEM, LTD.

Inventor： Jin Oh Yang ,  Suk Jin Song ,  Young Su Son ,  Jae Young Jang

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K1/0204 ,  H05K1/111 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10901

Abstract: The present disclosure relates to a printed circuit board connected to a battery, and more particularly, to a printed circuit board having an improved structure connected to an electrode led out from a battery.

公开(公告)号：US20170149155A1

公开(公告)日：2017-05-25

申请号：US14952242

申请日：2015-11-25

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H01R12/58

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20150282295A1

公开(公告)日：2015-10-01

申请号：US14626936

申请日：2015-02-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKASHI MATSUMOTO ,  TETSUYOSHI OGURA ,  DAISUKE WAKUDA

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/14 ,  H05K3/00

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/14 ,  H05K3/16 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10901 ,  Y10T29/49162

Abstract: An elastic flexible substrate including an insulating film base material provided with a wire is provided. In the insulating film base material, a plurality of slits are provided with a predetermined space left therebetween, the insulating film base material has a bellows shape in which the insulating film base material is bent or curved by using the slits as base points, and the slits are deformed when the insulating film base material is stretched.

Abstract translation: 提供一种包括设置有导线的绝缘膜基材的弹性柔性基板。 在绝缘膜基材中，多个狭缝在其间留有预定的空间，绝缘膜基材具有波纹管形状，其中绝缘膜基材通过使用狭缝作为基点而弯曲或弯曲，并且 当绝缘膜基材被拉伸时，狭缝变形。

公开(公告)号：US20240090114A1

公开(公告)日：2024-03-14

申请号：US18273173

申请日：2022-01-04

Applicant: LS ELECTRIC CO., LTD.

Inventor： Jae Moon LEE

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0201 ,  H05K1/18 ,  H05K7/20909 ,  H05K7/20927 ,  H05K2201/10901 ,  H05K2201/2045

Abstract: The present disclosure relates to an inverter module comprising: a power module coupled to a PCB; a thermal pad positioned between the PCB and the power module to prevent foreign substances from being attached to the PCB and the power module and to conduct heat; and a cooling device including a heat sink attached to the power module to cool the power module.

公开(公告)号：US20230284387A1

公开(公告)日：2023-09-07

申请号：US17688473

申请日：2022-03-07

Applicant: Rolls-Royce Corporation

Inventor： Shuai Wang ,  Chandana J. Gajanayake ,  David R. Trawick

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/18 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10901

Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first portion arranged around the electrical connection pin and a second portion located radially outward of the first portion.

公开(公告)号：US09924595B2

公开(公告)日：2018-03-20

申请号：US14567402

申请日：2014-12-11

Applicant: Intel Corporation

Inventor： Beom-Taek Lee ,  Raul Enriquez Shibayama

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/11 ,  H05K1/14 ,  H01R12/58 ,  H01R12/71 ,  H01R31/06

CPC classification number: H05K1/115 ,  H01R12/585 ,  H01R12/718 ,  H01R31/06 ,  H05K1/147 ,  H05K1/184 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/10901

Abstract: In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

公开(公告)号：US09761972B2

公开(公告)日：2017-09-12

申请号：US15200695

申请日：2016-07-01

Applicant: MERCURY SYSTEMS, INC.

Inventor： Philip Beucler ,  Daniel Coolidge ,  Darryl J. McKenney ,  Kevin Jorczak

IPC: H01R9/05 ,  H01R12/71 ,  H01R12/58 ,  H01R13/652 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

公开(公告)号：US09699893B2

公开(公告)日：2017-07-04

申请号：US14626936

申请日：2015-02-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Matsumoto ,  Tetsuyoshi Ogura ,  Daisuke Wakuda

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/14 ,  H05K1/11 ,  H05K1/18 ,  H05K3/16

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/14 ,  H05K3/16 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10901 ,  Y10T29/49162

Abstract: An elastic flexible substrate including an insulating film base material provided with a wire is provided. In the insulating film base material, a plurality of slits are provided with a predetermined space left therebetween, the insulating film base material has a bellows shape in which the insulating film base material is bent or curved by using the slits as base points, and the slits are deformed when the insulating film base material is stretched.

公开(公告)号：US20150264810A1

公开(公告)日：2015-09-17

申请号：US14636356

申请日：2015-03-03

Applicant: FUJITSU LIMITED

Inventor： Shunji BABA ,  Manabu WATANABE ,  Kenji FUKUZONO ,  Satoshi OHSAWA ,  Tetsuro YAMADA ,  Akihiro WAKABAYASHI ,  Yasushi MASUDA ,  Yohei MIURA

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/10 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/167 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0263 ,  H05K1/11 ,  H05K1/144 ,  H05K1/184 ,  H05K1/185 ,  H05K3/22 ,  H05K3/325 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.

Abstract translation: 电路板包括：基板; 形成在基板中的通孔; 以及设置在通孔中的连接端子; 其中，所述连接端子包括设置在所述通孔内的基座部分和设置在所述基座部分的中心并且从所述基座部朝向所述基板的第一表面延伸的销，使得所述第一端部从所述第一端部突出， 表面。

公开(公告)号：US07677905B2

公开(公告)日：2010-03-16

申请号：US11979968

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。