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    LEED for SEM
    24.
    发明授权
    LEED for SEM 有权

    公开(公告)号：US09576770B2

    公开(公告)日：2017-02-21

    申请号：US14888414

    申请日：2014-05-14

    Applicant: Okinawa Institute of Science and Technology School Corporation

    Inventor： Tsumoru Shintake

    IPC: G21K5/04 ,  H01J37/244 ,  H01J37/295

    CPC classification number: H01J37/244 ,  G01N23/20 ,  H01J37/2955 ,  H01J2237/2449 ,  H01J2237/24578 ,  H01J2237/2544 ,  H01J2237/2803

    Abstract: A low energy electron diffraction (LEED) detection module (100) includes: a first vacuum chamber for receiving diffracted electrons from a specimen (109); a larger second vacuum chamber connected to the first vacuum chamber to receive the diffracted electrons that have been transported through the first vacuum chamber; a two-dimensional electron detector disposed in the second vacuum chamber to detect the diffracted electrons; a potential shield (106) disposed generally along an inner surface of the first vacuum chamber and an inner surface of the second vacuum chamber; a magnetic lens (105) to expand a beam of the diffracted electrons that have been transported through the first vacuum chamber towards the two-dimensional electron detector; and a generally plane-shaped energy filter (103) to repel electrons having an energy lower than the probe beam (203) of electrons that impinges on the specimen (109).

    Abstract translation: 低能电子衍射（LEED）检测模块（100）包括：用于从样品（109）接收衍射电子的第一真空室; 连接到第一真空室的较大的第二真空室，以接收已经传送通过第一真空室的衍射电子; 设置在第二真空室中以检测衍射电子的二维电子检测器; 大致沿第一真空室的内表面设置的电位屏蔽件（106）和第二真空室的内表面; 用于将已经通过第一真空室传送的衍射电子束朝向二维电子检测器扩大的磁性透镜（105）; 和大致平面状的能量过滤器（103），以排斥能量低于碰撞在样本（109）上的电子的探针光束（203）的能量的电子。

    CIRCUIT TRACING USING A FOCUSED ION BEAM
    25.
    发明申请
    CIRCUIT TRACING USING A FOCUSED ION BEAM 有权
    使用聚焦离子束进行电路跟踪

    公开(公告)号：US20160187419A1

    公开(公告)日：2016-06-30

    申请号：US14811549

    申请日：2015-07-28

    Applicant: TECHINSIGHTS INC.

    Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN ,  Alexander KRECHMER

    IPC: G01R31/303 ,  G01R31/28

    CPC classification number: G01R31/303 ,  G01N23/2255 ,  G01R31/2896 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/2803 ,  H01J2237/2809 ,  H01J2237/31749 ,  H01L22/12

    Abstract: Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.

    Abstract translation: 描述了使用基于聚焦离子束的成像技术在集成电路上跟踪电路的方法和系统的各种实施例。 在一个这样的实施例中，提供了一种用于识别与集成电路上的可切换电力接口相关联的功能组件的方法，其中所述可切换电力接口包括其间具有控制开关的源极和漏极，所述控制开关由控制信号 在集成电路运行期间。 该方法包括用沉积的导电材料连接源极和漏极; 通过源极和漏极中的一个将外部电压施加到可切换电力接口的功率输入; 将集成电路暴露于聚焦离子束; 以及在曝光期间收集集成电路的图像，以确定与可切换电源接口可操作连接的功能组件的高对比度区域。

    System and method for simultaneous detection of secondary electrons and light in a charged particle beam system
    26.
    发明授权
    System and method for simultaneous detection of secondary electrons and light in a charged particle beam system 有权
    在带电粒子束系统中同时检测二次电子和光的系统和方法

    公开(公告)号：US09040909B2

    公开(公告)日：2015-05-26

    申请号：US13681746

    申请日：2012-11-20

    Applicant: FEI Company

    Inventor： N. William Parker ,  Mark W. Utlaut

    IPC: G01N23/00 ,  G01N23/225 ,  G01N21/64 ,  H01J37/22 ,  H01J37/28

    CPC classification number: G01N21/6428 ,  G01N21/6458 ,  G01N21/6486 ,  G01N23/225 ,  H01J37/228 ,  H01J37/28 ,  H01J37/285 ,  H01J2237/206 ,  H01J2237/2443 ,  H01J2237/24455 ,  H01J2237/2448 ,  H01J2237/2803 ,  H01J2237/2857

    Abstract: A method and system for the imaging and localization of fluorescent markers such as fluorescent proteins or quantum dots within biological samples is disclosed. The use of recombinant genetics technology to insert “reporter” genes into many species is well established. In particular, green fluorescent proteins (GFPs) and their genetically-modified variants ranging from blue to yellow, are easily spliced into many genomes at the sites of genes of interest (GoIs), where the GFPs are expressed with no apparent effect on the functioning of the proteins of interest (PoIs) coded for by the GoIs. One goal of biologists is more precise localization of PoIs within cells. The invention is a method and system for enabling more rapid and precise PoI localization using charged particle beam-induced damage to GFPs. Multiple embodiments of systems for implementing the method are presented, along with an image processing method relatively immune to high statistical noise levels.

    Abstract translation: 公开了用于生物样品中荧光标记如荧光蛋白或量子点的成像和定位的方法和系统。 使用重组遗传学技术将“记者”基因插入许多物种已经很成熟。 特别地，绿色荧光蛋白（GFP）及其从蓝色到黄色的遗传修饰的变体易于在感兴趣的基因（GoI）的位点处接合到许多基因组中，其中GFP表达对功能没有明显的影响 的由GoI编码的感兴趣的蛋白质（PoI）。 生物学家的一个目标是更精确地定位细胞内的PoI。 本发明是一种方法和系统，用于使得能够使用带电粒子束对GFP的损伤进行更快速和精确的PoI定位。 提出了用于实现该方法的系统的多个实施例，以及相对不受高统计噪声水平影响的图像处理方法。

    AUTOMATED SLICE MILLING FOR VIEWING A FEATURE
    27.
    发明申请
    AUTOMATED SLICE MILLING FOR VIEWING A FEATURE 审中-公开
    自动铣床查看功能

    公开(公告)号：US20150021475A1

    公开(公告)日：2015-01-22

    申请号：US14311614

    申请日：2014-06-23

    Applicant: FEI Company

    Inventor： Ryan Tanner

    IPC: H01J37/30 ,  H01J37/305 ,  H01J37/304 ,  H01J37/28

    CPC classification number: H01J37/3005 ,  G01N1/286 ,  H01J37/26 ,  H01J37/265 ,  H01J37/28 ,  H01J37/30 ,  H01J37/3045 ,  H01J37/3056 ,  H01J2237/2611 ,  H01J2237/28 ,  H01J2237/2803 ,  H01J2237/2814 ,  H01J2237/30472 ,  H01J2237/3174 ,  H01J2237/31745 ,  H01J2237/31749

    Abstract: A method and apparatus for performing a slice and view technique with a dual beam system. The feature of interest in an image of a sample is located by machine vision, and the area to be milled and imaged in a subsequent slice and view iteration is determined through analysis of data gathered by the machine vision at least in part. A determined milling area may be represented as a bounding box around a feature, which dimensions can be changed in accordance with the analysis step. The FIB is then adjusted accordingly to slice and mill a new face in the subsequent slice and view iteration, and the SEM images the new face. Because the present invention accurately locates the feature and determines an appropriate size of area to mill and image, efficiency is increased by preventing the unnecessary milling of substrate that does not contain the feature of interest.

    Abstract translation: 一种使用双光束系统执行切片和观看技术的方法和装置。 通过机器视觉来定位样本图像中的兴趣特征，并且通过至少部分地通过机器视觉收集的数据的分析来确定要在后续切片和观看迭代中被研磨和成像的区域。 确定的铣削区域可以表示为围绕特征的边界框，该尺寸可以根据分析步骤而改变。 然后，相应地调整FIB以在随后的切片中切割并研磨新的面并查看迭代，并且SEM对新的面进行成像。 因为本发明精确地定位了特征并且确定了适当的面积大小以进行研磨和图像，所以通过防止不需要研磨不包含感兴趣特征的基底来提高效率。

    ION BEAM DEVICE
    28.
    发明申请
    ION BEAM DEVICE 审中-公开
    离子束装置

    公开(公告)号：US20140319370A1

    公开(公告)日：2014-10-30

    申请号：US14328754

    申请日：2014-07-11

    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

    Inventor： Hiroyasu SHICHI ,  Shinichi MATSUBARA ,  Norihide SAHO ,  Masahiro YAMAOKA ,  Noriaki ARAI

    IPC: H01J27/02 ,  H01J37/26

    CPC classification number: H01J27/26 ,  H01J27/022 ,  H01J37/023 ,  H01J37/067 ,  H01J37/08 ,  H01J37/26 ,  H01J37/28 ,  H01J2237/002 ,  H01J2237/006 ,  H01J2237/061 ,  H01J2237/0807 ,  H01J2237/2803

    Abstract: An ion beam device according to the present invention includes a gas field ion source (1) including an emitter tip (21) supported by an emitter base mount (64), a ionization chamber (15) including an extraction electrode (24) and being configured to surround the emitter tip (21), and a gas supply tube (25). A center axis line of the extraction electrode (24) overlaps or is parallel to a center axis line (14A) of the ion irradiation light system, and a center axis line (66) passing the emitter tip (21) and the emitter base mount (64) is inclinable with respect to a center axis line of the ionization chamber (15). Accordingly, an ion beam device including a gas field ion source capable of adjusting the direction of the emitter tip is provided.

    Abstract translation: 根据本发明的离子束装置包括气体离子源（1），其包括由发射极基座（64）支撑的发射极尖端（21），包括引出电极（24）的电离室（15） 构造成围绕发射器尖端（21），以及气体供应管（25）。 引出电极（24）的中心轴线与离​​子照射光系统的中心轴线（14A）重叠或平行，通过发射极尖端（21）和发射极基座 （64）相对于所述电离室（15）的中心轴线是可倾斜的。 因此，提供了包括能够调节发射极尖端的方向的气体场离子源的离子束装置。

    CIRCUIT TRACING USING A FOCUSED ION BEAM
    29.
    发明申请
    CIRCUIT TRACING USING A FOCUSED ION BEAM 有权
    使用聚焦离子束进行电路跟踪

    公开(公告)号：US20140319343A1

    公开(公告)日：2014-10-30

    申请号：US14309674

    申请日：2014-06-19

    Applicant: Chris Pawlowicz ,  Alexander Sorkin ,  Michael W. Phaneuf ,  Alexander Krechmer ,  Ken G. Lagarec

    Inventor： Chris Pawlowicz ,  Alexander Sorkin ,  Michael W. Phaneuf ,  Alexander Krechmer ,  Ken G. Lagarec

    IPC: G01N23/225 ,  H01J37/22

    CPC classification number: G01N23/2255 ,  G01R31/303 ,  H01J37/222 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/2803 ,  H01J2237/2809 ,  H01J2237/31749 ,  H01L22/12

    Abstract: Methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. A first component or node on an integrated circuit is coupled to a second component or node on the same integrated circuit. After an external bias is applied to the first component or node, a focused ion beam is applied to the integrated circuit and an image is taken using an electron detector. The features or components on the integrated circuit which are coupled to the second component or node will show up in high contrast on the resulting image. The method may also involve applying a bias to a node or component and then using focused ion beam imaging techniques (through an electron detector) to arrive at an image of the integrated circuit. Components coupled to the node will appear in high contrast in the resulting image.

    Abstract translation: 使用聚焦离子束成像技术在集成电路上跟踪电路的方法和系统。 集成电路上的第一组件或节点耦合到同一集成电路上的第二组件或节点。 在将外部偏压施加到第一部件或节点之后，将聚焦离子束施加到集成电路，并且使用电子检测器拍摄图像。 耦合到第二组件或节点的集成电路上的特征或组件将在所得到的图像上呈现高对比度。 该方法还可以包括向节点或部件施加偏压，然后使用聚焦离子束成像技术（通过电子检测器）来获得集成电路的图像。 耦合到节点的组件将在所得到的图像中以高对比度出现。

    FOCUSED ION BEAM SYSTEM
    30.
    发明申请
    FOCUSED ION BEAM SYSTEM 有权
    聚焦离子束系统

    公开(公告)号：US20140284474A1

    公开(公告)日：2014-09-25

    申请号：US14221514

    申请日：2014-03-21

    Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION

    Inventor： Yasuhiko SUGIYAMA ,  Tomokazu KOZAKAI ,  Osamu MATSUDA

    IPC: H01J37/26 ,  H01J27/20

    CPC classification number: H01J37/28 ,  H01J37/08 ,  H01J37/222 ,  H01J2237/0807 ,  H01J2237/221 ,  H01J2237/2803 ,  H01J2237/31749

    Abstract: A focused ion beam system includes a gas field ion source which generates gas ions, an ion gun unit which accelerates the gas ions and radiates the gas ions as an ion beam, a beam optical system which includes at least a focusing lens electrode and radiates the ion beam onto a sample, and an image acquiring mechanism which acquires an FIM image of a tip of an emitter based on the ion beam. The image acquiring mechanism includes an alignment electrode which is disposed between the ion gun unit and the focusing lens electrode and adjusts a radiation direction of the ion beam, an alignment control unit which applies an alignment voltage to the alignment electrode, and an image processing unit which combines a plurality of FIM images acquired when applying different alignment voltages to generate one composite FIM image.

    Abstract translation: 聚焦离子束系统包括产生气体离子的气体离子源，加速气体离子并将气体离子作为离子束辐射的离子枪单元，包括至少聚焦透镜电极的射束光学系统， 离子束到样品，以及图像获取机构，其基于离子束获取发射器的尖端的FIM图像。 图像获取机构包括配置在离子枪单元和聚焦透镜电极之间并调整离子束的辐射方向的取向电极，向对准电极施加取向电压的取向控制单元和图像处理单元 其组合当应用不同对准电压时获得的多个FIM图像以生成一个复合FIM图像。

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