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公开(公告)号：US11696405B2
公开(公告)日：2023-07-04
申请号：US17231507
申请日：2021-04-15
Applicant: Samsung Display Co., LTD.
Inventor： Tae Hyun Ryu , Tae Beom Kim , Yoon Seop Shim
CPC classification number: H05K1/144 , G06F3/04164 , H05K1/0269 , H05K1/118 , H05K1/189 , H05K2201/058 , H05K2201/09063 , H05K2201/09936 , H10K59/131
Abstract: A display device may include a main flexible printed circuit including a first alignment mark and electrically connected to a first panel; and a touch flexible printed circuit including a second alignment mark and electrically connected to a second panel that is perpendicular to the first panel, wherein the main flexible printed circuit is electrically connected to the touch flexible printed circuit through a pad region, and the touch flexible printed circuit includes a first overcoat region disposed between the first alignment mark and the second alignment mark.
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公开(公告)号：US20230171881A1
公开(公告)日：2023-06-01
申请号：US18096844
申请日：2023-01-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Bumhee BAE , Younghun SEONG , Jaehoon LEE , Jeongnam CHEON
CPC classification number: H05K1/028 , H05K1/0272 , H05K1/181 , H05K2201/09063 , H05K2201/093 , H05K2201/10128 , H05K2201/10098 , G06F1/1652
Abstract: A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.
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公开(公告)号：US20190229449A1
公开(公告)日：2019-07-25
申请号：US16371708
申请日：2019-04-01
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC: H01R12/59 , H01R12/69 , H01B7/08 , H05K1/02 , B60J5/04 , H01B7/04 , B60R16/02 , H01B7/00 , H01R43/20
CPC classification number: H01R12/592 , B60J5/0413 , B60R16/0215 , B60Y2410/115 , H01B7/0045 , H01B7/04 , H01B7/08 , H01B7/421 , H01B13/01254 , H01R12/69 , H01R43/205 , H01R2201/26 , H05K1/0201 , H05K1/028 , H05K1/118 , H05K3/0052 , H05K3/28 , H05K3/366 , H05K3/368 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209 , H05K2201/041 , H05K2201/052 , H05K2201/09063 , H05K2201/10189 , H05K2203/0228
Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.
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公开(公告)号：US20190174629A1
公开(公告)日：2019-06-06
申请号：US16092795
申请日：2017-04-26
Inventor： NOBUHIKO NAKAMURA
CPC classification number: H05K1/184 , H05K1/182 , H05K1/183 , H05K3/306 , H05K3/3447 , H05K3/3468 , H05K2201/09063 , H05K2201/09072 , H05K2201/2018 , H05K2203/0169 , H05K2203/044
Abstract: The present disclosure provides a manufacturing method. According to this manufacturing method, either a first claw or a second claw is inserted through a notch formed by notching an edge of the hole. The first claw and the second claw are so provided as to project outward from a wall portion of a cover member that covers the body portion of the component from a soldering surface side. The cover member is held on the wiring board, by sliding the cover member relative to the wiring board in a direction along a component mounting surface of the wiring board to position the edge of the hole between the first claw and the second claw provided on a surface of the wall portion identical to a surface on which the first claw is provided. The body portion is inserted into the hole, and an electrode terminal of the body portion is disposed on the wiring board. Solder is applied by flow soldering to the wiring board on which the cover member is held. The cover member is detached from the wiring board, by sliding the cover member relative to the wiring board to which solder has been applied to shift the first claw from the component mounting surface side to the soldering surface side with the first claw passing through the notch.
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公开(公告)号：US20190103692A1
公开(公告)日：2019-04-04
申请号：US15945775
申请日：2018-04-05
Applicant: TE CONNECTIVITY CORPORATION
Inventor： John Joseph Consoli , Chad William Morgan , Matthew Jeffrey Sypolt
IPC: H01R12/73 , H01R13/6582 , H01R13/6585 , H01R13/6477 , H05K1/14 , H01R13/631 , H01R13/40 , H01R13/502 , H01R13/56 , H05K7/14
CPC classification number: H01R12/737 , H01R12/91 , H01R13/40 , H01R13/502 , H01R13/562 , H01R13/631 , H01R13/6471 , H01R13/6477 , H01R13/6582 , H01R13/6585 , H01R13/6587 , H05K1/14 , H05K7/1417 , H05K2201/048 , H05K2201/09063 , H05K2201/10325
Abstract: An electrical connector for a circuit card assembly including a PCB includes a mating housing having a mating end movable relative to the PCB and contact modules coupled to the mating housing including signal contacts having a mating conductor, a mounting conductor and a flexible conductor. The flexible conductor is flexible to allow relative movement of the mating conductor relative to the mounting conductor. The flexible conductor has a bent portion changing shape. The contact modules have ground contacts providing electrical shielding for the signal contacts. The ground contacts include covers extending along and providing shielding along at least one side of the bent portion of the corresponding signal contact.
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Patent Agency Ranking
公开(公告)号：US20190098754A1
公开(公告)日：2019-03-28
申请号：US16189342
申请日：2018-11-13
Applicant: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
Inventor： NING HOU , SI-HONG HE , BIAO LI , MEI-HUA HUANG
CPC classification number: H05K1/09 , H05K1/115 , H05K3/06 , H05K3/241 , H05K3/244 , H05K3/4038 , H05K2201/0338 , H05K2201/09063 , H05K2201/099 , Y10T29/49165
Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.
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公开(公告)号：US20190081389A1
公开(公告)日：2019-03-14
申请号：US16123021
申请日：2018-09-06
Applicant: ASUSTeK COMPUTER INC.
Inventor： Chien-Hung TSAI , Kuo-Chu LIAO , Wei-Cheng LO , Te-Li LIEN , Hsuan-Chi TSAI , Ming-Shan WU , Yung-Chieh YU
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q7/00 , H04B5/0081 , H05K1/028 , H05K1/165 , H05K2201/05 , H05K2201/09063 , H05K2201/09072 , H05K2201/10098
Abstract: An antenna module is provided. The antenna module includes a circuit board, a conductive layer, and a spiral coil. The circuit board has a first surface and a second surface opposite to each other. The circuit board further includes a first block and a second block connected to each other. The conductive layer is disposed on the first block. The spiral coil is disposed in the second block of the circuit board. The conductive layer at least partially surrounds the spiral coil.
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公开(公告)号：US20180368262A1
公开(公告)日：2018-12-20
申请号：US15562992
申请日：2015-08-21
Applicant: Renesas Electronics Corporation
Inventor： Norikazu MOTOHASHI , Tomohiro NISHIYAMA , Tadashi SHIMIZU , Shinji NISHIZONO
IPC: H05K1/18 , H05K1/11 , H05K1/14 , H02M7/00 , H02P27/06 , H01L23/31 , H01L23/495 , H02K11/33 , F02M37/08
CPC classification number: H05K1/181 , F02M37/08 , F02M2037/085 , H01L23/3107 , H01L23/49513 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H02K11/33 , H02K2211/03 , H02M7/003 , H02M7/48 , H02P27/06 , H05K1/115 , H05K1/14 , H05K2201/042 , H05K2201/09027 , H05K2201/09063 , H05K2201/10166
Abstract: A plurality of semiconductor devices each including a semiconductor chip having a high-side MOSFET and a semiconductor chip having a low-side MOSFET are mounted on a wiring board (PB1). The wiring board (PB1) includes a power supply wiring WV1 to which a power supply potential is supplied and output wirings WD1, WD2, and WD3 electrically connecting a low-side drain terminal of each of the plurality of semiconductor devices to a plurality of output terminals. A minimum value and a maximum value of a current path width in the power supply wiring WV1 are referred to as a first minimum width and a first maximum width, respectively, and a minimum value and a maximum value of a current path width in the output wirings WD1, WD2, and WD3 are referred to as a second minimum width and a second maximum width, respectively. When the first minimum width is smaller than the second minimum width, the first minimum width is larger than half of the second maximum width, and when the second minimum width is smaller than the first minimum width, the second minimum width is larger than half of the first maximum width.
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公开(公告)号：US20180324942A1
公开(公告)日：2018-11-08
申请号：US15773205
申请日：2016-10-19
Applicant: OSRAM GmbH
Inventor： Peter Hummel , Stefan Mannhardt
IPC: H05K1/02
CPC classification number: H05K1/0256 , F21V23/02 , F21Y2115/10 , H05K1/0259 , H05K1/0262 , H05K2201/09063 , H05K2201/09227
Abstract: A method for reducing conductor track spacings in a printed circuit board, wherein the printed circuit board has an input part, wherein the input part is fed by a supply voltage, and has an output part, comprising the following steps: inserting an intermediate conductor track which has an intermediate potential derived from the input part, maintaining a functional insulation gap between the intermediate conductor track and adjacent conductor tracks of the input part, maintaining a safety-relevant insulation gap between the intermediate conductor track and the adjacent conductor tracks of the output part. The intermediate potential has, with respect to adjacent conductor tracks of the output part, a voltage which corresponds at most to the supply voltage of the input part.
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公开(公告)号：US20180279514A1
公开(公告)日：2018-09-27
申请号：US15920989
申请日：2018-03-14
Applicant: Japan Display Inc.
Inventor： Masanori MAEMUKO
CPC classification number: H05K9/0026 , G02B6/0088 , G02F1/133308 , G02F2001/133314 , G02F2001/133334 , H01L51/5237 , H01R4/34 , H05K1/0215 , H05K1/117 , H05K1/147 , H05K9/0054 , H05K9/0058 , H05K2201/09063 , H05K2201/0999 , H05K2201/10128 , H05K2201/10136 , H05K2201/10371 , H05K2201/10409
Abstract: According to an aspect, a display device includes: a display panel; a housing; a printed circuit board; a boss that penetrates a first through hole in the printed circuit board and protrudes from a surface of the housing, the surface being attached to the printed circuit board; a shield cover; and a male screw. The shield cover includes: a top plate; side plates; and a contact piece formed by folding a part of one of the side plates inward and including a protrusion in contact with a ground pattern of the printed circuit board and a claw facing the top plate. The protrusion causes the claw to protrude toward the printed circuit board. The male screw is fastened to the boss from the outside of the top plate.
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