公开(公告)号：US07973247B2

公开(公告)日：2011-07-05

申请号：US12161668

申请日：2006-02-03

Applicant: Hidetsugu Mukae ,  Hiroyuki Suzuki

Inventor： Hidetsugu Mukae ,  Hiroyuki Suzuki

IPC: H05K1/11

CPC classification number: H05K3/361 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0278

Abstract: In a circuit board-connecting portion 10, a first connecting portion 15 and a second connecting portion 20 are disposed in facing relation such that first conductors 14 contact second conductors 19, and also a first substrate 12 and a second substrate 17 are fixed to each other by an adhesive 22. The first connecting portion 15 has rigid members 24 provided at a reverse surface 12B of the first substrate 12 which is a soft substrate, and the rigid members 24 are disposed along a direction of a thickness of the first substrate 14, and are provided at positions corresponding to at least parts 14A of the first conductors 14.

Abstract translation: 在电路板连接部分10中，以第一导体14接触第二导体19的方式设置第一连接部分15和第二连接部分20，并且将第一基板12和第二基板17固定到每个 第一连接部分15具有设置在作为软质基板的第一基板12的反面12B处的刚性构件24，并且刚性构件24沿着第一基板14的厚度方向 设置在与第一导体14的至少一部分14A对应的位置。

公开(公告)号：US20110075382A1

公开(公告)日：2011-03-31

申请号：US12567631

申请日：2009-09-25

Applicant: Bob Lee MACKEY ,  Khamvong Thammasouk

Inventor： Bob Lee MACKEY ,  Khamvong Thammasouk

IPC: H05K1/00 ,  H05K3/30

CPC classification number: G06F3/044 ,  H05K1/028 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/2009 ,  Y10T29/4913

Abstract: A flexible circuit assembly. The flexible circuit assembly includes a flexible circuit, a substrate of a capacitive-sensing device and an electronic component that are coupled to the flexible circuit. The flexible circuit includes a first portion having a first conductive contact pad, a second portion having a second conductive contact pad, and a third portion disposed between the first portion and the second portion. The flexible circuit is configured to fold at the third portion between the first portion and the second portion so that the first conductive contact pad couples to a first conductor disposed along a first edge of the substrate and the second conductive contact pad couples to a second conductor disposed along a second edge of the substrate of the capacitive-sensing device. The first edge of the substrate of the capacitive-sensing device is non-parallel to the second edge of the substrate of the capacitive-sensing device.

Abstract translation: 柔性电路组件。 柔性电路组件包括柔性电路，电容感测装置的基板和耦合到柔性电路的电子部件。 柔性电路包括具有第一导电接触焊盘的第一部分，具有第二导电接触焊盘的第二部分和设置在第一部分和第二部分之间的第三部分。 柔性电路被配置为在第一部分和第二部分之间的第三部分处折叠，使得第一导电接触焊盘耦合到沿着衬底的第一边缘设置的第一导体，并且第二导电接触焊盘耦合到第二导体 沿着电容感测装置的基板的第二边缘设置。 电容感测装置的基板的第一边缘不平行于电容感测装置的基板的第二边缘。

公开(公告)号：US07884470B2

公开(公告)日：2011-02-08

申请号：US12317434

申请日：2008-12-23

Applicant: Kee Leong Cheah ,  Eu Soon Lee

Inventor： Kee Leong Cheah ,  Eu Soon Lee

IPC: H01L23/34

CPC classification number: H01L23/49833 ,  H01L23/16 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/023 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10962 ,  H05K2201/2009 ,  H05K2201/2018 ,  H01L2924/00

Abstract: Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the electrical conductor may be electrically coupled to the power and ground terminals of the semiconductor package.

Abstract translation: 本发明的实施例涉及半导体封装，其中将电力输送到可拆卸地安装在形成在封装加强件和电导体之间的插座中的裸片侧部件。 为此，封装加强件和电导体可以电耦合到半导体封装的电源和接地端子。

公开(公告)号：US20110014803A1

公开(公告)日：2011-01-20

申请号：US12922669

申请日：2009-03-26

Applicant: John Michael Bailey

Inventor： John Michael Bailey

IPC: H01R43/20

CPC classification number: H01R12/616 ,  H01R12/67 ,  H01R2201/26 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0064 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/2009 ,  Y10T29/49208

Abstract: A connector and electrical tracks assembly comprises a connector with a plurality of electrical contacts; said connector being connectable to a further connector at a first extremity; said connector being connectable at a second extremity to a circuit board portion with a plurality of electrical tracks; wherein a circuit board portion is located between a first layer of plastic thermosetting composite material of fibre and filler and a second layer of plastic thermosetting composite material of fibre and filler.

Abstract translation: 连接器和电气轨道组件包括具有多个电触头的连接器; 所述连接器可在第一末端连接到另一连接器; 所述连接器可在第二末端连接到具有多个电迹线的电路板部分; 其中电路板部分位于第一层纤维和填料的塑料热固性复合材料层和第二层纤维和填料的塑料热固性复合材料之间。

公开(公告)号：US20110002685A1

公开(公告)日：2011-01-06

申请号：US12559106

申请日：2009-09-14

Applicant: Yu-Jung Hsiao

Inventor： Yu-Jung Hsiao

IPC: G03B17/02 ,  H05K3/30

CPC classification number: H05K1/182 ,  G03B17/02 ,  H04N5/2257 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10121 ,  H05K2201/2009 ,  Y10T29/4913

Abstract: A camera module and an assembling method thereof are provided. The camera module includes a circuit board, a base plate, an image chip, a holder and a lens assembly. The circuit board includes a first surface, a second surface and a hollow portion running through the first surface and the second surface. The base plate is fixed on the second surface of the circuit board such that the hollow portion of the circuit board is sheltered by the base plate. The image chip is disposed on the base plate and accommodated within the hollow portion. The holder is fixed on the first surface of the circuit board. The lens assembly is fixed on the holder.

Abstract translation: 提供了相机模块及其组装方法。 相机模块包括电路板，底板，图像芯片，保持器和透镜组件。 电路板包括第一表面，第二表面和穿过第一表面和第二表面的中空部分。 基板固定在电路板的第二表面上，使得电路板的中空部分被基板遮蔽。 图像芯片设置在基板上并容纳在中空部分内。 保持器固定在电路板的第一表面上。 镜头组件固定在支架上。

公开(公告)号：US07851258B2

公开(公告)日：2010-12-14

申请号：US11983868

申请日：2007-11-13

Applicant: Hiroshi Kobayashi

Inventor： Hiroshi Kobayashi

IPC: H01L21/00

CPC classification number: H05K1/0271 ,  G06K19/0723 ,  H01L21/563 ,  H01L23/4985 ,  H01L23/49855 ,  H01L24/12 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/189 ,  H05K3/305 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing an RFID tag that includes forming an antenna pattern and a reinforcing layer on one surface of a film made of a resin material, applying a thermosetting adhesive onto the reinforcing layer and the antenna pattern, mounting a circuit chip on the antenna pattern via the thermosetting adhesive, pinching the circuit chip and the other surface of the film, and fixing the circuit chip to the antenna pattern by hardening the thermosetting adhesive. The reinforcing layer is formed within a region where the circuit chip is mounted and the circuit chip includes a first protrusion contacting the antenna pattern and a second protrusion contacting the reinforcing layer.

Abstract translation: 一种制造RFID标签的方法，包括在由树脂材料制成的膜的一个表面上形成天线图案和增强层，将热固性粘合剂施加到加强层和天线图案上，将电路芯片安装在天线图案上 通过热固性粘合剂夹住电路芯片和膜的另一个表面，并通过硬化热固性粘合剂将电路芯片固定到天线图案。 加强层形成在安装电路芯片的区域内，电路芯片包括与天线图案接触的第一突起和与增强层接触的第二突起。

公开(公告)号：US07833910B2

公开(公告)日：2010-11-16

申请号：US12230511

申请日：2008-08-29

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: H01L21/311

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/243 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0574 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract translation: 在薄膜基材（1）和形成在薄膜基材（1）上的导体布线（23）的薄膜基板（FB）中，导体布线（23）布置成使外部的导体布线厚度 连接另一面板或基板的薄膜基板上的连接部分比其他位置的导体布线部分（弯曲部分）（25）的导体布线厚度厚。

公开(公告)号：US20100277904A1

公开(公告)日：2010-11-04

申请号：US12434248

申请日：2009-05-01

Applicant: Roger T. HANLEY ,  Robert M. BECKER ,  Steven S. LYONS ,  David P. RAMER ,  Jonathan A. ROBBINS ,  Chad N. SANDERS ,  J. Michael Phipps

Inventor： Roger T. HANLEY ,  Robert M. BECKER ,  Steven S. LYONS ,  David P. RAMER ,  Jonathan A. ROBBINS ,  Chad N. SANDERS ,  J. Michael Phipps

IPC: F21V1/00

CPC classification number: F21V1/04 ,  F21K9/62 ,  F21K9/64 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2009

Abstract: Disclosed exemplary solid state light fixtures use optical cavities to combine or integrate light from LEDs or the like. In such a fixture, the cavity is formed by a light transmissive structure having a volume, and a diffuse reflector that covers a contoured portion of the structure. A heat sink member supports a flexible circuit board so as to position the light emitters to couple light to the transmissive structure and provide effective heat dissipation. The circuit board has flexible tabs mounting the emitters. When installed in the fixture, the tabs bend and the emitters press against a sufficiently rigid periphery of the light transmissive structure. TIM may be compressed between the heat sink member and the opposite surface of each tab. Heat conductive surface pads and heat conductors through vias through the tabs conduct heat from the emitters to the heat sink member, e.g. through the TIM.

Abstract translation: 公开的示例性固态灯具使用光学腔来组合或集成来自LED等的光。 在这种固定装置中，空腔由具有体积的透光结构和覆盖结构的轮廓部分的漫反射器形成。 散热构件支撑柔性电路板，以便定位发光体以将光耦合到透射结构并提供有效的散热。 电路板具有安装发射器的挠性突片。 当安装在夹具中时，突片弯曲并且发射器压靠光透射结构的足够刚性的周边。 TIM可以在散热构件和每个翼片的相对表面之间被压缩。 导热表面焊盘和通过通孔的通孔的加热导体将热量从发射器传导到散热器部件，例如， 通过TIM。

公开(公告)号：US20100271793A1

公开(公告)日：2010-10-28

申请号：US12429915

申请日：2009-04-24

Applicant: Drew G. Doblar ,  Gurpreet S. Dayal

Inventor： Drew G. Doblar ,  Gurpreet S. Dayal

IPC: H01R12/18 ,  H05K1/14

CPC classification number: H05K7/1454 ,  H05K1/0271 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/2009 ,  H05K2203/167

Abstract: A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.

Abstract translation: 提供了一种安装平面组件（例如背板或中平面），用于互连服务器计算机中的多个子板。 安装平面组件包括印刷电路板（“PCB”），该印刷电路板具有多个共用的安装孔，用于将连接器对准销连接到PCB的正面以及通过其连接到PCB背面的机械支撑元件 安装孔。

公开(公告)号：US20100220457A1

公开(公告)日：2010-09-02

申请号：US12161668

申请日：2006-02-03

Applicant: Hidetsugu Mukae ,  Hiroyuki Suzuki

Inventor： Hidetsugu Mukae ,  Hiroyuki Suzuki

IPC: H05K1/11

CPC classification number: H05K3/361 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0278

Abstract: To provide a connecting portion of a circuit board and a circuit board-connecting structure, in which connecting portions can be positively connected together, and also a connecting process can be simplified.In a circuit board-connecting portion 10, a first connecting portion 15 and a second connecting portion 20 are disposed in facing relation such that first conductors 14 contact second conductors 19, and also a first substrate 12 and a second substrate 17 are fixed to each other by an adhesive 22. The first connecting portion 15 has rigid members 24 provided at a reverse surface 12B of the first substrate 12 which is a soft substrate, and the rigid members 24 are disposed along a direction of a thickness of the first substrate 14, and are provided at positions corresponding to at least parts 14A of the first conductors 14.

Abstract translation: 为了提供电路板和电路板连接结构的连接部分，其中连接部分可以牢固地连接在一起，并且还可以简化连接过程。 在电路板连接部分10中，以第一导体14接触第二导体19的方式设置第一连接部分15和第二连接部分20，并且将第一基板12和第二基板17固定到每个 第一连接部分15具有设置在作为软质基板的第一基板12的反面12B处的刚性构件24，并且刚性构件24沿着第一基板14的厚度方向 设置在与第一导体14的至少一部分14A对应的位置。