公开(公告)号：US20170223816A1

公开(公告)日：2017-08-03

申请号：US15421618

申请日：2017-02-01

Applicant: IBIDEN CO., LTD.

Inventor： Takahisa HIRASAWA ,  Kiyotaka TSUKADA

IPC: H05K1/02 ,  H05K3/32 ,  H05K1/14 ,  H05K1/09

CPC classification number: H05K1/147 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4046 ,  H05K2201/10242

Abstract: A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal block including a welding base material and positioned such that the metal block is penetrating through the flexible insulating layer and the conductor layer.

公开(公告)号：US09717148B2

公开(公告)日：2017-07-25

申请号：US14859026

申请日：2015-09-18

Applicant: Delaware Capital Formation, Inc.

Inventor： Mark Hahn

IPC: H05K3/10 ,  H05K1/18 ,  B23K9/167 ,  B23K9/09 ,  H01L23/00 ,  B23K26/21 ,  B23K26/0622

CPC classification number: H05K3/103 ,  B23K9/0043 ,  B23K9/091 ,  B23K9/092 ,  B23K9/167 ,  B23K9/23 ,  B23K26/0622 ,  B23K26/21 ,  B23K26/22 ,  B23K26/32 ,  B23K2101/38 ,  B23K2103/00 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/07 ,  H01L24/08 ,  H01L24/09 ,  H01L24/42 ,  H01L24/44 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02163 ,  H01L2224/02185 ,  H01L2224/04042 ,  H01L2224/45147 ,  H01L2224/45639 ,  H01L2224/48476 ,  H01L2224/80007 ,  H01L2224/80009 ,  H01L2224/8019 ,  H01L2224/8034 ,  H01L2924/00014 ,  H05K1/18 ,  H05K3/328 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.

公开(公告)号：US09549472B2

公开(公告)日：2017-01-17

申请号：US14305948

申请日：2014-06-16

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryuichi Shibutani

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/2036 ,  Y02P70/613

Abstract: First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.

Abstract translation: 形成在一个半导体封装表面上的第一电极焊盘包括表面积大于其它第一电极焊盘的表面积的第一增强电极焊盘。 形成在其上安装有半导体封装的印刷线路板上的第二电极焊盘包括至少一个第二增强电极焊盘。 第二加强电极垫与第一增强电极焊盘相对，并且其表面积大于其它第二电极焊盘的表面积。 第一和第二电极焊盘通过焊接连接部分连接。 圆柱形封闭构件包围连接第一和第二增强电极焊盘的焊接连接部分的外周边。 抑制诸如封装衬底和印刷电路板的半导体器件的翘曲量的增加，并且减少了相对于相邻焊料连接部件或相邻部件的焊料桥的发展。

公开(公告)号：US09497877B2

公开(公告)日：2016-11-15

申请号：US14179811

申请日：2014-02-13

Applicant: SMA Solar Technology AG

Inventor： Eberhard Janssen ,  Volker Marschang ,  Burkhard Roecher

IPC: H05K7/14 ,  H01G2/06 ,  H02M7/00 ,  H01G2/10 ,  H01G2/14 ,  H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K7/1417 ,  H01G2/06 ,  H01G2/106 ,  H01G2/14 ,  H02M7/003 ,  H05K1/0201 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0254 ,  H05K1/0268 ,  H05K3/222 ,  H05K3/301 ,  H05K3/325 ,  H05K7/14 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10454 ,  H05K2201/10492 ,  Y10T29/49004

Abstract: An electronic device includes a housing, a circuit board, a plurality of holders having mechanical connectors to the housing and to the circuit board and mechanically fixing the circuit board within the housing, and at least one capacitor having a first electrode, a second electrode and a dielectric arranged between the first and second electrodes. The first electrode is electrically connected to a contact on the circuit board, and the second electrode is electrically connected to the housing. The at least one capacitor is part of one of the plurality of holders; and the dielectric of the capacitor is part of a thermal insulation between the connectors to the circuit board and to the housing.

Abstract translation: 电子设备包括壳体，电路板，多个保持器，其具有到外壳和电路板的机械连接器，并将电路板机械地固定在壳体内;以及至少一个电容器，其具有第一电极，第二电极和 布置在第一和第二电极之间的电介质。 第一电极电连接到电路板上的触点，并且第二电极电连接到壳体。 所述至少一个电容器是所述多个保持器之一的一部分; 并且电容器的电介质是到电路板的连接器和壳体之间的绝热的一部分。

公开(公告)号：US20160309587A1

公开(公告)日：2016-10-20

申请号：US15016212

申请日：2016-02-04

Applicant: TM TECHNOLOGY, INC

Inventor： Ben WU ,  Wen-Doe SU

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0298 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2933/0075 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0017 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2203/0562

Abstract: A light emitting diode load board includes a substrate, a first dielectric layer, a second dielectric layer and a first conductive pad and a second conductive pad. The second dielectric layer includes a first structure part, a second structure part and a third structure part. The first dielectric layer is disposed on the substrate. The first structure part is disposed on the first dielectric layer and has a first sidewall. The second structure part is disposed on the first structure part and has a second sidewall. The third structure part is disposed on the second structure part and has N sidewalls. The second sidewall is more prominent than the first sidewall. The first sidewall, the second sidewall and the N sidewalls define the first etched part, and the part of the first dielectric layer is exposed from the first etched part. The first conductive pad is disposed in the first etched part. The second conductive is disposed on the second dielectric layer, covers part of the second dielectric and exposes the open of the first etched part.

Abstract translation: 发光二极管负载板包括衬底，第一电介质层，第二电介质层和第一导电焊盘和第二导电焊盘。 第二电介质层包括第一结构部分，第二结构部分和第三结构部分。 第一介电层设置在基板上。 第一结构部分设置在第一电介质层上并具有第一侧壁。 第二结构部分设置在第一结构部分上并且具有第二侧壁。 第三结构部分设置在第二结构部分上并具有N个侧壁。 第二侧壁比第一侧壁更突出。 第一侧壁，第二侧壁和N侧壁限定第一蚀刻部分，并且第一电介质层的一部分从第一蚀刻部分露出。 第一导电焊盘设置在第一蚀刻部分中。 第二导体设置在第二电介质层上，覆盖第二电介质的一部分并暴露第一蚀刻部分的开口。

公开(公告)号：US20160270213A1

公开(公告)日：2016-09-15

申请号：US15041033

申请日：2016-02-11

Applicant: APPLE INC.

Inventor： Amir Salehi ,  Vu T. Vo ,  Wyeman Chen ,  Chang Liu ,  Dennis R. Pyper ,  Steven Patrick Cardinali ,  Lan Hoang ,  Siddharth Nangia ,  Meng Chi Lee ,  Takayoshi Katahira

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/284 ,  B33Y80/00 ,  H05K1/0224 ,  H05K2201/0141 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2201/10969 ,  H05K2201/2036

Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Abstract translation: 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。

公开(公告)号：US09287224B2

公开(公告)日：2016-03-15

申请号：US14090560

申请日：2013-11-26

Applicant: FUJITSU LIMITED

Inventor： Satoshi Masuda

IPC: H01L23/34 ,  H01L23/66 ,  H01L25/16 ,  H01L23/045 ,  H01L23/047 ,  H01L23/498 ,  H05K3/46 ,  H05K7/20 ,  H01L23/00 ,  H01L23/367 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member, a semiconductor device mounted on an upper face of the upper substrate, a first ground line connected to the semiconductor device and formed on the upper substrate, and a ground metal part connected to the base metal part and disposed in the lower base member, wherein the ground metal part is connected to the first ground line on the upper substrate.

Abstract translation: 高频模块包括下基部件，其具有形成在其上表面中的凹部，并且具有形成在其下表面上的待接地的基底金属部分，设置在下部的凹部内的上基板 基底构件，安装在上基板的上表面上的半导体器件，连接到半导体器件并形成在上基板上的第一接地线，以及连接到基底金属部分并设置在下基底构件中的接地金属部件 ，其中所述接地金属部分连接到所述上基板上的所述第一接地线。

公开(公告)号：US20160057863A1

公开(公告)日：2016-02-25

申请号：US14833578

申请日：2015-08-24

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masahiro Kyozuka

IPC: H05K1/14 ,  H05K1/09 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC classification number: H05K1/144 ,  H01L21/486 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/18161 ,  H05K2201/042 ,  H05K2201/10242

Abstract: An electronic component device includes a cored wiring substrate, an electronic component, a reinforcing layer, a connection terminal, and sealing resin. The cored wiring substrate includes a core layer. The electronic component is mounted on the cored wiring substrate. The coreless wiring substrate is disposed on the cored wiring substrate and the electronic component. The reinforcing layer is provided in the coreless wiring substrate and in a region corresponding to the electronic component. The connection terminal connects the cored wiring substrate and the coreless wiring substrate. The sealing resin is filled between the cored wiring substrate and the coreless wiring substrate.

Abstract translation: 电子部件装置包括芯线布线基板，电子部件，加强层，连接端子和密封树脂。 芯线布线基板包括芯层。 电子部件安装在芯线布线基板上。 无芯布线基板设置在芯线布线基板和电子部件上。 加强层设置在无芯布线基板中和对应于电子部件的区域中。 连接端子连接芯线布线基板和无芯布线基板。 密封树脂填充在芯线布线基板和无芯布线基板之间。

公开(公告)号：US20150173192A1

公开(公告)日：2015-06-18

申请号：US14405094

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： Stephane Kohn

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设有螺纹孔，另一端设置有横向支承表面，该横向支承表面具有从其突出的平滑的定中心钉，所述栓具有纵向外部通道， 其长度为横向支承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔件的模块。

公开(公告)号：US20150077963A1

公开(公告)日：2015-03-19

申请号：US14491069

申请日：2014-09-19

Applicant: IBIDEN CO., LTD.

Inventor： Takema ADACHI ,  Yuzo KAIDA

IPC: H05K1/14 ,  H05K3/42 ,  H05K3/36 ,  H05K3/10 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/144 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10242 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A printed wiring board includes a wiring board, and multiple posts formed on the wiring board and positioned to mount a second printed wiring board onto the wiring board. Each of the metal posts has a first surface connected to the wiring board, a second surface formed to connect the second printed wiring board, and a side surface between the first surface and the second surface, and the side surface of each of the metal posts forms a curved surface.

Abstract translation: 印刷电路板包括布线板和形成在布线板上并定位成将第二印刷布线板安装到布线板上的多个柱。 每个金属柱具有连接到布线板的第一表面，形成为连接第二印刷线路板的第二表面和第一表面和第二表面之间的侧表面以及每个金属柱的侧表面 形成曲面。