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公开(公告)号：US20160242270A1
公开(公告)日：2016-08-18
申请号：US15027177
申请日：2014-09-29
Inventor： David ROBERT , Yves ROYER
CPC classification number: H05K1/0201 , G01J5/06 , G01J5/061 , G01J5/10 , H01R12/77 , H05K1/0209 , H05K1/0218 , H05K1/028 , H05K1/0296 , H05K1/11 , H05K1/147 , H05K2201/06 , H05K2201/066 , H05K2201/0715
Abstract: A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks.
Abstract translation: 一种低发射率的柔性印刷电路，包括第一端和第二端以及在第一和第二端之间延伸的柔性中心部分，并且包括被涂覆有聚合物材料的电导轨道，以电连接第一端和第二端。 柔性中心部分至少部分地被形成在具有小于聚合物材料和导电轨道的发射率的材料中形成的热屏蔽覆盖。
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公开(公告)号：US20160174357A1
公开(公告)日：2016-06-16
申请号：US14565744
申请日：2014-12-10
Applicant: RAYTHEON COMPANY
Inventor： Waid Paine , James S. Wilson , Cary C. Kyhl , Robert S. Isom
CPC classification number: H05K1/0204 , H01Q21/0025 , H01R12/72 , H05K1/0237 , H05K1/111 , H05K1/183 , H05K7/20509 , H05K2201/06 , H05K2201/09036 , H05K2201/10098
Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.
Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 衬底，其布置在所述散热器的表面上，使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面，并为设置在基板中的发热电路提供热路径。
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公开(公告)号：US20160157334A1
公开(公告)日：2016-06-02
申请号：US14893255
申请日：2013-12-12
Applicant: KANEKA CORPORATION
Inventor： Aki KOUKAMI , Kazuo HAGIWARA , Keisuke OGUMA , Kazuhide FUJIMOTO
CPC classification number: H05K1/0209 , H01L23/295 , H01L23/3121 , H01L23/3737 , H01L2924/0002 , H05K1/18 , H05K3/284 , H05K2201/0104 , H05K2201/06 , H05K2201/10371 , H05K2201/10545 , H05K2203/1327 , H01L2924/00
Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.
Abstract translation: 一种散热结构，包括：印刷电路板; 第一发热元件; 第二发热元件; 和导热性可固化液体树脂组合物的固化物，所述印刷电路板具有与所述第一表面相对的第一表面和第二表面，所述第一发热元件设置在所述第一表面上， 所述第一发热元件被放置在所述第二表面上，所述第一发热元件产生与所述第二发热元件相同或更多的热量，所述第二发热元件被所述固化产物包围，所述第一发热元件 被具有比固化产物低的热导率的层包围。
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公开(公告)号：US20160104826A1
公开(公告)日：2016-04-14
申请号：US14975030
申请日：2015-12-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Seok PARK
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.
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公开(公告)号：US20150144387A1
公开(公告)日：2015-05-28
申请号：US14407402
申请日：2013-06-09
Applicant: SCHNEIDER TOSHIBA INVERTER EUROPE SAS
Inventor： Jing Chen
CPC classification number: H05K1/181 , H01G2/06 , H01G2/065 , H05K1/111 , H05K3/301 , H05K3/325 , H05K3/4015 , H05K5/0239 , H05K7/1432 , H05K2201/0311 , H05K2201/0314 , H05K2201/06 , H05K2201/10015 , H05K2201/10287 , H05K2201/10325 , H05K2201/10409 , H05K2201/10606 , H05K2201/10651 , H05K2201/1081 , H05K2201/10818 , H05K2201/2018 , H05K2201/2036
Abstract: An electrical apparatus, comprising a circuit board, and a capacitor installed on the circuit board; the capacitor is detachably installed on the circuit board. The capacitor can be conveniently detached from the circuit board; therefore, a damaged capacitor can be easily replaced with a new capacitor, saving cost by avoiding the problem in the prior art that the entire electrical apparatus is discarded or causes downtime for repairs due to a damaged capacitor.
Abstract translation: 一种电气设备，包括电路板和安装在电路板上的电容器; 电容器可拆卸地安装在电路板上。 电容器可以方便地从电路板上拆下; 因此，可以容易地用新的电容器替换损坏的电容器，通过避免现有技术中的问题，整个电气设备被丢弃或由于损坏的电容器导致维修停机，从而节省成本。
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Patent Agency Ranking
66.发明申请公开(公告)号：US20150055306A1
公开(公告)日：2015-02-26
申请号：US14528346
申请日：2014-10-30
Inventor： Robert Christopher BURNS , Wolfgang TUSLER , Bernd HAEGELE
CPC classification number: H05K1/05 , H01L23/492 , H01L25/072 , H01L25/18 , H01L2924/0002 , H02M7/003 , H05K1/021 , H05K1/0263 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/4644 , H05K7/023 , H05K7/04 , H05K2201/0326 , H05K2201/04 , H05K2201/06 , H05K2201/10166 , H01L2924/00
Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.
Abstract translation: 本发明涉及一种电路板，特别是用于电力电子模块的电路板，其包括至少部分且优选完全由铝和/或铝合金组成的导电基底。 在导电基板的至少一个表面上，优选使用印刷方法，更优选使用丝网印刷方法，以导电层的形式布置至少一个导体表面，所述导体表面是直接的 与导电基板电接触。
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67.发明申请THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD OF PRODUCING SUCH A METAL-CERAMIC SUBSTRATE 审中-公开热电发生器模块，金属陶瓷基板和生产这种金属陶瓷基板的方法公开(公告)号：US20140345664A1
公开(公告)日：2014-11-27
申请号：US14368372
申请日：2013-01-22
Applicant: Curamik Electronics GmbH
Inventor： Andreas Meyer , Jurgen Schulz-Harder
CPC classification number: H05K1/0306 , C04B37/021 , C04B37/026 , C04B37/028 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/406 , C04B2237/407 , C04B2237/64 , C04B2237/706 , C04B2237/86 , H01L23/38 , H01L35/30 , H01L35/32 , H01L2924/0002 , H05K1/11 , H05K3/0067 , H05K2201/06 , H05K2201/10219 , Y10T29/49155 , H01L2924/00
Abstract: The invention relates to a thermoelectric generator module with a hot zone and a cold zone including at least a first metal-ceramic substrate, which has a first ceramic layer and at least one structured first metallization applied to the first ceramic layer and is assigned to the hot zone, and at least a second metal-ceramic substrate, which has a second ceramic layer and at least one structured second metallization applied to the second ceramic layer and is assigned to the cold zone, and also a number of thermoelectric generator components located between the first and second structured metallizations of the metal-ceramic substrates. The first metal-ceramic substrate, assigned to the hot zone, has at least one layer of steel or high-grade steel, wherein the first ceramic layer is arranged between the first structured metallization and the at least one layer of steel or high-grade steel. The invention also relates to an associated metal-ceramic substrate and to a method for producing it.
Abstract translation: 本发明涉及一种具有热区和至少包含第一金属陶瓷衬底的冷区的热电发电机模块，该第一金属陶瓷衬底具有施加到第一陶瓷层的第一陶瓷层和至少一个构造的第一金属化层，并被分配给 热区和至少第二金属陶瓷衬底，其具有施加到第二陶瓷层并被分配给冷区的第二陶瓷层和至少一个构造的第二金属化，以及位于第二陶瓷层之间的多个热电发电机组件 金属陶瓷基板的第一和第二结构化金属化。 分配给热区的第一金属陶瓷基体具有至少一层钢或高级钢，其中第一陶瓷层布置在第一结构化金属化和至少一层钢之间或高级 钢。 本发明还涉及一种相关联的金属 - 陶瓷衬底及其制造方法。
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公开(公告)号：US08378360B2
公开(公告)日：2013-02-19
申请号：US13399709
申请日：2012-02-17
Applicant: Jun Seok Park
Inventor： Jun Seok Park
IPC: H01L29/267
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.
Abstract translation: 本发明公开了一种发光封装，包括：基座; 基底上的发光器件; 电连接到所述发光装置的电路层; 电路层上的金层; 电连接在发光器件和金层之间的线; 屏幕构件，具有开口并且设置在与所述发光装置相邻的所述基座上; 以及覆盖所述发光装置的透镜，其中，所述屏幕部件的底面位于比所述发光装置高的位置，并且所述屏部件的整个最上表面与所述透镜接触。
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公开(公告)号：US20110147781A1
公开(公告)日：2011-06-23
申请号：US13036947
申请日：2011-02-28
Applicant: Park Jun Seok
Inventor： Park Jun Seok
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.
Abstract translation: 本发明公开了一种发光器件封装，包括：金属基底; 电路层，设置在所述金属基座的上侧，用于提供导电路径; 安装在具有比所述金属基底上的第一区域更小的厚度的第二区域中的发光器件; 绝缘层，夹在元基体和电路层之间; 设置在所述电路层的上侧的电极层; 以及用于电连接电极层和发光器件的导线。 此外，提供了一种发光器件封装，其由于将发光器件放置在金属基底的小厚度部分上而提高了发光效率。
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公开(公告)号：US20080290352A1
公开(公告)日：2008-11-27
申请号：US10578150
申请日：2005-07-21
Applicant: Jun Seok Park
Inventor： Jun Seok Park
IPC: H01L33/00
CPC classification number: H01L33/641 , F21K9/00 , H01L27/156 , H01L33/40 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2924/0002 , H01L2924/19107 , H01L2933/0025 , H01L2933/0058 , H05K1/0203 , H05K1/021 , H05K1/056 , H05K1/182 , H05K3/243 , H05K2201/06 , Y10S257/918 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.
Abstract translation: 本发明公开了一种发光器件封装，包括：金属基底; 电路层，设置在所述金属基座的上侧，用于提供导电路径; 安装在具有比所述金属基底上的第一区域更小的厚度的第二区域中的发光器件; 绝缘层，夹在元基体和电路层之间; 设置在所述电路层的上侧的电极层; 以及用于电连接电极层和发光器件的导线。 此外，提供了一种发光器件封装，其由于将发光器件放置在金属基底的小厚度部分上而提高了发光效率。
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