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    Printed Wiring Board
    63.
    发明申请
    Printed Wiring Board 审中-公开
    印刷线路板

    公开(公告)号：US20160309592A1

    公开(公告)日：2016-10-20

    申请号：US15099905

    申请日：2016-04-15

    Applicant: Rohm Co., Ltd.

    Inventor： Masashi Nagasato

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/0243 ,  H05K1/0242 ,  H05K1/025 ,  H05K3/4685 ,  H05K2201/09154 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/1009 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

    Abstract: A printed wiring board used to suppress parasitic component is provided. The printed wiring board 100 includes a multi-layer substrate 110, and a power line 50 laid on the multi-layer substrate 110 and connected with a power terminal row T11a-T11d of a semiconductor device 10. The power line 50 includes a first wiring pattern 51 formed on a surface of the multi-layer substrate 110, a second wiring pattern 52 formed within the multi-layer substrate 110, and interlayer connections 53x and 53y electrically conducting the first wiring pattern 51 and the second wiring pattern 52 to bypass at least a portion of the power terminal row T11a-T11d.

    Abstract translation: 提供了用于抑制寄生成分的印刷线路板。 印刷电路板100包括多层基板110和布置在多层基板110上并与半导体装置10的电源端子排T11a-T11d连接的电力线50.电力线50包括第一布线 形成在多层基板110的表面上的图案51，形成在多层基板110内的第二布线图案52，以及导电第一布线图案51和第二布线图案52旁路的层间连接53x和53y 电力端子排T11a-T11d的至少一部分。

    Assembly of a circuit board and a flexible flat cable, circuit board, and assembling method for a flexible flat cable
    64.
    发明授权
    Assembly of a circuit board and a flexible flat cable, circuit board, and assembling method for a flexible flat cable 有权
    组装电路板和柔性扁平电缆，电路板和柔性扁平电缆的组装方法

    公开(公告)号：US09426889B2

    公开(公告)日：2016-08-23

    申请号：US14231411

    申请日：2014-03-31

    Applicant: Wistron Corporation

    Inventor： Yu-Ju Liu ,  Che-Wen Liu

    IPC: H05K1/14 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/10356 ,  H05K2201/2027 ,  Y10T29/49181

    Abstract: An assembly includes a circuit board and a flexible flat cable. The circuit board includes a board body having top, bottom and side faces, and a connection module. The board body is formed with a positioning slot that is formed through the top and bottom faces and that has a first length, and an opening that extends from the side face and that is in spatial communication with the positioning slot. The opening is formed through the top and bottom faces and has a second length shorter than the first length. The flexible flat cable includes a connection unit and a cable main body that has a width greater than the second length. The cable main body is able to pass through the opening, and extends through and is positioned in the positioning slot.

    Abstract translation: 组件包括电路板和柔性扁平电缆。 电路板包括具有顶部，底部和侧面以及连接模块的板体。 板本体形成有通过顶面和底面形成并具有第一长度的定位槽，以及从侧面延伸并与定位槽空间连通的开口。 开口通过顶面和底面形成，并且具有比第一长度短的第二长度。 柔性扁平电缆包括具有大于第二长度的宽度的连接单元和电缆主体。 电缆主体能够穿过开口，并且延伸穿过并定位在定位槽中。

    LED lamp with tapered PCB
    65.
    发明授权
    LED lamp with tapered PCB 有权
    LED灯带锥形PCB

    公开(公告)号：US09392682B2

    公开(公告)日：2016-07-12

    申请号：US14517598

    申请日：2014-10-17

    Applicant: Kevin Yang

    Inventor： Kevin Yang

    IPC: F21V19/00 ,  H05K1/00 ,  F21Y103/00 ,  F21K99/00 ,  F21Y101/02

    CPC classification number: H05K1/00 ,  F21K9/90 ,  F21V19/004 ,  F21V19/0045 ,  F21V19/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/09154 ,  H05K2201/10106

    Abstract: An LED lamp has a PCB at least partially made of metal and a base configured to receive the PCB in a slot formed on the base. The base has a base top surface and the slot has a tapered cross-section. A first sidewall is formed in the slot. The first sidewall is formed at a first sidewall angle that is less than 90°. A second sidewall is formed in the slot. The second sidewall is formed at a second sidewall angle. A top protrusion is formed on a base top surface. The top protrusion has a top protrusion first position and a top protrusion second position. A pair of edges are formed on the PCB, namely a first edge formed on the PCB and a second edge formed on the PCB. The first edge is tapered to engage the first sidewall.

    Abstract translation: LED灯具有至少部分地由金属制成的PCB和被配置为在形成在基座上的槽中接收PCB的基座。 基座具有基座顶面，并且槽具有锥形横截面。 第一侧壁形成在槽中。 第一侧壁形成为小于90°的第一侧壁角。 第二侧壁形成在槽中。 第二侧壁形成为第二侧壁角。 顶部突起形成在基底顶面上。 顶部突起具有顶部突起第一位置和顶部突起第二位置。 在PCB上形成一对边缘，即形成在PCB上的第一边缘和形成在PCB上的第二边缘。 第一边缘是锥形的以接合第一侧壁。

    Cross talk reduction for high-speed electrical connectors
    66.
    发明授权
    Cross talk reduction for high-speed electrical connectors 有权
    用于高速电连接器的串扰减少

    公开(公告)号：US09277649B2

    公开(公告)日：2016-03-01

    申请号：US13644092

    申请日：2012-10-03

    Applicant: Jason John Ellison

    Inventor： Jason John Ellison

    IPC: H05K1/11 ,  H01R12/52 ,  H01R13/6471 ,  H05K1/02

    CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R13/6471 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/09154 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09781

    Abstract: An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal conductors that define respective signal contact pads. The contact pads are configured to mate with electrical contacts of a complementary electrical connector. The printed circuit board includes a ground coupling assembly that electrically connects at least a pair of the ground conductors.

    Abstract translation: 电连接器包括印刷电路板，其包括承载限定各个接地焊盘的多个接地导体的本体，以及限定相应的信号接触焊盘的多个信号导体。 接触垫被配置成与互补的电连接器的电触点配合。 印刷电路板包括电连接至少一对接地导体的接地耦合组件。

    ELECTRICAL VACUUM-COMPATIBLE FEEDTHROUGH STRUCTURE AND DETECTOR ASSEMBLY USING SUCH FEEDTHROUGH STRUCTURE
    68.
    发明申请
    ELECTRICAL VACUUM-COMPATIBLE FEEDTHROUGH STRUCTURE AND DETECTOR ASSEMBLY USING SUCH FEEDTHROUGH STRUCTURE 审中-公开
    电气真空兼容的结构和检测器组装使用这种有力的结构

    公开(公告)号：US20150348766A1

    公开(公告)日：2015-12-03

    申请号：US14443913

    申请日：2013-11-19

    Applicant: PARTICLE PHYSICS INSIDE PRODUCTS B.V.

    Inventor： Dirk-Jan SPAANDERDAM ,  Helga Julia JUNGMANN ,  Ronald Martinus Alexander HEEREN

    IPC: H01J49/00 ,  H01J49/24 ,  H01J49/02 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H01J49/0004 ,  H01J49/022 ,  H01J49/025 ,  H01J49/24 ,  H05K1/02 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/11 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2203/1147

    Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure, the feedthrough structure comprising a printed circuit board (PCB) for carrying one or more detectors, wherein said PCB comprises a top surface covered with a first UHV sealing layer and one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, a back surface comprising one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, wherein one or more conductive wires are embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, wherein one or more thermally conductive vias are embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.

    Abstract translation: 一种超高真空（UHV）兼容馈通结构和使用这种馈通结构的检测器组件，所述馈通结构包括用于承载一个或多个检测器的印刷电路板（PCB），其中所述PCB包括覆盖有第一特高压 密封层和一个或多个第一电极和至少部分地在所述顶表面上延伸的至少第一导热层; 以及包括一个或多个第二电极和至少部分地在所述背表面上延伸的至少第二导热层的后表面，其中一个或多个导电线嵌入所述PCB中以将所述一个或多个第一电极与所述 一个或多个第二电极; 并且其中一个或多个导热通孔嵌入所述PCB中，用于将所述至少第一导热层与所述第二导热层热连接。

    CIRCUIT BOARD AND VEHICLE BRAKE HYDRAULIC PRESSURE CONTROL UNIT
    70.
    发明申请
    CIRCUIT BOARD AND VEHICLE BRAKE HYDRAULIC PRESSURE CONTROL UNIT 有权
    电路板和车辆制动液压控制单元

    公开(公告)号：US20150245483A1

    公开(公告)日：2015-08-27

    申请号：US14632574

    申请日：2015-02-26

    Applicant: NISSIN KOGYO CO., LTD.

    Inventor： Sakae MIYASAKA

    IPC: H05K1/11 ,  B60T15/02

    CPC classification number: B60T15/028 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/10151 ,  H05K2203/048

    Abstract: One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

    Abstract translation: 一个实施例提供一种具有基板和设置在基板上的电极部分的电路板。 电极部分包括：设置在基板的前表面上的四边形区域; 层叠在所述焊盘的前表面的整体上的焊料层; 以及与焊料层的前表面接合的焊盘。 当从上方观察电极部分时，焊盘的外周线接触焊盘的四边中的每一侧。 焊料层露出的露出部分分别形成在电极部分的前表面的四个角处。 并且，露出部分形成为具有相同的形状。

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