公开(公告)号：US09769955B2

公开(公告)日：2017-09-19

申请号：US14395644

申请日：2013-04-26

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Junichi Teraki ,  Akihiko Oguri

IPC: F25D23/12 ,  H05K7/20 ,  F24F1/24 ,  F25B31/00 ,  H01L23/473 ,  H05K1/02 ,  F25B13/00 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K7/2029 ,  F24F1/24 ,  F25B13/00 ,  F25B31/006 ,  F25B2313/0254 ,  F25B2700/21153 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/0271 ,  H05K3/22 ,  H05K3/306 ,  H05K3/3468 ,  H05K7/20936 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10409 ,  H05K2203/044 ,  H01L2924/00

Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.

公开(公告)号：US09755368B2

公开(公告)日：2017-09-05

申请号：US15377893

申请日：2016-12-13

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Chih-Pi Cheng ,  Wen He ,  Quan Wang ,  Feng Zeng

IPC: H01R24/00 ,  H01R13/6471 ,  H01R24/62 ,  H01R4/02 ,  H01R13/631 ,  H05K1/11 ,  H01R107/00

CPC classification number: H01R13/6471 ,  H01R4/023 ,  H01R13/631 ,  H01R24/60 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A plug connector includes a connector body defining a front mating cavity with a first inner side and a second inner side opposite to the first inner side, and a rear cable supporting platform with a first surface and a second surface opposite to the first inner side and a plurality of terminals. The terminals include two rows of contacting sections arranged along the first and second inner sides of the mating cavity and soldering legs extending to the platform to be welded to a cable. The soldering legs are arranged in one row and exposing to the first surface of the platform while the second surface of the platform has no soldering legs to be welded to the cable.

公开(公告)号：US09736955B2

公开(公告)日：2017-08-15

申请号：US15216727

申请日：2016-07-22

Applicant: ABB Schweiz AG

Inventor： Thomas Keul

IPC: H01R12/71 ,  H05K1/14 ,  H05K5/02 ,  H05K3/36 ,  H05K1/11 ,  H05K5/00 ,  H01R12/73 ,  H05K1/02

CPC classification number: H05K5/0286 ,  H01R12/716 ,  H01R12/737 ,  H05K1/02 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K3/366 ,  H05K5/0069 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10522 ,  H05K2201/10962

Abstract: An electronic circuit has at least one first printed circuit board extending in a first plane, and at least one second printed circuit board extending in a second plane that extends in parallel to, and outside of, the first plane, and also has at least one first connector device, in electrical contact with the first printed circuit board, and a second connector device, in electrical contact with the second printed circuit board and arranged on a second printed circuit board side facing away from the first printed circuit board, both connector devices being designed together to receive an associated plug-in board and to electrically contact this plug-in board using both printed circuit boards, the first connector device being arranged, at least in part, on a second plane side facing away from the first printed circuit board.

公开(公告)号：US09735221B2

公开(公告)日：2017-08-15

申请号：US15006481

申请日：2016-01-26

Applicant: Japan Display Inc.

Inventor： Toshihiko Fukuma ,  Norio Oku

IPC: H01L29/88 ,  H01L27/32 ,  H01L25/16 ,  H05K1/14

CPC classification number: H01L27/3276 ,  H01L25/167 ,  H01L27/323 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/147 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10128 ,  H01L2924/00

Abstract: The display module includes first and second FPC substrates disposed on top of each other. The first substrate has an IC mounted on it. The second FPC substrate has a cutout inside which the IC is disposed.

公开(公告)号：US09730330B1

公开(公告)日：2017-08-08

申请号：US14550467

申请日：2014-11-21

Applicant: H4 Engineering, Inc.

Inventor： Christopher T. Boyle ,  Alexander G. Sammons ,  Denes Marton ,  Scott K. Taylor

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/189 ,  G09F9/301 ,  H05K1/028 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/09063 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2203/1327

Abstract: A compliant electronic device is presented. The device may be, for example a wearable display for sports applications. The compliant electronic device comprises a thin sheet with a regular pattern of openings optimized to provide maximum compliance. The device may be partially or completely embedded in foam or other highly stretchable and compressible material that, while preserving compliance, protects the device from untoward environmental influences.

公开(公告)号：US20170223846A1

公开(公告)日：2017-08-03

申请号：US15119559

申请日：2015-03-04

Applicant: MC10, INC.

Inventor： Brian Elolampi ,  David G. Garlock ,  Harold Gaudette ,  Steven Fastert ,  Adam Standley ,  Yung-Yu Hsu

IPC: H05K5/00 ,  H05K5/06 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K5/0034 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/32 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/065 ,  H05K2201/09063 ,  H05K2201/09872 ,  H05K2201/10151 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

公开(公告)号：US20170194723A1

公开(公告)日：2017-07-06

申请号：US14996855

申请日：2016-01-15

Applicant: INVENTEC (PUDONG) TECHNOLOGY CORPORATION ,  INVENTEC CORPORATION

Inventor： Ji-Peng Xu ,  Guang-Zhao Tian ,  Yang-Qiu Lai ,  Xiang-Biao Sha

IPC: H01R4/34 ,  H05K1/18

CPC classification number: H01R12/7047 ,  H01R12/7088 ,  H01R12/712 ,  H05K1/0263 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10962 ,  H05K2203/167 ,  Y02P70/611

Abstract: A circuit board assembly includes a circuit board, at least one metal sheet, at least one bus and at least one fixed member. The circuit board has at least one electrical connecting area. The metal sheet is adapted to solder to the electrical connecting area and has at least one metal sheet hole. The bus has a connecting portion. The connecting portion is corresponding to the metal sheet. The bus has at least one fixed screwing hole. The fixed screwing hole is corresponding to the metal sheet hole. The circuit board and the bus is locked by the fixed member.

公开(公告)号：US09696349B2

公开(公告)日：2017-07-04

申请号：US14315743

申请日：2014-06-26

Applicant: General Electric Company

Inventor： Ruxi Wang ,  William Edward Burdick, Jr. ,  Satish Prabhakaran ,  Raymond John Nicholas

IPC: G01R15/20 ,  G01R15/18 ,  H05K1/02 ,  H01F27/28 ,  H05K1/16 ,  H05K3/28

CPC classification number: G01R15/181 ,  H01F27/2804 ,  H01F2027/2809 ,  H05K1/028 ,  H05K1/165 ,  H05K3/282 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/097 ,  H05K2201/10151 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/0221 ,  H05K2203/0228 ,  H05K2203/107

Abstract: A detecting unit is presented. The detecting unit includes a flexible circuit having a first side and a second side opposite the first side. The flexible circuit includes a plurality of cells defined therein, each of the plurality of cells having a first side and a second side respectively corresponding to the first side and the second side of the flexible circuit. Moreover, the flexible circuit includes a plurality of conductive windings disposed on at least one of the first and second sides of the plurality of cells. Further, the flexible circuit includes a stress reduction feature between each of the plurality of cells. Also, the detecting unit includes a sealing element configured to secure the flexible circuit in a stacked configuration. A sensing system and a method of making a detecting unit are also presented.

公开(公告)号：US09686867B2

公开(公告)日：2017-06-20

申请号：US13723364

申请日：2012-12-21

Applicant: Daniela Rus ,  Robert J. Wood ,  Cagdas Denizel Onal ,  Michael Tolley

Inventor： Daniela Rus ,  Robert J. Wood ,  Cagdas Denizel Onal ,  Michael Tolley

IPC: H05K1/18 ,  H05K3/06 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K3/0005 ,  H05K3/0052 ,  H05K3/06 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/1453 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: Methods to systematize the development of machines using inexpensive, fast, and convenient fabrication processes are disclosed. In an embodiment, a folding pattern and corresponding circuit design can provide the blueprints for fabrication. The folding pattern may be provided (e.g. laser machined) on a flat sheet of substrate material, such as a polymer. The circuit pattern may be generated by etching or applying (e.g. sputtering) a copper foil layer onto the substrate. Circuit components and actuators may then be added at specified locations. The flat substrate may then be folded along the predefined locations to form the final machine. The machine may operate autonomously to perform a task.

公开(公告)号：US09685425B2

公开(公告)日：2017-06-20

申请号：US14165982

申请日：2014-01-28

Applicant: Apple Inc.

Inventor： Matthias Sauer

IPC: H05K7/00 ,  H01L25/065 ,  H05K1/14 ,  H01L23/31 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package may have a package substrate with a surface to which an integrated circuit die is soldered. A first set of contacts on the package substrate may mate with contacts on the integrated circuit die. Solder may be used to connect the integrated circuit die to the first set of contacts. A covering material such as a plastic mold cap may be used to cover the integrated circuit die and the first set of contacts. The mold cap may have a rectangular shape or other footprint. A rectangular ring-shaped border region or a border region of other shapes may surround the mold cap and may be free of mold cap material. A second set of contacts on the package substrate may be formed on the surface in the border region.