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公开(公告)号：US09407798B2
公开(公告)日：2016-08-02
申请号：US14028268
申请日：2013-09-16
Applicant: Apple Inc.
Inventor： David G. Havskjold , Emery A. Sanford
CPC classification number: H04N5/2253 , G01J1/4204 , H04M1/0264 , H04M1/0277 , H04M2250/12 , H05K1/028 , H05K1/189 , H05K2201/046 , H05K2201/055 , H05K2201/057 , H05K2201/09045
Abstract: An electronic device may have electrical components such as input-output devices. An electrical component may be mounted on a flexible printed circuit. The flexible printed circuit may have a bend that forms a flexible printed circuit spring to bias the electrical component in a desired direction. The electronic device may have a display with a display cover layer. In an inactive display area, opaque masking material may be formed on the display cover layer. A light window may be formed in the opaque masking layer. The flexible printed circuit spring may bias the electrical component against the display cover layer in alignment with the light window. An air gap under the electrical component may separate the component from a planar portion of the flexible printed circuit that is overlapped by the electrical component. The electrical component may be a camera, a light sensor, or other device.
Abstract translation: 电子设备可以具有诸如输入 - 输出设备的电气部件。 电气部件可以安装在柔性印刷电路上。 柔性印刷电路可以具有形成柔性印刷电路弹簧的弯曲部，以在期望的方向上偏置电气部件。 电子设备可以具有带有显示器覆盖层的显示器。 在非活动显示区域中，可以在显示器覆盖层上形成不透明掩模材料。 可以在不透明掩模层中形成光窗。 柔性印刷电路弹簧可以将电气部件偏置在与光窗口对准的显示器覆盖层上。 电气部件下方的空气间隙可以将部件与由电气部件重叠的柔性印刷电路的平面部分分离。 电气部件可以是相机，光传感器或其他装置。
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公开(公告)号：US20160150634A1
公开(公告)日：2016-05-26
申请号：US14904551
申请日：2014-07-24
Applicant: LG CHEM, LTD.
Inventor： Ducksu OH , Sung Soo PARK , Minsoo KANG
CPC classification number: H05K1/028 , H01L27/3276 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K1/141 , H05K1/142 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0397 , H05K2201/046 , H05K2201/05 , H05K2201/058 , H05K2201/09418 , H05K2201/10128 , H05K2201/10681 , H05K2203/049
Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.
Abstract translation: 提供了一种安装在显示装置的基板上的柔性印刷电路板。
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83.发明授权Method of producing a light emitting diode arrangement and light emitting diode arrangement 有权制造发光二极管装置和发光二极管装置的方法公开(公告)号：US09341328B2
公开(公告)日：2016-05-17
申请号：US14107759
申请日：2013-12-16
Applicant: OSRAM Gesellschaft mit beschräenkter Haftung
Inventor： Harald Stoyan
IPC: H01L29/18 , H01L21/02 , F21S2/00 , H05K1/14 , F21V23/06 , F21K99/00 , F21Y101/02 , H05K3/34 , H05K3/36
CPC classification number: F21S2/005 , F21K9/20 , F21V23/06 , F21Y2115/10 , H05K1/141 , H05K1/142 , H05K1/147 , H05K1/148 , H05K3/3442 , H05K3/363 , H05K2201/046 , H05K2201/09963 , H05K2201/10106 , Y10T29/41
Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules are provided, which in each case comprise at least one radiation emitting semiconductor component on a carrier body. At least one separately fabricated connection carrier is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.
Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块，其在每种情况下都包括载体主体上的至少一个辐射发射半导体部件。 提供至少一个单独制造的连接载体。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。
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公开(公告)号：US09338895B2
公开(公告)日：2016-05-10
申请号：US13573969
申请日：2012-10-17
Applicant: James E. Clayton , Zakaryae Fathi
Inventor： James E. Clayton , Zakaryae Fathi
CPC classification number: H05K3/363 , B23K1/0016 , B23K2101/42 , H05K1/141 , H05K3/32 , H05K3/366 , H05K3/40 , H05K2201/046 , H05K2201/048 , H05K2201/052 , Y10T29/49126 , Y10T156/1002
Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.
Abstract translation: 一种制造电路的方法包括以下步骤：在至少一个表面上形成具有多个电触点的刚性印刷电路板; 形成在至少一个表面上具有多个电气部件的多层柔性电路板，并且还沿着一个边缘具有分叉区域; 当分叉区域分开约180°时，在柔性电路板的分叉区域的内表面上分别形成电极焊盘，该电极焊盘分别与刚性电路板上的电触点对准; 将分叉区域分开并将电极焊盘与电触点对准; 以及在电极焊盘和电触点之间形成电连接。
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85.发明授权公开(公告)号：US09288907B2
公开(公告)日：2016-03-15
申请号：US14217621
申请日：2014-03-18
Inventor： Shao-Chung Hu , Kuo-Yang Horng , Ling-Yueh Yang , Wei-Ching Liu , Pen-Shan Chao , Kun-Feng Chen , Louis Lu-Chen Hsu
CPC classification number: H05K1/14 , H05K1/0209 , H05K1/0216 , H05K1/11 , H05K1/141 , H05K1/148 , H05K1/181 , H05K3/32 , H05K3/366 , H05K2201/04 , H05K2201/046 , H05K2201/047 , H05K2201/10515 , Y02P70/611 , Y10T29/49126
Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
Abstract translation: 介绍了微电子3D封装结构及其制造方法。 微电子3D封装结构包括具有多个第一边缘并且布置有第一电子器件的第一板; 具有多个第二边缘并且设置有第二电子设备的第二板，其中所述第二板的至少一个第二边缘连接到所述第一板的至少一个第一边缘以形成接合线; 以及设置在两个相邻板的接合线处并且适于用作传输信号的连接路径的接合连接部分。
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Patent Agency Ranking
公开(公告)号：US20150357733A1
公开(公告)日：2015-12-10
申请号：US14300855
申请日：2014-06-10
Applicant: Apple Inc.
Inventor： Emery A. Sanford , Tyson B. Manullang , David G. Havskjold , Tyler S. Bushnell , Eric S. Jol , Anthony S. Montevirgen , John Raff
IPC: H01R12/61
CPC classification number: H01R12/62 , H01R12/52 , H05K1/14 , H05K1/142 , H05K1/147 , H05K1/148 , H05K2201/046 , H05K2201/05 , H05K2201/10325 , H05K2201/1034 , H05K2201/10681
Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.
Abstract translation: 一种电路板对板连接器，包括具有低轮廓或尺寸减小的构造的柔性电缆组件。 电缆组件的连接器主体可以被加宽以提供足以支持焊锡引线连接阵列的结构刚度。 可以从电缆组件中省略其它支撑元件，这导致减小的高度尺寸。 柔性电缆组件还可以包括用于将电缆组件保持抵靠电路板的整流罩。 整流罩也可以被配置成减小连接的尺寸或尺寸。
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公开(公告)号：US20150177779A1
公开(公告)日：2015-06-25
申请号：US14544875
申请日：2015-02-27
Applicant: James E. Clayton , Zakaryae Fathi
Inventor： James E. Clayton , Zakaryae Fathi
CPC classification number: G06F1/16 , G06F1/184 , G06F1/185 , H01R12/62 , H05K1/028 , H05K1/118 , H05K1/147 , H05K1/181 , H05K3/366 , H05K2201/046 , H05K2201/09481 , H05K2201/10159 , H05K2201/10189 , H05K2201/10409 , H05K2201/10545
Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.
Abstract translation: 电互连系统包括在分叉的内表面上具有电极焊盘的分叉的多层柔性电路。 电子部件通过常规方式安装在柔性电路的一侧或两侧。 当分叉分开时，电极焊盘可与印刷电路板上的各个触点对准。 在通过焊接，导电粘合剂或其他方式将焊盘接合到触点之后，保持牢固的电连接，同时仍然允许柔性电路从一侧到另一侧弯曲一些，从而产生不具有刚性安装的部件和模块的附加设计选项。
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88.发明授权公开(公告)号：US08883287B2
公开(公告)日：2014-11-11
申请号：US12822609
申请日：2010-06-24
Applicant: Mary C. Boyce , Simona Socrate , Christopher M. Boyce , Brian P. Greviskes
Inventor： Mary C. Boyce , Simona Socrate , Christopher M. Boyce , Brian P. Greviskes
CPC classification number: B29C59/02 , B29C59/16 , B29C2791/009 , B29C2793/00 , B32B3/266 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K1/0283 , H05K2201/0133 , H05K2201/046 , H05K2201/09063 , Y10T428/24314 , Y10T428/24479 , H01L2924/00
Abstract: A flexible and stretchable patterned substrate is provided having a strain-permitting material comprising a patterned conformation that allows the flexible patterned substrate to experience local strain or local strain domains lower than the macroscopic strain of the flexible and stretchable patterned substrate.
Abstract translation: 提供了一种柔性和可拉伸的图案化基底，其具有包含图案化构象的应变允许材料，其允许柔性图案化基底经历比柔性和可拉伸图案化基底的宏观应变低的局部应变或局部应变结构域。
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公开(公告)号：US08837141B2
公开(公告)日：2014-09-16
申请号：US13573968
申请日：2012-10-17
Applicant: James E. Clayton , Zakaryae Fathi
Inventor： James E. Clayton , Zakaryae Fathi
CPC classification number: H05K1/147 , G06F1/20 , H01R12/62 , H01R12/737 , H05K1/118 , H05K3/366 , H05K2201/046 , H05K2201/09481 , H05K2201/10159 , H05K2201/10189 , H05K2201/10409 , H05K2201/10545 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155
Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.
Abstract translation: 电子模块包括：具有沿着一个边缘的分叉区域和安装在至少一个表面上的多个电子部件的多层电路板; 多个电极焊盘功能地连接到电子部件并且定位在分叉区域的内表面上，使得当分叉区域的两条腿分开约180°时，电极焊盘与主板上的相应触点对准，并且 可连接到其上，从而可以在电路板和母板之间产生安全连接; 以及两个金属的散热盖，其可锁定地围绕电路板，一个在任一侧，所述盖还提供配合表面，机械夹紧装置可以在该配合表面上接合并将模块固定到主板。
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90.发明申请SELF-LOCATING ELECTRONICS PACKAGE PRECURSOR STRUCTURE, METHOD FOR CONFIGURING AN ELECTRONICS PACKAGE, AND ELECTRONICS PACKAGE 有权自定位电子封装前置器件结构，配置电子封装的方法和电子封装公开(公告)号：US20140254109A1
公开(公告)日：2014-09-11
申请号：US13787438
申请日：2013-03-06
Applicant: ALLIANT TECHSYSTEMS INC.
Inventor： James D. Lucas , Christopher A. McKellips
IPC: H05K1/14
CPC classification number: H05K1/148 , F42C15/40 , F42C19/02 , F42C19/06 , H05K1/144 , H05K3/4691 , H05K2201/042 , H05K2201/046 , H05K2201/047 , H05K2201/053 , H05K2201/2036
Abstract: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.
Abstract translation: 一种电子封装，包括多个相互平行的垂直间隔的电路板，其大致为圆形，并通过柔性电路电连接，该柔性电路包括围绕电路板周向延伸的导体，并具有延伸到每个电路板的分支。 还公开了电子封装前体结构和从前体结构配置电子封装的方法。
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