公开(公告)号：US08406009B2

公开(公告)日：2013-03-26

申请号：US12863479

申请日：2008-01-30

Applicant: Jeffrey A. Lev ,  Steven S. Homer ,  Earl W. Moore ,  Mark H. Ruch

Inventor： Jeffrey A. Lev ,  Steven S. Homer ,  Earl W. Moore ,  Mark H. Ruch

IPC: H05K7/02

CPC classification number: H05K1/0271 ,  H05K7/142 ,  H05K2201/0133 ,  H05K2201/09081 ,  H05K2201/10409

Abstract: An electronic device is provided, the electronic device includes a printed circuit board (PCB) having a mounting point. The computer system also includes a chassis having a mounting post. The mounting point and the mounting post are flexibly connected.

Abstract translation: 提供电子设备，电子设备包括具有安装点的印刷电路板（PCB）。 计算机系统还包括具有安装柱的底盘。 安装点和安装柱灵活连接。

公开(公告)号：US20130062121A1

公开(公告)日：2013-03-14

申请号：US13597683

申请日：2012-08-29

Applicant: Tomoyuki Yoshimatsu

Inventor： Tomoyuki Yoshimatsu

IPC: H01R4/28

CPC classification number: H01R13/245 ,  H05K1/0215 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/10409

Abstract: An electronic unit includes: a plate-shaped support member having an insulating surface and a conductive surface that are opposed to each other; a cut-and-raised section provided in the support member, and having a contact that is bent to protrude toward the conductive surface, and a pair of through holes provided at side faces of the cut-and-raised section; and a substrate inserted into the pair of through holes, and with which the contact is in elastic and electric contact.

Abstract translation: 电子单元包括：具有彼此相对的绝缘表面和导电表面的板状支撑构件; 设置在所述支撑构件上的切起凸起部分，并且具有弯曲以朝向所述导电表面突出的接触部;以及设置在所述切起部分的侧面处的一对通孔; 以及插入到该对通孔中的基板，并且该接触件与弹性和电接触。

公开(公告)号：US20130050954A1

公开(公告)日：2013-02-28

申请号：US13659066

申请日：2012-10-24

Applicant: TDK-Lambda Americas, Inc.

Inventor： L. Ray Albrecht, III ,  Gordon K.Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K3/34

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermal conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 两个PCB之间的受控电气隔离被提供用于使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US20130037932A1

公开(公告)日：2013-02-14

申请号：US13654489

申请日：2012-10-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Anwar A. Mohammed ,  Soon Ing Chew ,  Donald Fowlkes ,  Alexander Komposch ,  Benjamin Pain-Fong Law ,  Michael Opiz Real

IPC: H01L23/12 ,  F16L23/00 ,  B21D19/00 ,  H01L21/50

CPC classification number: B21D22/20 ,  H01L23/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2924/157 ,  H01L2924/161 ,  H01L2924/171 ,  H01L2924/3511 ,  H05K3/303 ,  H05K2201/10409 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/014

Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.

Abstract translation: 半导体封装包括弯曲体和多个半导体管芯。 弯曲体包括第一和第二相对末端区域和中间中心区域。 弯曲体在中心区域具有第一拐点，在第一端部区域具有第二拐点，在第二端部区域具有第三拐点。 中心区域具有在第一拐点处具有最小极值的凸曲率，第一端区域具有在第二拐点处具有最大极值的凹曲率，并且第二端区域具有在第三拐点处具有最大极值的凹曲率 拐点。 多个半导体管芯在最大极值之间附接到弯曲体的上表面。

公开(公告)号：US08351002B2

公开(公告)日：2013-01-08

申请号：US12505132

申请日：2009-07-17

Applicant: Ryujiro Takamatsu

Inventor： Ryujiro Takamatsu

IPC: G02F1/1345

CPC classification number: H05K1/0216 ,  H05K1/0215 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/10409 ,  Y10T29/49124

Abstract: A printed circuit board for mounting electronic parts thereon includes a ground portion formed on the printed circuit board and connected to an outer ground. A plurality of conductive ground layers are stacked so as to interpose an insulation layer therebetween. An upper conductive ground layer includes first and second conductive ground portions. The first and second ground portions are connected by a connecting element. Another conductive ground layer under the upper conductive ground layer is grounded via the first and second ground portions of the upper conductive ground layer via a through hole provided in the ground portion.

Abstract translation: 用于在其上安装电子部件的印刷电路板包括形成在印刷电路板上并连接到外部接地的接地部分。 堆叠多个导电接地层，以便在它们之间插入绝缘层。 上导电接地层包括第一和第二导电接地部分。 第一和第二接地部分通过连接元件连接。 上导电接地层下的另一导电接地层经由设置在接地部分中的通孔经由上导电接地层的第一和第二接地部分接地。

公开(公告)号：US08344462B2

公开(公告)日：2013-01-01

申请号：US11850996

申请日：2007-09-06

Applicant: Kazutaka Takagi

Inventor： Kazutaka Takagi

IPC: H01L23/24

CPC classification number: H01L23/427 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12044 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/10166 ,  H05K2201/10409 ,  H01L2924/00014

Abstract: A power amplifying semiconductor element is mounted in a package 13, having a heat dissipating surface acting as high frequency ground as well. The package 13 is mounted upside down with flip-chip mounting method in a concave portion 12 formed on a housing 11 having a high frequency ground acting as a heat dissipating surface as well. A cooling mechanism 14 thermally independent from that of the housing 11 is arranged on a heat dissipating base surface of the package 13 facing upward. The cooling mechanism 14 is composed of a heat dissipating fin 15 and a heat pipe 16. The present invention can prevent thermal influence upon other electronic components and can improve greatly the degree of freedom on the designing of the cooling system, because the cooling mechanism of the power amplifying semiconductor element is made independent from that of the housing 11.

Abstract translation: 功率放大半导体元件安装在具有用作高频接地的散热表面的封装13中。 封装13通过倒装芯片安装方式倒置在形成在具有用作散热表面的高频地面的外壳11上的凹部12中。 与壳体11的热独立的冷却机构14布置在面向上的包装13的散热基面上。 冷却机构14由散热片15和热管16构成。本发明能够防止对其他电子部件的热影响，能够大大提高冷却系统的设计自由度，因为冷却机构 功率放大半导体元件被独立于外壳11的功率放大半导体元件。

公开(公告)号：US20120302074A1

公开(公告)日：2012-11-29

申请号：US13114875

申请日：2011-05-24

Applicant: Abraham Hartenstein

Inventor： Abraham Hartenstein

IPC: H01R12/51 ,  H05K3/36 ,  H01R13/02

CPC classification number: H01Q9/045 ,  H01R12/737 ,  H01R13/02 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10098 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49018 ,  Y10T29/49126

Abstract: A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.

Abstract translation: 一种用于将垂直印刷电路板与水平印刷电路板连接的方法和系统，其中当垂直印刷电路连接到垂直印刷电路时，接触装置被偏置在第一位置时不接触垂直印刷电路板并被偏置在第二位置 水平印刷电路板。

公开(公告)号：US20120300423A1

公开(公告)日：2012-11-29

申请号：US13116776

申请日：2011-05-26

Applicant: Gerald G. Advocate, JR. ,  Mitchell G. Ferrill ,  Michael J. Fisher ,  Matthew S. Kelly ,  Theron L. Lewis

Inventor： Gerald G. Advocate, JR. ,  Mitchell G. Ferrill ,  Michael J. Fisher ,  Matthew S. Kelly ,  Theron L. Lewis

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K3/303 ,  H05K3/3421 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/2009 ,  Y02P70/613 ,  Y10T29/49147

Abstract: An apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.

Abstract translation: 提供了一种装置，其包括基板，包括分立元件的连接器，每个分立元件具有连接到顺应性脊柱的第一端和包括引线和紧固件的相对的第二端，该第一端被一次性地延伸穿过基板并进入 连接器，紧固件和连接器被构造成使得由紧固件操作引起的机械干涉促使连接器朝向衬底，以使每个引线朝向公共平面中的相应焊接位置。

公开(公告)号：US20120250279A1

公开(公告)日：2012-10-04

申请号：US13308432

申请日：2011-11-30

Applicant: Masaru Harashima ,  Norihiro Ishii

Inventor： Masaru Harashima ,  Norihiro Ishii

IPC: H05K7/06

CPC classification number: G06F1/187 ,  H05K1/0271 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10159 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: According to one embodiment, a storage device includes a housing, a circuit board, and a module. The circuit board is located in the housing, and includes a first surface and a second surface located opposite the first surface. The module is provided on at least one of the first surface and the second surface of the circuit board. The circuit board is provided with a first notch and a connection portion to be connected to the housing at the periphery. The first notch is provided with a second notch extending toward an area between the connection portion and a module fixation area where the module is fixed on the circuit board.

Abstract translation: 根据一个实施例，存储设备包括壳体，电路板和模块。 电路板位于壳体中，并且包括第一表面和与第一表面相对的第二表面。 模块设置在电路板的第一表面和第二表面中的至少一个上。 电路板设置有第一凹口和连接部分，以在外围连接到壳体。 第一凹口设置有朝向连接部分和模块固定区域之间的区域延伸的第二凹口，其中模块固定在电路板上。

公开(公告)号：US08279607B2

公开(公告)日：2012-10-02

申请号：US12826779

申请日：2010-06-30

Applicant: Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung ,  Chung-Ken Cheng ,  Jui-Feng Wang

Inventor： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung ,  Chung-Ken Cheng ,  Jui-Feng Wang

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/09563 ,  H05K2201/10409 ,  H01L2924/00

Abstract: A cooling module assembly method includes forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, with the at least one heat-generating element aligned with and covering the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.

Abstract translation: 冷却模块组装方法包括在电路板上形成至少一个通孔; 将电路板耦合到散热单元，使得电路板的表面耦合到散热单元的耦合面; 用金属焊料填充至少一个通孔; 将至少一个发热元件固定到所述电路板的另一个表面，所述至少一个发热元件与所述至少一个通孔对齐并覆盖所述至少一个通孔; 以及通过熔化所述至少一个通孔中的所述金属焊料将所述至少一个发热元件和所述散热单元焊接在一起。