公开(公告)号：US5905304A

公开(公告)日：1999-05-18

申请号：US892750

申请日：1997-07-15

Applicant: Peter R. Ewer ,  Arthur Woodworth

Inventor： Peter R. Ewer ,  Arthur Woodworth

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L25/07 ,  H01L25/18 ,  H05K3/26 ,  H05K3/34 ,  H01L23/36

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01043 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/26 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A surface mount semiconductor package includes washing grooves disposed on a bottom surface of a plastic housing. The package also employs locking elements for locking the plastic housing to a metal pad on which a semiconductor device is mounted, where the locking elements include a cross bar between terminals, slots disposed on the metal pad which include barbs and dove-tail grooves disposed on the metal pad. The metal pad includes a waffled surface for improved coupling to a substrate. The package includes terminals having offset portions for providing spaces for the plastic housing material to fill for improved encapsulation of the terminals. The metal pad extends beyond the lateral edges of the plastic housing for improved heat dissipation and for providing a surface to couple to a heatsink.

Abstract translation: 表面安装半导体封装包括设置在塑料外壳的底表面上的洗涤槽。 封装还采用锁定元件，用于将塑料壳体锁定到其上安装有半导体器件的金属焊盘，其中锁定元件包括端子之间的横杆，设置在金属焊盘上的槽，其包括倒钩和设置在其上的鸠尾槽 金属垫。 金属焊盘包括用于改善与基板的耦合的波纹表面。 该包装包括具有偏移部分的端子，用于为塑料外壳材料提供空间以便填充以改善端子的封装。 金属垫延伸超过塑料外壳的侧边缘，以改善散热性，并提供与散热片相连的表面。

公开(公告)号：US5832598A

公开(公告)日：1998-11-10

申请号：US742919

申请日：1996-11-01

Applicant: Norman L. Greenman ,  Jorge M. Hernandez ,  M. P. Ramachandra Panicker

Inventor： Norman L. Greenman ,  Jorge M. Hernandez ,  M. P. Ramachandra Panicker

IPC: H01L23/12 ,  H01L23/02 ,  H01L23/04 ,  H01L23/10 ,  H01L23/15 ,  H01L23/552 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/10 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H05K1/0243 ,  H01L2223/6633 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19039 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K3/3431 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an �s! matrix close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.

Abstract translation: 公开了一种具有高性能特性的低成本微波电路封装。 封装在高达90 GHz的频率范围内工作，同时在印刷电路板上占用更少的空间。 空间节省由小组件和包装的无引导设计提供。 取代导线是球栅阵列和RF端口。 对于任何一对信号传输端口，在封装的工作频带内的[s]矩阵内，无限数量的布局设计是可能的。

公开(公告)号：US5727727A

公开(公告)日：1998-03-17

申请号：US853983

申请日：1997-05-09

Applicant: George J. Ead

Inventor： George J. Ead

IPC: B23K1/00 ,  H01L21/52 ,  H01L23/373 ,  H05K3/00 ,  H05K3/34 ,  B23K1/20

CPC classification number: H05K3/341 ,  H01L23/3735 ,  H01L24/743 ,  H05K3/3452 ,  H01L2224/48091 ,  H01L2224/743 ,  H01L2924/10158 ,  H01L2924/12042 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/042 ,  H05K3/0061 ,  H05K3/3431 ,  Y02P70/613 ,  Y10T428/12701

Abstract: The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap to reduce formation of voids.

Abstract translation: 本发明的特征在于使焊料在两个表面之间的间隙中流动的方法。 焊料供应被加热以使其在间隙中回流和流动。 焊料被引导作为间隙中的主流流动并且作为外围流从主流朝间隙的边缘流动以减少空隙的形成。

公开(公告)号：US5708566A

公开(公告)日：1998-01-13

申请号：US742110

申请日：1996-10-31

Applicant: Roy E. Hunninghaus ,  Kevin M. Andrews ,  Gary L. Christopher ,  David J. Anderson ,  Joseph P. Tomase

Inventor： Roy E. Hunninghaus ,  Kevin M. Andrews ,  Gary L. Christopher ,  David J. Anderson ,  Joseph P. Tomase

IPC: H01L25/10 ,  H01L25/18 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  H05K7/20

CPC classification number: H05K7/20509 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/42

Abstract: An electronic control module (10) includes a circuit substrate (12) containing a plurality of thermal vias (36) and a heat-generating electronic device (26) attached to the thermal vias (36). The circuit substrate (12) is attached to a mounting plate (18) by a plurality of electrically-isolated, thermal attachment pads (20) located at selected positions on an electrically insulating layer (16) overlying a metal baseplate (14). A solder layer (22) functions to both mechanically attach the plurality of thermal vias (36) to the plurality of thermal attachment pads (20), and to provide a thermal dissipation pathway for heat generated by the electronic devices (26). The heat is transferred from the circuit substrate (12) through the plurality of thermal attachment pads (20) to the metal baseplate (14).

Abstract translation: 一个电子控制模块（10）包括一个包含多个热通孔（36）的电路基板（12）和一个附着在热通孔（36）上的发热电子设备。 电路基板（12）通过位于覆盖在金属基板（14）上的电绝缘层（16）上的选定位置处的多个电隔离的热附接焊盘（20）附接到安装板（18）。 焊接层（22）用于将多个热通孔（36）机械地附接到多个热附接焊盘（20），并且为电子设备（26）产生的热量提供散热路径。 热量从电路基板（12）通过多个热连接焊盘（20）传送到金属基板（14）。

公开(公告)号：US5690270A

公开(公告)日：1997-11-25

申请号：US745782

申请日：1996-11-08

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin. The pin is sized for loosely fitting within the feedthrough and thus movement caused by a coefficient of thermal expansion mismatch between materials of the pad, pin, and printed circuit board is absorbed by movement of the pin within the feedthrough. As a result, stress relief is provided for the solder joints.

Abstract translation: 用于将表面贴装封装安装到印刷电路板上的装置和方法包括将引脚插入穿过印刷电路板馈通以提供销在馈通内的运动。 引脚的一端焊接到印刷电路板底部的导电表面，而引脚ID的另一端焊接到表面贴装封装焊盘。 封装以与印刷电路板顶表面间隔的关系安装。 使用高温焊料将引脚焊接到板导电表面，用于形成焊接接头，在使用诸如铅锡焊料类型的低温焊料的后续焊接期间保持固体。 然后使用低温铅锡焊料将引脚焊接到表面贴装封装的焊盘，以在焊盘和引脚之间形成焊接接头。 该销的尺寸适于松动地配合在馈通内，并且因此由焊盘，销和印刷电路板的材料之间的热膨胀失配系数引起的移动被引脚内的引脚的移动所吸收。 因此，为焊点提供了应力消除。

公开(公告)号：US5572175A

公开(公告)日：1996-11-05

申请号：US509332

申请日：1995-07-31

Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

Abstract: A dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting a signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Abstract translation: 电介质谐振元件包括至少一个电介质多级谐振器，其包括一个介质块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体， 导电体覆盖一个介质块的基本上整个的外表面，电介质多级谐振器在该介电块中构成多个介质谐振器; 以及固定地安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

公开(公告)号：US5469012A

公开(公告)日：1995-11-21

申请号：US374528

申请日：1995-02-01

Applicant: Yoshihisa Suzuki ,  Yuuichi Sugawara ,  Susumu Ishihara ,  Ikuo Katoh

Inventor： Yoshihisa Suzuki ,  Yuuichi Sugawara ,  Susumu Ishihara ,  Ikuo Katoh

IPC: H03H9/02 ,  H03H9/13 ,  H04R17/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H01L41/08

CPC classification number: H04R17/00 ,  H05K3/303 ,  H05K3/3442 ,  H05K1/141 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K2203/0465 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic elemental A1 has a lead electrode at the edge and a supporting member A2, positioned so that it faces the electronic element across a gap G. The supporting member A2 also has an external connecting terminal A5 at a location opposite the lead electrode A4. A resin layer A3 is positioned between electronic element A1 and supporting member A2, indented by the distance d from the edge of the electronic element A1. The resin layer bonds the electronic element (A1) and supporting member A2. The relationship of the distance d with G should satisfy this expression; d>G. A solder A6 fills the space created by the gap G between the lead electrode A4 and the external connecting terminal A5 over the distance d which is the distance from the edge of the electronic component A1, to the resin layer A3. The solder connects the lead electrode A4 and the external connecting terminal A5. No defective connection occurs between the lead electrode and the external connecting terminal when the electronic component is mounted on the printed board.

Abstract translation: PCT No.PCT / JP93 / 00923 Sec。 371日期：1995年2月1日 102（e）1995年2月1日PCT PCT 1993年7月5日PCT公布。 出版物WO94 / 05134 日期为1994年3月3日。电子元件A1在边缘处具有引线电极和支撑构件A2，定位成使其面对电子元件跨越间隙G.支撑构件A2还具有外部连接端子A5 位置与引线电极A4相对。 树脂层A3位于从电子元件A1的边缘延伸的距离d的电子元件A1和支撑构件A2之间。 树脂层与电子元件（A1）和支撑构件A2结合。 距离d与G的关系应满足该表达式; d> G。 焊料A6在从电子部件A1的边缘到树脂层A3的距离d之间填充由引线电极A4和外部连接端子A5之间的间隙G产生的空间。 焊料将引线电极A4和外部连接端子A5连接起来。 当电子部件安装在印刷电路板上时，引线电极和外部连接端子之间不会发生有缺陷的连接。

公开(公告)号：US5362679A

公开(公告)日：1994-11-08

申请号：US96416

申请日：1993-07-26

Applicant: Gene F. Wakefield

Inventor： Gene F. Wakefield

IPC: H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K3/34 ,  H01L21/60

CPC classification number: H01L23/315 ,  H01L23/4334 ,  H01L23/49551 ,  H05K3/3436 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/10969 ,  H05K3/3426 ,  Y02P70/613 ,  Y10T29/49121

Abstract: Solderable connections are formed in a grid array pattern on the surface of a plastic package by modifying conventional lead frame assemblies so that the outer ends of the leads terminate at the bottom surface of the package and forming solder pads or balls on the ends of the leads. Conventional lead frames are used and, after modification, are encapsulated using conventional plastic packaging techniques to form plastic packages with solderable terminal ends arranged in an interconnection array on one surface of the package.

Abstract translation: 可焊接的连接通过修改常规引线框架组件而以塑料封装的表面上的网格阵列图案形成，使得引线的外端终止于封装的底表面，并在引线的端部上形成焊盘或球 。 使用常规的引线框架，并且在修改之后，使用常规的塑料封装技术来封装，以形成具有可焊接终端的可塑封装，该封装的终端布置在封装的一个表面上的互连阵列中。

公开(公告)号：US5220724A

公开(公告)日：1993-06-22

申请号：US756490

申请日：1991-09-09

Applicant: Roland Gerstner

Inventor： Roland Gerstner

IPC: H05K1/18 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0469 ,  H05K3/321 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/181 ,  H05K2201/0129 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K2203/0108 ,  H05K2203/0338 ,  H05K2203/1105 ,  H05K3/1216 ,  H05K3/341 ,  H05K3/3484 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method for mounting Surface-Mounted-Devices ("SMD's") on a substrate, e.g. a PC board, involves warming an adhesive containing conductive particles from a room-temperature solid state to a warmed fluid state, applying said fluid adhesive to the substrate, permitting the adhesive to cool back into a solid state, subsequently warming the substrate and adhesive to render the adhesive tacky and yielding, mounting the components (2-5) in the tacky adhesive, and permitting the adhesive to cool back into a solid state, thereby securing the components on the substrate.

Abstract translation: 将表面安装器件（“SMD”）安装在基板上的方法，例如， PC板包括将含有导电颗粒的粘合剂从室温固态加热至加热的流体状态，将所述流体粘合剂施加到基底上，允许粘合剂冷却回固态，随后将基底和粘合剂加热至 使粘合剂发粘并产生，将组分（2-5）安装在粘性粘合剂中，并允许粘合剂冷却回固态，从而将组分固定在基材上。

公开(公告)号：US5173574A

公开(公告)日：1992-12-22

申请号：US720912

申请日：1991-06-25

Applicant: Heinz Kraus

Inventor： Heinz Kraus

IPC: H01L21/60 ,  H01L23/52 ,  H01L31/02 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H01L23/52 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/37011 ,  H01L2224/40225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K2201/10477 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A soldering connector and a method for manufacturing an electric circuit with this soldering connector. The soldering connector serves to bridge several contact surfaces. The soldering connector includes several soldering jumpers which include a common support and are of an electrically conductive material and are formed in a single piece with the support and are constructed in a cantilevering manner. Predetermined breaking points are provided between the support and the soldering jumpers, so that the common support can be severed after the soldering procedure by simply tearing it off from the soldering jumper.

Abstract translation: 焊接连接器和使用该焊接连接器制造电路的方法。 焊接连接器用于桥接几个接触表面。 焊接连接器包括几个焊接跳线，其包括公共支撑件并且是导电材料，并且与支撑件形成为单件并且以悬臂方式构造。 在支撑和焊接跳线之间提供了预定的断点，从而通过简单地从焊接跳线上撕下来，可以在焊接过程之后切断共同的支撑。