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    4.
    发明专利
    未知

    公开(公告)号：DE69031855D1

    公开(公告)日：1998-02-05

    申请号：DE69031855

    申请日：1990-07-27

    Applicant: IBM

    Inventor： ARBACH GARY V ,  O'TOOLE TERRENCE R ,  VIEHBECK ALFRED

    IPC: C23C18/16 ,  C23C18/31 ,  C25D5/02 ,  C25D5/54 ,  C08G73/10 ,  C25D7/00 ,  H01L21/48 ,  H01L23/12 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24

    Abstract: Structures and methods of fabrication thereof wherein the method selectively supplies electrons to a first electroactive material in the presence of a second electroactive material wherein the first and second electroactive materials have different redox potentials. The electrons are selectively supplied either by electrochemical means or by appropriately chosen reducing agents. A structure fabricated by these methods has a first electroactive body disposed on a second electroactive body wherein the first body has a pattern therein exposing at the base thereof the surface of the second electroactive material body. Electrons can be selectively supplied to the surface of the second electroactive material body which is exposed at the base of the pattern in the first electroactive material body. Upon exposing the structure to a seeding solution seed is selectively supplied to those regions to which electrons have been selectively supplied. Electrically conductive material can then be electrolessly deposited onto the seed material to form an electrically conductive pattern in the pattern in the first electroactive body. The electroactive material bodies are preferably polyimide materials. The structures can be used as the top metallization levels of an electronic device such as a semiconductor chip or a semiconductor chip packaging substrate.

    5.
    发明专利
    未知

    公开(公告)号：DE69015878D1

    公开(公告)日：1995-02-23

    申请号：DE69015878

    申请日：1990-03-21

    Applicant: IBM

    Inventor： BREGMAN MARK FIELDING ,  BUCHWALTER STEPHEN LESLIE ,  HERMANN KARL ,  KOVAC CAROLINE ANN ,  POORE PAIGE ADAMS ,  VIEHBECK ALFRED

    IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/00

    Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

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