公开(公告)号：HUT76992A

公开(公告)日：1998-01-28

申请号：HU9701699

申请日：1995-09-20

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ANTHONY ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  MURHPY PHILIP ,  WALKER GEORGE FREDERICK

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59

Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

公开(公告)号：ZA957085B

公开(公告)日：1996-03-11

申请号：ZA957085

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK ,  COFINO THOMAS ANTHONY ,  JOHNSON GLEN WALDEN ,  MURPHY PHILIP

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59 ,  H05K

Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

公开(公告)号：ZA9507085B

公开(公告)日：1996-03-11

申请号：ZA9507085

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK ,  COFINO THOMAS ANTHONY ,  JOHNSON GLEN WALDEN ,  MURPHY PHILIP

IPC: H01L21/60 ,  G06K7/08 ,  G06K19/067 ,  H01L25/04 ,  H01L25/18 ,  H04B1/59 ,  H05K

CPC classification number: H01L24/85 ,  G06K7/086 ,  G06K19/067 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01Q1/2225 ,  H01Q7/00 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：DE3787772D1

公开(公告)日：1993-11-18

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：DE2754923A1

公开(公告)日：1978-07-06

申请号：DE2754923

申请日：1977-12-09

Applicant: IBM

Inventor： COMERFORD LIAM DAVID ,  CROW JOHN DAIVD ,  LAFF ROBERT ALLAN ,  LEAN ERIC GUNG-HWA ,  BRADY MICHAEL JOHN

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/42 ,  H01L27/15 ,  H01L33/00 ,  H01S5/00 ,  H01S5/022 ,  H01S5/042 ,  H01S5/40 ,  H01S3/00

Abstract: An optical assembly structure wherein miniature optical components such as lasers, modulators, lenses, thin-film and fiber-optic waveguides, and photodetectors are critically aligned and supported for coactive operation by means of two or more wafers which are formed with complementary grooves and mortises to support the loose optical components such as lenses and fiber-optic waveguides and to receive alignment rails to insure the relativity of the wafers, which also have formed integral therewith optical elements such as waveguides, modulators, and lasers, to produce an integrated optical assembly somewhat in the manner of an "optical bench," wherein the bench structure also provides an active optical element.

公开(公告)号：MY134716A

公开(公告)日：2007-12-31

申请号：MYPI9300721

申请日：1993-04-21

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  RIELEY SHELDON COLE ,  WALKER GEORGE FREDERICK ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT ,  MIKALSEN DONALD JOSEPH ,  MOSKOWITZ PAUL ANDREW ,  O'SULLIVAN EUGENE JOHN ,  O'TOOLE TERRENCE ROBERT ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/60 ,  H01L23/485 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1)

公开(公告)号：DE69324959D1

公开(公告)日：1999-06-24

申请号：DE69324959

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：HUT76996A

公开(公告)日：1998-01-28

申请号：HU9700407

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COTEUS PAUL WILLIAM ,  MOSKOWITZ PAUL ANDREW

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

公开(公告)号：SG33351A1

公开(公告)日：1996-10-18

申请号：SG1995000334

申请日：1995-04-26

Applicant: IBM

Inventor： WALKER GEORGE FREDERICK ,  JOHNSON GLEN WALDEN ,  HEINRICH HARLEY KENT ,  BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COFINO THOMAS

IPC: H01Q23/00

公开(公告)号：DE3787772T2

公开(公告)日：1994-05-05

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48