公开(公告)号：DE10032369A1

公开(公告)日：2002-02-07

申请号：DE10032369

申请日：2000-07-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOTTSWINTER CHRISTIAN ,  NEUHOFF OSKAR ,  STADLER BERND

IPC: H05K9/00 ,  H05K5/03

Abstract: A cover or shield device for ceramic modules with electronic components is supported on the components-equipped surface (4) of the substrate (1) by a spacer-retainer and the cover or shield device (3) has snap fit elements (14) on at least two opposite facing side edge faces (110 of the cover device, which grip friction- and shape-fit into the snap-fit elements of corresponding lateral recesses (16).

公开(公告)号：DE102007008518A1

公开(公告)日：2008-08-28

申请号：DE102007008518

申请日：2007-02-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  STADLER BERND

IPC: B81B7/02 ,  B81C3/00

Abstract: The module (100) has a carrier (13) and a semiconductor chip (10) attached to the carrier. The semiconductor chip has a movable unit (11) e.g. acceleration sensor, and an active main surface (14) of the chip is turned towards the carrier. Another semiconductor chip (12) is attached at the chip (10), where a cavity (15) is formed between the chips. Another cavity (16) is formed between the chip (10) and the carrier. A diaphragm is arranged in an area of the active main surface of the chip (10), and a microphone is integrated into the chip (10). An independent claim is also included for a method for manufacturing a semiconductor module.

公开(公告)号：DE50211166D1

公开(公告)日：2007-12-20

申请号：DE50211166

申请日：2002-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PETZ MARTIN ,  STADLER BERND ,  PAULUS STEFAN ,  SCHROEDER MARTIN ,  LOSEHAND REINHARD ,  SCHAFFER JOSEF-PAUL

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H04N5/225

Abstract: A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.

公开(公告)号：DE102005008600A1

公开(公告)日：2006-08-31

申请号：DE102005008600

申请日：2005-02-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  STADLER BERND ,  DANGELMAIER JOCHEN ,  GUENGERICH VOLKER

IPC: H01L23/12 ,  H01L21/50 ,  H01L23/36

Abstract: A chip carrier (1) comprises two opposing surfaces (2, 3); and two recesses (4, 5) provided in the respective surface, where the chip carrier is configured to provide a heat sink for semiconductor chips arranged on the chip carrier, and the recesses are dimensioned to receive two semiconductor chips (10, 10'). Independent claims are also included for: (1) a system comprising a chip carrier and two semiconductor chips supported by the chip carrier, the chip carrier comprising two opposing surfaces, and two recesses in the respective surface, where the semiconductor chips are received within the respective recess, and the chip carrier is configured to provide a heat sink for the semiconductor chips supported by the chip carrier; and (2) a method for producing a chip carrier to support semiconductor chips, comprising forming a first recess in a first surface of the chip carrier; and forming a second recess in a second surface of the chip carrier, the second surface opposing the first surface, where the recesses are configured to receive the semiconductor chips in the respective recesses, and the chip carrier is configured to provide a heat sink for the semiconductor chips.

公开(公告)号：DE59905674D1

公开(公告)日：2003-06-26

申请号：DE59905674

申请日：1999-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINTERER JUERGEN ,  STADLER BERND

IPC: H05K13/04

Abstract: A handling and mounting protection device is described that has a cap-shaped configuration with a covering layer which covers a contact-sensitive upper side of a component which is to be protected. Extending from the covering layer are locking arms with locking hooks which, in the state in which they are fitted onto the component, engage behind undercuts in the component in such a way that even after the component has been mounted they can still be released from it.

公开(公告)号：DE10146854A1

公开(公告)日：2003-04-30

申请号：DE10146854

申请日：2001-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  THEUS HORST ,  STADLER BERND

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/31 ,  H01L23/552 ,  H01L21/60 ,  H01L21/50

Abstract: The electronic component (2) comprises the semiconductor chip (4) on a metal substrate (6), and a housing (12). There is also a screen (124) against HF electromagnetic radiation, as an integral part of the housing, forming at least one part of the housing wall (122).The screen may comprise a metal, or a non-conductor, or non-conductor with metal plating. The metal substrate may contain a wiring structure (8) round the semiconductor chip(s), whose contact faces (43) are conductively coupled by bonding wires (10) to contact pads (81) of wiring structure. Independent claims are included for mfg. method of the electronic component.

公开(公告)号：DE10109787A1

公开(公告)日：2002-10-02

申请号：DE10109787

申请日：2001-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PETZ MARTIN ,  STADLER BERND ,  PAULUS STEFAN ,  SCHROEDER MARTIN ,  LOSEHAND REINHARD ,  SCHAFFER JOSEF-PAUL

IPC: H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  G03B17/00 ,  G03B19/00 ,  H04N1/00

Abstract: A digital camera has a lens, a camera housing, and a semiconductor sensor. The camera housing is primarily formed of a transparent plastic block that encloses a semiconductor sensor only on its underside and has an adapted lens on its top side. Between the two there is provided an opaque layer with an aperture that improves the image quality. The invention also relates to a method for producing such a digital camera.

公开(公告)号：DE102017205748A1

公开(公告)日：2017-10-05

申请号：DE102017205748

申请日：2017-04-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  MAIER DOMINIC ,  LODERMEYER JOHANNES ,  STADLER BERND

IPC: B81B7/02 ,  B81C1/00 ,  H01L23/04 ,  H01L25/16 ,  H04R19/04

Abstract: Ein Halbleiterbauelement enthält einen MEMS(Microelectromechanical System)-Die, einen Deckel und einen integrierten Schaltungs-Die. Der Deckel befindet sich über dem MEMS-Die und definiert einen Hohlraum zwischen dem Deckel und dem MEMS-Die. Der integrierte Schaltungs-Die ist an einer Innenseite des Deckels angebracht. Der integrierte Schaltungs-Die ist elektrisch an den MEMS-Die gekoppelt.

公开(公告)号：DE102014111420A1

公开(公告)日：2015-02-12

申请号：DE102014111420

申请日：2014-08-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WACHTER ULRICH ,  HUBER VERONIKA ,  KILGER THOMAS ,  OTREMBA RALF ,  STADLER BERND ,  MAIER DOMINIC ,  SCHIESS KLAUS ,  SCHLOEGL ANDREAS ,  WAHL UWE

IPC: H01L21/50 ,  H01L21/283 ,  H01L21/768 ,  H01L23/28 ,  H01L23/36 ,  H01L23/485 ,  H01L33/48

Abstract: Ein Halbleitergehäuse wird durch Bereitstellen eines Halbleiter-Nacktchips mit einem Anschluss an einer ersten Seite des Nacktchips, einem Bereitstellen eines Materials, das mit dem Nacktchip an einer gegenüberliegenden zweiten Seite des Nacktchips verbunden ist und einem solchen Einbetten des Nacktchips in eine Formmasse hergestellt, so dass der Nacktchip an allen Seiten, mit Ausnahme der ersten Seite, von der Formmasse bedeckt ist. Die Formmasse wird an einer Seite der Formmasse, benachbart zu der zweiten Seite des Nacktchips, gedünnt, um das Material an der zweiten Seite des Nacktchips freizulegen, ohne dabei die zweite Seite des Nacktchips freizulegen. Eine elektrische Verbindung wird mit dem Anschluss an der ersten Seite des Nacktchips ausgebildet. Im Fall eines Transistor-Nacktchips kann der Anschluss ein Source-Anschluss sein, und der Transistor-Nacktchip kann mit der Source nach unten an einem Metallblock wie einem Diepaddle eines Leiterrahmens angebracht sein.

公开(公告)号：DE102008007682A1

公开(公告)日：2008-12-11

申请号：DE102008007682

申请日：2008-02-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  DANGELMAIER JOCHEN ,  KRAUSE JENS ,  AUBURGER ALBERT ,  STADLER BERND

IPC: H04R19/04 ,  B81B3/00 ,  B81B7/02 ,  B81C3/00 ,  H04R1/04 ,  H04R31/00

Abstract: A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.