스퍼터링 장치
    22.
    发明公开
    스퍼터링 장치 有权
    溅射装置

    公开(公告)号:KR1020110066502A

    公开(公告)日:2011-06-17

    申请号:KR1020090123185

    申请日:2009-12-11

    Abstract: PURPOSE: A sputtering apparatus is provided to uniformly and stably deposit metallic catalysts with extremely low density in amorphous silicon by positioning a magnetic assembly only in an area where a free-sputtering process is performed. CONSTITUTION: A sputtering apparatus comprises a process chamber(110), a metal target(120), a target transfer unit(130), a substrate holder(140), and a magnetic assembly. The process chamber comprises first and second areas. The metal target is located inside the process chamber. The target transfer unit moves the metal target from the first area to the second area. The substrate holder is located at the second area to face with the metal target. The magnetic assembly is located between the target transfer unit in the first area and the process chamber.

    Abstract translation: 目的:提供一种溅射装置,通过仅在进行自由溅射处理的区域中定位磁性组件,在非晶硅中均匀且稳定地沉积极低密度的金属催化剂。 构成:溅射装置包括处理室(110),金属靶(120),靶转印单元(130),基底保持器(140)和磁性组件。 处理室包括第一和第二区域。 金属靶位于处理室内。 目标传送单元将金属目标从第一区域移动到第二区域。 衬底保持器位于第二区域以与金属靶相对。 磁性组件位于第一区域中的目标转移单元和处理室之间。

    금속 포집기 및 이를 구비하는 원자층 증착 장치
    24.
    发明公开
    금속 포집기 및 이를 구비하는 원자층 증착 장치 无效
    具有金属接合装置和原子层沉积装置

    公开(公告)号:KR1020110019965A

    公开(公告)日:2011-03-02

    申请号:KR1020090077605

    申请日:2009-08-21

    CPC classification number: B01D8/00 C23C16/4412 C23C16/45544 Y02C20/30

    Abstract: PURPOSE: A metal intercepting device and an atomic layer deposition device with the same are provided to discharge a discharging gas discharged from a processing chamber to the outside without a scrubber, thereby saving costs for installing the scrubber. CONSTITUTION: An intercepting chamber(310) provides an intercepting space. An intercepting plate(320) is located on one side of the intercepting chamber. The intercepting plate includes a body attached or detached to or from the intercepting chamber and an intercepting finger(324) inserted into the intercepting chamber. A coolant source(330) supplies a coolant. An attaching/detaching unit attaches/detaches the intercepting chamber to/from the intercepting plate.

    Abstract translation: 目的:提供一种金属截留装置及其原子层沉积装置,以便将没有洗涤器的处理室排出的排放气体排出到外部,从而节省安装洗涤器的成本。 构成:拦截室(310)提供拦截空间。 拦截板(320)位于拦截室的一侧。 拦截板包括与拦截室连接或分离的主体以及插入拦截室的拦截手指(324)。 冷却剂源(330)供应冷却剂。 安装/拆卸单元将拦截室与拦截板相连/分离。

    원자층 증착 장비 및 이를 이용한 원자층 증착 방법
    27.
    发明公开
    원자층 증착 장비 및 이를 이용한 원자층 증착 방법 有权
    原子层沉积装置和使用其的原子层的制造方法

    公开(公告)号:KR1020100099917A

    公开(公告)日:2010-09-15

    申请号:KR1020090018490

    申请日:2009-03-04

    CPC classification number: C23C16/45544 C23C16/042 C30B25/165 C30B35/00

    Abstract: PURPOSE: An atomic layer deposition device and method for cooling a mask assembly are provided to effectively heat a substrate through a heating element of a substrate holder while preventing the thermal deformation of a mask assembly. CONSTITUTION: An atomic layer deposition device comprises a chamber(100), a vacuum pump(130), a gas supply unit(140), a substrate holder(110), a mask assembly, and a cooling source(150). The vacuum pump controls the internal pressure of the chamber. The gas supply unit supplies reaction gas into the chamber. The substrate holder is embedded with a heating element and located between the vacuum pump and the gas supply unit. The mask assembly with an internal cooling passage is located between the substrate holder and the gas supply unit. The cooling source supplies coolant to the cooling passage of the mask assembly.

    Abstract translation: 目的:提供用于冷却掩模组件的原子层沉积装置和方法,以有效地加热衬底通过衬底保持器的加热元件,同时防止掩模组件的热变形。 构成:原子层沉积装置包括腔室(100),真空泵(130),气体供应单元(140),衬底保持器(110),掩模组件和冷却源(150)。 真空泵控制室的内部压力。 气体供应单元将反应气体供应到室中。 衬底保持器嵌有加热元件,并位于真空泵和气体供应单元之间。 具有内部冷却通道的面罩组件位于衬底保持器和气体供应单元之间。 冷却源将冷却剂供应到面罩组件的冷却通道。

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