公开(公告)号：DE102005061248B4

公开(公告)日：2007-09-20

申请号：DE102005061248

申请日：2005-12-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  WOMBACHER RALF ,  LACHMANN DIETER ,  BETZ BERND ,  PAULUS STEFAN ,  RIEDL EDMUND

IPC: H01L23/16 ,  C09D5/25 ,  C23C16/453 ,  H01L21/50 ,  H01L23/08

Abstract: A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.

公开(公告)号：DE102006012780B3

公开(公告)日：2007-06-06

申请号：DE102006012780

申请日：2006-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WIETSCHORKE HELMUT ,  PAULUS STEFAN ,  THEUSS HORST ,  AUBURGER ALBERT ,  GHAHREMANI CYRUS ,  SCHMITT JEAN ,  DANGELMAIER JOCHEN ,  LICHTENEGGER THOMAS

IPC: H01L31/12 ,  G02B6/42 ,  H01L31/0232

Abstract: An optical coupler for interconverting optical and electrical signals comprises a housing (4) with plug connection (5) to a light conductor (6) and a mountable external contact (8) on a conductive film (9). An optical semiconductor chip (12) and an application-specific integrated circuit chip (13) lie on the optical axis (10) and the conductive film has a curved region (14) between the mounting position and external contact that is completely embedded in the housing material so that only the underside contact (25) is accessible. Independent claims are also included for the following: (A) A mobile phone; (B) A digital camera;and (C) A camcorder comprising the above.

公开(公告)号：DE102004047659A1

公开(公告)日：2006-04-13

申请号：DE102004047659

申请日：2004-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DANGELMAIER JOCHEN ,  GUENGERICH VOLKER ,  PAULUS STEFAN

IPC: H01L23/15 ,  C23C14/14 ,  C23C16/06 ,  C25D7/00 ,  H01L23/488

公开(公告)号：DE10252556B3

公开(公告)日：2004-05-19

申请号：DE10252556

申请日：2002-11-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILGER THOMAS ,  PAULUS STEFAN

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L21/60 ,  H01L23/50

Abstract: Production of an electronic component having external contact elements (1) comprises preparing a metal plate having several component positions, forming recesses in one upper side of the plate, applying a mask on the upper side of the plate to expose openings in the region of the recesses, chemically or galvanically depositing a core material (7) in the recesses and in the openings to form a metallic bulge (8) on the edges of the openings in the mask, applying a metallic material on the bulge, removing the mask, arranging chips on the component positions, electrically connecting contact surfaces of the chips with the bulge, coating the metal plate with a plastic housing (9) forming a composite body, removing the metal plate, and dividing the composite body into individual electronic components. An Independent claim is also included for an electronic component produced by the above method.

公开(公告)号：DE10144464A1

公开(公告)日：2003-04-10

申请号：DE10144464

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  STADLER BERND

IPC: H01F17/00 ,  H01F27/29 ,  H01L27/08

Abstract: Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electronic component comprises an induction coil (2); and a flat plastic housing (3) having an upper side (4) and a lower side (5). The coil is arranged on the upper side. The lower side has external contact surfaces (6) for a flat assembly. Electrically connecting through-contacts (7) are arranged through the housing between electrodes (8, 9) of the coil on the upper side and the external contacts on the lower side. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The through-contacts have galvanically deposited metallic columns which are surrounded by a plastic housing composition (11) on the casing surfaces (12) of the columns. The through-contacts are made from nickel, gold, silver, aluminum or their alloys. The plastic housing is applied using an injection molding process.

公开(公告)号：DE10138659A1

公开(公告)日：2003-03-06

申请号：DE10138659

申请日：2001-08-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHER JUERGEN ,  PUESCHNER FRANK ,  STAMPKA PETER ,  PAULUS STEFAN

IPC: G06K19/077 ,  H01L21/48 ,  H01L23/31 ,  H01Q1/22 ,  H01L21/60 ,  H01L25/065 ,  H01Q23/00

Abstract: With this method a track structure (2) is by etching on the upper surface of a metal plate or depositing on a motherboard (6). A semiconductor chip (1) is then attached to the track structure and connected to it by the contact surfaces (3) provided on the tracks, e.g. by bond wiring or flip chip assembly. After encapsulation (5) the rear surface of the motherboard is removed down to the track structure. The track structure already include any required antenna structure.

公开(公告)号：DE10134979A1

公开(公告)日：2002-10-17

申请号：DE10134979

申请日：2001-07-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/60

Abstract: Semiconductor component (2) having active front side (21) with semiconductor structures and contact connections and a passive/active rear side (22) with/without semiconductor structures. The semiconductor component lies with its passive/active rear side on a supporting base (14) of an electrically conducting wiring structure (30). The contact connections are electrically connected to contact surfaces of the wiring structure. The electronic component has a housing (10) from which external contacts (8) of the wiring structure lead electrically contact the component. An Independent claim is also included for a process for the production of an electronic component.

公开(公告)号：DE10047135A1

公开(公告)日：2002-04-25

申请号：DE10047135

申请日：2000-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  HAINZ OSWALD ,  LANG DIETMAR ,  PETZ MARTIN ,  WEBER MICHAEL

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/50 ,  H01L21/58 ,  H01L21/60

Abstract: Production of a component comprises preparing an integrated circuit (1) having an active main side (5) with contact pads (11) connected to electrically conducting humps (2); applying the circuit onto a substrate, the main side of the circuit facing the substrate; enclosing the circuit using a cast mass (3); and removing parts of the substrate from the circuit. Preferred Features: The step of applying the circuit to the substrate comprises connecting the humps to the substrate by thermal compressing or alloying. The substrate is removed by etching, delaminating, grinding or sawing.

公开(公告)号：DE10038163A1

公开(公告)日：2002-02-14

申请号：DE10038163

申请日：2000-08-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEHNER RUDOLF ,  PAULUS STEFAN

IPC: B65B9/04 ,  B65B15/04 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H05K13/00

Abstract: The invention relates to a device and a method for the placement of electronic components (4) on transport belts, whereby a mould support (1) comprises at least one recess (2), over which a planar plastic web (5) is arranged. A heater (6, 7) heats the mould support (1) and/or the plastic web (5) in the region of the recesses (2). A stamping tool (8), comprising the electronic component (4) in the stamping region (9) thereof, is stamped, with the electronic component (4) in the direction of the recess (2) of the mould support (1), into the plastic web (5) to form a belt pocket (3).

公开(公告)号：DE102010000539B4

公开(公告)日：2014-06-05

申请号：DE102010000539

申请日：2010-02-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  PAULUS STEFAN ,  SEE BENG KEH ,  WIETSCHORKE HELMUT

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L25/16

Abstract: Halbleiteranordnung (100'), aufweisend: • ein Metallsubstrat (52) mit einer Chipkontaktstelle (61) und einer Drahtbond-Kontaktstelle (72); • einen an der Chipkontaktstelle (61) des Metallsubstrats (52) angebrachten Leistungshalbleiterchip (95a); und • einen den Leistungshalbleiterchip (95a) und das Metallsubstrat (52) einkapselnden Einkapselungskörper (106); wobei eine planare äußere Oberfläche (97', 99') der Halbleiteranordnung (100') einen exponierten Peripherierand (61', 72', 107, 109) der Chipkontaktstelle (61), der Drahtbond-Kontaktstelle (72), des Leistungshalbleiterchips (95a) und des Einkapselungskörpers (106) aufweist, und wobei der Leistungshalbleiterchip (95a) an einer ersten Seite des Leistungshalbleiterchips (95a) an der Chipkontaktstelle (61) des Metallsubstrats (52) angebracht ist und eine zweite Seite des Leistungshalbleiterchips (95a) mit einem Bonddraht mit der Drahtbond-Kontaktstelle (72) des Metallsubstrats (52) elektrisch verbunden ist.