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    Device and method for cooling electronic components and for supplying power to the electronic components
    41.
    发明专利
    Device and method for cooling electronic components and for supplying power to the electronic components 未知

    公开(公告)号：GB2512378A

    公开(公告)日：2014-10-01

    申请号：GB201305730

    申请日：2013-03-28

    Applicant: IBM

    Inventor： DOERING ANDREAS ,  LUIJTEN RONALD PETER ,  MICHEL BRUNO ,  PAREDES STEPHEN

    IPC: G06F1/18 ,  G06F1/20 ,  H01R12/70

    Abstract: A computer module for cooling electronic components of a printed circuit board (PCB) module and for supplying power to those components is suggested. The computer module 200 comprises a PCB module 101 with electronic components 102 attached, and a cooling module 103 connected thereto, the cooling module being arranged in parallel to the printed circuit board and having a first layer 202 which is both thermally and electrically conductive. The first layer is arranged such that heat can be dissipated from the printed circuit board module and power from a power source can be supplied to the electronic components. This allows improved dissipation of heat along with a power supply. The cooling module may include additional layers 203 to provide further heat dissipation and a ground connection, and the cooling module may be connected 303 to a heat sink 301, 302 to remove the dissipated heat. A modular computer system is disclosed which comprises a plurality of these modules.

    Concentrating solar photovoltaic-thermal hybrid systems
    43.
    发明专利
    Concentrating solar photovoltaic-thermal hybrid systems 未知

    公开(公告)号：GB2500706A

    公开(公告)日：2013-10-02

    申请号：GB201205736

    申请日：2012-03-30

    Applicant: IBM ,  EGYPT NANOTECHNOLOGY CT EGNC

    Inventor： MICHEL BRUNO ,  PAREDES STEPHAN ,  ESCHER WERNER ,  GHANNAM RAMI

    IPC: H01L31/058 ,  F24S10/50 ,  F24S10/55 ,  F24S20/20 ,  F24S23/70

    Abstract: The system 10 comprises: a hybrid solar receiver 20, having a photovoltaic module 21, operatively coupled to the system to deliver an electrical output power Po for a power user; and a thermal collector 22. The photovoltaic module and/or the thermal collector are movably mounted in the system. Thermal storage 42 is thermally connected to the thermal collector to store heat collected at the thermal collector and positioning unit 30 is adapted to move the photovoltaic module and/or the thermal collector. The positioning unit moves the photovoltaic module and/or the thermal collector to change a ratio of an intensity of radiation received at the photovoltaic module to an intensity of radiation received at the thermal collector. The system matches electrical power to demand and efficiency is increased by storing surplus energy thermally rather than electrically using a battery. The system further comprises a parabolic concentrating solar reflector.

    In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen
    44.
    发明专利
    In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen 未知

    公开(公告)号：DE112011102966T5

    公开(公告)日：2013-06-27

    申请号：DE112011102966

    申请日：2011-10-21

    Applicant: IBM

    Inventor： BAROWSKI HARRY ,  HARRER HUBERT ,  SUPPER JOCHEN ,  MICHEL BRUNO ,  HUBER ANDREAS ,  NIGGEMEIER TIM ,  BRUNSCHWILER THOMAS ,  PAREDES STEPHAN

    IPC: H01L25/18

    Abstract: Es wird ein Mechanismus zur integrierten Stromversorgung und Stromverteilung über einen Kühlkörper bereitgestellt. Der Mechanismus weist eine Prozessorschicht auf, die über eine erste Menge von Verbindungseinheiten mit einer Signalisierungs- und Eingabe/Ausgabe-Schicht (E/A-Schicht) verbunden ist, sowie einen Kühlkörper, der über eine zweite Menge von Verbindungseinheiten mit der Prozessorschicht verbunden ist. Bei dem Mechanismus weist der Kühlkörper eine Vielzahl von Nuten auf, wobei jede Nut entweder einen Pfad für Strom oder einen Pfad für Masse bereitstellt, die der Prozessorschicht zugeführt werden sollen. Bei dem Mechanismus ist der Kühlkörper nur zur Zufuhr von Strom vorgesehen und stellt den Elementen des Mechanismus keine Datenaustauschsignale bereit, und die Signalisierungs- und E/A-Schicht ist nur zum Übertragen der Datenaustauschsignale an die Prozessorschicht und zum Empfangen der Datenaustauschsignale von der Prozessorschicht vorgesehen und stellt den Elementen der Prozessorschicht keinen Strom bereit.

    46.
    发明专利
    未知

    公开(公告)号：AT451717T

    公开(公告)日：2009-12-15

    申请号：AT04744316

    申请日：2004-08-23

    Applicant: IBM

    Inventor： BIETSCH ALEXANDER ,  MICHEL BRUNO

    IPC: H01L21/768 ,  G03F7/00 ,  H01L21/027

    Abstract: A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substrate on which the structure is to be formed and complementary recesses in the patterning of the stamp.

    47.
    发明专利
    未知

    公开(公告)号：AT396048T

    公开(公告)日：2008-06-15

    申请号：AT04292954

    申请日：2004-12-10

    Applicant: ESSILOR INT ,  IBM

    Inventor： SCHMID HEINZ ,  MICHEL BRUNO ,  KLOTER URS ,  KELLER GERHARD ,  CANO JEAN-PAUL

    IPC: B41F17/00 ,  B29C33/30 ,  B29C33/42 ,  B29C39/02 ,  B29C39/10 ,  B41F17/30

    Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

    METHOD AND DEVICE FOR FLOWING A LIQUID ON A SURFACE
    49.
    发明专利
    METHOD AND DEVICE FOR FLOWING A LIQUID ON A SURFACE 未知

    公开(公告)号：AU2003283627A1

    公开(公告)日：2004-06-23

    申请号：AU2003283627

    申请日：2003-11-13

    Applicant: IBM

    Inventor： DELAMARCHE EMMANUEL ,  JUNCKER DAVID ,  MICHEL BRUNO ,  SCHMID HEINZ

    IPC: B01J19/00 ,  B01L3/00 ,  B01L3/02 ,  B05C5/02 ,  C40B60/14

    Abstract: A device for flowing a liquid on a surface comprises: a flow path. A first port supplies the liquid to one end of the flow path and applies a first port pressure for retaining the liquid when the flow path is remote from the surface. A second port receives the liquid from the other end of the flow path and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to promote flow of the liquid from the first port to the second port via the flow path in response to the flow path being located proximal to the surface and the liquid in the device contacting the surface. The first and second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.

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