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    Planar cavity MEMS and related structures, methods of manufacture and design structures
    52.
    发明专利
    Planar cavity MEMS and related structures, methods of manufacture and design structures 未知

    公开(公告)号：GB2494359B

    公开(公告)日：2015-01-14

    申请号：GB201300085

    申请日：2011-06-08

    Applicant: IBM

    Inventor： HERRIN RUSSELL T ,  JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K ,  WHITE ERIC J

    IPC: B81C1/00 ,  H01H57/00

    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

    Hermetically sealed MEMS Switch
    54.
    发明专利
    Hermetically sealed MEMS Switch 未知

    公开(公告)号：GB2506770A

    公开(公告)日：2014-04-09

    申请号：GB201321363

    申请日：2010-08-12

    Applicant: IBM ,  RF MICRO DEVICES INC

    Inventor： ANDERSON FELIX P ,  MCDEVITT THOMAS LEDDY ,  STAMPER ANTHONY K ,  COSTA JULIO CARLOS ,  HAMMOND JONATHAN HALE

    IPC: B81B3/00 ,  B81C3/00 ,  H01H1/00

    Abstract: A MEMS structure, comprising a lower forcing electrode and a lower contact electrode, remote from the lower forcing electrode; a cantilever beam 34 is positioned above the lower forcing electrode and the lower contact electrode; a capping layer 42 hermetically seals the lower forcing electrode, the lower contact electrode and the cantilever beam 34, the capping layer 42 having a sealed portion 40 positioned on a side of the lower contact electrode, remote from the lower forcing electrode and an end portion of the cantilever beam 34. Wherein the cantilever beam 34 may be devoid of stresses from material variability of a sealing material used to seal the capping layer 42.

    Micro-electro-mechanical system (MEMS) and related actuator bumps method of manufacture and design structures
    55.
    发明专利
    Micro-electro-mechanical system (MEMS) and related actuator bumps method of manufacture and design structures 未知

    公开(公告)号：GB2505600A

    公开(公告)日：2014-03-05

    申请号：GB201321798

    申请日：2012-03-14

    Applicant: IBM

    Inventor： JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K

    IPC: H01H1/00 ,  B81B3/00 ,  B81C1/00

    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes (115) and a contact point on a substrate. The method further includes forming a MEMS beam (100) over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes (105') in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

    MEMS structures having reduced snap down
    56.
    发明专利
    MEMS structures having reduced snap down 未知

    公开(公告)号：GB2498264A

    公开(公告)日：2013-07-10

    申请号：GB201300017

    申请日：2013-01-02

    Applicant: IBM

    Inventor： JAHNES CHRISTOPHER VINCENT ,  STAMPER ANTHONY K

    IPC: B81B3/00 ,  H01G5/18

    Abstract: A MEMS cantilever has a first wide portion attached to a support and a second narrower portion attached to the first portion. Tapered cantilever portions and beam structures having narrow and tapered portions are also described (figure 10). The reduction in width of the beam or cantilever in the vicinity of the pull-in portion reduces the occurrence of snap down when the structure is used as a varactor. The MEMS beam and cantilever structures may also be used for RF devices, contact switches or bulk acoustic wave resonators.

    Schaltbare Filter und Entwurfsstrukturen
    57.
    发明专利
    Schaltbare Filter und Entwurfsstrukturen 未知

    公开(公告)号：DE102012223979A1

    公开(公告)日：2013-07-04

    申请号：DE102012223979

    申请日：2012-12-20

    Applicant: IBM

    Inventor： ADKISSON JAMES W ,  CANDRA PANGLIJEN ,  DUNBAR THOMAS J ,  GAMBINO JEFFREY P ,  JAFFE MARK D ,  STAMPER ANTHONY K ,  WOLF RANDY L

    IPC: B81B7/02 ,  B81C1/00 ,  H01L41/04 ,  H03H9/25

    Abstract: Hierin werden schaltbare und/oder abstimmbare Filter, Herstellungsverfahren und Entwurfsstrukturen offenbart. Das Verfahren zum Bilden der Filter schließt das Bilden mindestens einer piezoelektrischen Filterstruktur ein, die eine Vielzahl von Elektroden aufweist, die auf einem piezoelektrischen Substrat gebildet sind. Das Verfahren schließt außerdem das Bilden einer mikro-elektromechanischen Struktur (MEMS) ein, die einen MEMS-Balken aufweist, der über dem piezoelektrischen Substrat und an einer Stelle angeordnet ist, an welcher der MEMS-Balken bei Betätigung die piezoelektrische Filterstruktur kurzschließt, indem er mit mindestens einer der Vielzahl von Elektroden in Kontakt kommt.

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