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    Conductive circuit structure having an electrically conductive surface fixed by collar walls
    53.
    发明授权
    Conductive circuit structure having an electrically conductive surface fixed by collar walls 失效
    导电电路结构，其具有由套环壁固定的导电表面

    公开(公告)号：US06490169B1

    公开(公告)日：2002-12-03

    申请号：US09717402

    申请日：2000-11-22

    Applicant: Hiroshi Watanabe

    Inventor： Hiroshi Watanabe

    IPC: H05K114

    CPC classification number: H01R12/79 ,  H02G5/04 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K3/202 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09854 ,  H05K2201/09863

    Abstract: An electrically conductive circuit conductor 2 is disposed on an insulating resin substrate 1, an electrically conductive surface 3 of the circuit conductor is exposed from the resin substrate continuously in a longitudinal direction, and both side portions 4 of the conductive surface are covered and fixed by collar walls 5 of the resin substrate. A bus bar or an electrically conductive resin material is used as the circuit conductor 2. The bus bar 2 is insert-molded onto the resin substrate. The electrically conductive resin material is poured and solidified in a groove portion in the resin substrate. A contact terminal on a mating circuit side or electrical component side is brought into contact with the conductive surface of the circuit conductor 2. A second circuit board is laminated on the resin substrate, and an insertion hole for allowing the conductive surface of the circuit conductor 2 to be exposed is provided in the second circuit board, and the contact terminal is inserted in the insertion hole. Other contact terminals on the mating circuit side or electrical component side are brought into contact with circuits of the second circuit board.

    Abstract translation: 导电电路导体2设置在绝缘树脂基板1上，电路导体的导电表面3沿着纵向连续地从树脂基板露出，并且导电表面的两个侧部4被覆盖并固定在 树脂基板的环状壁5。 母线或导电树脂材料用作电路导体2.汇流条2插入模制在树脂基片上。 导电性树脂材料在树脂基板的槽部注入并凝固。 匹配电路侧或电气元件侧的接触端子与电路导体2的导电表面接触。第二电路板层叠在树脂基板上，并且插入孔用于允许电路导体的导电表面 2被设置在第二电路板中，并且接触端子插入到插入孔中。 匹配电路侧或电气部件侧的其他接触端子与第二电路板的电路接触。

    Formation of narrow conductive paths on a substrate
    56.
    发明授权
    Formation of narrow conductive paths on a substrate 失效
    在基板上形成窄导电路径

    公开(公告)号：US4519877A

    公开(公告)日：1985-05-28

    申请号：US665535

    申请日：1984-10-26

    Applicant: Raymond E. Wiech, Jr.

    Inventor： Raymond E. Wiech, Jr.

    IPC: H05K1/03 ,  H05K1/09 ,  H05K3/04 ,  H05K3/06 ,  H05K3/07 ,  H05K3/10 ,  H05K3/12 ,  C25D5/02 ,  C25D5/48 ,  C25D5/50

    CPC classification number: H05K3/1258 ,  H05K3/045 ,  H05K3/07 ,  H05K3/107 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K3/06 ,  H05K3/108

    Abstract: A method of forming electrically conductive paths within grooves formed in a substrate wherein the width of the grooves is of the same order of magnitude as the thickness of an electrically conductive layer deposited on the substrate and in the grooves. The substrate with grooves therein is exposed to a medium whereby electrically conductive material from the medium deposits substantially uniformly on all surfaces of the substrate which are exposed to the medium. In this way, the build-up of conductive material in grooves will take place along the side walls as well as the bottom of the grooves. If the layer is of substantially the same order of magnitude as the width of the groove (about one half the groove width or greater), the grooves will fill up with conductive material. The remainder of the substrate will ultimately provide a substantially flat conductive layer on the substrate surface. The conductive material is then removed by an action which removes exposed conductor along the entire substrate surface at a uniform rate whereby the conductor will be substantially entirely removed from the substrate except for the portion thereof within the grooves. In this way an electrically conductive path of predetermined geometry is provided.

    Abstract translation: 在衬底中形成的沟槽内形成导电路径的方法，其中沟槽的宽度与沉积在衬底和凹槽中的导电层的厚度相同数量级。 其中具有凹槽的衬底暴露于介质，由此来自介质的导电材料基本均匀地沉积在暴露于介质的衬底的所有表面上。 以这种方式，导电材料在槽中的积聚将沿着侧壁以及凹槽的底部发生。 如果该层与凹槽的宽度（槽宽度的大约一半）大致相同的数量级，则凹槽将填充导电材料。 衬底的其余部分将最终在衬底表面上提供基本平坦的导电层。 然后通过以均匀速率沿着整个基板表面去除暴露的导体的动作去除导电材料，由此导体将基本上完全从衬底除去，除了其中的凹槽内的部分。 以这种方式提供预定几何形状的导电路径。

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