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公开(公告)号：KR1020120074112A
公开(公告)日：2012-07-05
申请号：KR1020100136071
申请日：2010-12-27
Applicant: 제일모직주식회사
IPC: C09J9/00 , C09J163/00 , C09J133/04 , C09J7/02
CPC classification number: H01L24/29 , C09J9/00 , C09J7/35 , C09J133/04 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive composition for semiconductor and an adhesive film including the same are provided to smoothly remove void during EMC molding by giving residual cure index after various curing processes. CONSTITUTION: An adhesive composition for semiconductor has a compressive strength of 100-150 gf/mm^2 at 125 deg. Celsius after curing for 60 minutes. The adhesive compound comprises a binder resin, an epoxy resin, and an amine hardener. The binder resin is a (meth) acrylate copolymer. The amine hardener comprises a first amine hardener marked as chemical formula 1 and a secondary amine hardener marked as chemical formula 2. The adhesive composition has a foamable void of less than 15% at 150 deg. Celsius after curing for 10 minutes and 30 minutes.
Abstract translation: 目的：提供一种用于半导体的粘合剂组合物和包含该粘合剂组合物的粘合剂膜，以在EMC成型期间通过在各种固化过程之后给出残余固化指数来平滑地去除空隙。 构成：半导体用粘合剂组合物在125度下的抗压强度为100-150gf / mm ^ 2。 摄氏60度后固化。 粘合剂包括粘合剂树脂，环氧树脂和胺硬化剂。 粘合剂树脂是（甲基）丙烯酸酯共聚物。 胺固化剂包括标记为化学式1的第一胺硬化剂和标记为化学式2的仲胺硬化剂。粘合剂组合物在150度下具有小于15％的可发泡空隙。 摄氏10分钟30分钟。
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公开(公告)号：KR1020120068695A
公开(公告)日：2012-06-27
申请号：KR1020110120484
申请日：2011-11-17
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J163/00 , C09J11/06 , H01L21/58
CPC classification number: H01L24/29 , C08L63/00 , C09J133/066 , C09J133/18 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/13111 , H01L2224/13147 , H01L2224/16146 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/32145 , H01L2224/73104 , H01L2224/81011 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8181 , H01L2224/81815 , H01L2224/83191 , H01L2224/83203 , H01L2224/8385 , H01L2224/9211 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
Abstract: PURPOSE: An adhesive composition for semiconductor is provided to satisfy electric connection reliability between bump chips, to conduct flux process removing an oxide layer of a Cu bump and a solder by adhesive layer between bump chips, and to sufficiently connect a bump and a solder at chip bonding due to heating and compression. CONSTITUTION: An adhesive composition comprises an acryl-based polymer resin, epoxy-based resin, and imidazole compound. The imidazole compound has melting point of 200-270 °C. The composition has melting viscosity of 2 ×10^4 - 15 ×10^4 poise at 150 °C. The equivalent of the epoxy-based resin is about 200-250 g/eq, and the melting viscosity at 150 °C is about 0.01-0.2 Pa·s. the adhesion of the composition is about 15 - 30 kgf/25mm^2. The acrylic polymer resin contains an epoxy group, and the glass transition temperature is about (-30) - 80°C.
Abstract translation: 目的：提供一种用于半导体的粘合剂组合物，以满足凸块之间的电连接可靠性，通过在凸块之间的粘合剂层去除Cu凸块的氧化物层和焊料的通量处理，并充分地连接凸块和焊料 由于加热和压缩而导致的芯片接合。 构成：粘合剂组合物包含丙烯酸类聚合物树脂，环氧类树脂和咪唑化合物。 咪唑化合物的熔点为200-270℃。 该组合物在150℃下的熔融粘度为2×10 ^ 4 -15×10 ^ 4泊。 环氧基树脂的当量为约200-250g / eq，150℃下的熔融粘度为约0.01-0.2Pa·s。 组合物的粘合力为约15-30kgf / 25mm ^ 2。 丙烯酸类聚合物树脂含有环氧基，玻璃化转变温度约为（-30）〜80℃。
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公开(公告)号：KR1020120067197A
公开(公告)日：2012-06-25
申请号：KR1020100128660
申请日：2010-12-15
Applicant: 제일모직주식회사
IPC: H01L21/301
CPC classification number: H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2224/83191 , H01L2924/01012 , H01L2924/01029 , H01L2924/3512 , H01L2924/00
Abstract: PURPOSE: A dicing die-bonding film is provided to differently produce peeling force of a surface contacting with a base film and a surface contacting with a wafer by adding specific metal oxide filler. CONSTITUTION: A dicing die-bonding film(10) has a first side(A) contacting to a base film and a second side(B) contacting to a semiconductor wafer. The dicing die-bonding film is formed into monolayer. Peel force of the first side is under 0.1 N/25mm. The peel force of the second side is over 0.2 N/25mm. A light hardening degree of the first side is 90% to 99%. A light hardening degree of the second side is 10% to 50%. The ratio of the first side and the second side is 1:5-30. The dicing die-bonding film includes a metal oxide particle selected by titanium dioxide, zinc oxide, or mixture thereof.
Abstract translation: 目的：通过添加特定的金属氧化物填料，提供切割芯片接合薄膜以不同地产生与基底膜接触的表面和与晶片接触的表面的剥离力。 构成：切割芯片接合膜（10）具有与基膜接触的第一侧（A）和与半导体晶片接触的第二侧（B）。 切割芯片接合膜形成为单层。 第一面的剥离力在0.1N / 25mm以下。 第二面的剥离力超过0.2N / 25mm。 第一侧的光硬化度为90％〜99％。 第二面的光硬化度为10％〜50％。 第一面和第二面的比例为1:5-30。 切割芯片接合膜包括由二氧化钛，氧化锌或其混合物选择的金属氧化物颗粒。
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公开(公告)号：KR1020120057941A
公开(公告)日：2012-06-07
申请号：KR1020100119511
申请日：2010-11-29
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J201/00 , C09J11/00 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/00 , C09J201/005 , C09J2201/61 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: A semiconductor adhesive film composition is provided to effectively remove voids generated during die adhesion process, and to reduce film modulus even at semi cure process conducted after die adhesion. CONSTITUTION: A semiconductor adhesive film composition comprises a thermoplastic polymer resin, an epoxy-based resin, and an amine type cured resin. The amine type cured resin is in chemical formula 1. In chemical formula 1, A is SO2, CH2 or oxygen, R1-R10 is respectively and independently selected from hydrogen, a C1-3 alkyl group, and amine. The amine type cured resin has weight average molecular weight of 500g/mol or less. The semiconductor adhesive film composition additionally comprises 1-40 parts by weight of a filler, based on 100.0 parts by weight.
Abstract translation: 目的：提供半导体粘合膜组合物以有效地去除模具粘合过程中产生的空隙，并且即使在模具附着之后进行的半固化过程也降低膜模量。 构成：半导体粘合膜组合物包含热塑性聚合物树脂，环氧类树脂和胺型固化树脂。 胺型固化树脂为化学式1.在化学式1中，A为SO 2，CH 2或氧，R 1 -R 10分别独立地选自氢，C 1-3烷基和胺。 胺型固化树脂的重均分子量为500g / mol以下。 半导体粘合剂膜组合物另外包含基于100.0重量份的1-40重量份填料。
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公开(公告)号：KR1020120036691A
公开(公告)日：2012-04-18
申请号：KR1020100098504
申请日：2010-10-08
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J11/00 , C09J133/04 , H01L21/58
CPC classification number: H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , C09J7/35 , C09J7/29 , C09J11/00 , C09J133/04 , C09J2201/36 , C09J2201/61 , C09J2201/622 , C09J2203/326 , H01L21/67132 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: Adhesive film is provided to retrain the failure of bonding wire with retraining the introduce of separate spacer between semiconductor chips, and to restrain adhesive defect like void in interface. CONSTITUTION: Adhesive film for semiconductor packaging comprises a first adhesive layer(60) in which bonding wire is penetrated and accepted, and a second bonding layer attached to a lower chip. Before hardening, the first adhesive layer has lower viscosity than the second adhesive layer. The first adhesive layer and the second adhesive layer has the viscosity difference of 10^1-10^3 poise at 100 °C.
Abstract translation: 目的：提供粘合膜，通过重新引导半导体芯片之间的单独间隔物，重新制备接合线的故障，并抑制接口中的无孔等粘合剂缺陷。 构成：用于半导体封装的粘合膜包括第一粘合层（60），其中接合线被穿透并被接受，第二粘合层附接到下芯片。 在硬化之前，第一粘合剂层具有比第二粘合剂层低的粘度。 第一粘合剂层和第二粘合剂层在100℃下的粘度差为10 ^ 1-10 ^ 3泊。
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Patent Agency Ranking
公开(公告)号：KR101045262B1
公开(公告)日：2011-06-29
申请号：KR1020090128327
申请日：2009-12-21
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J7/02 , H01L21/58
CPC classification number: C09J163/00 , C08G59/621 , C08L63/00 , C08L2205/02 , Y10T428/31511 , C09J7/22 , C09J7/35 , C09J2203/326
Abstract: PURPOSE: A semiconductor adhesive composition for stealth dicing is provided to facilitate low temperature individualization and cuttability by the increase of low temperature elastic modulus, and to secure substrate embedding property and adhesion reliability. CONSTITUTION: A semiconductor adhesive composition for stealth dicing comprises (a) 100 parts by weight of a polymer resin having a glass transition temperature of 5 °C or more and less than 30°C, (b) 1-20 parts by weight of an epoxy-based resin including a liquid-phase epoxy resin and a solid-phase epoxy resin, (c) 1-20 parts by weight of phenol type epoxy resin hardener, (d) 10-80 parts by weight of inorganic filler, (e) 0.1-20 parts by weight of curing catalyst, and (f) 0.1-10 parts by weight of silane coupling agents.
Abstract translation: 目的：提供一种用于隐形切割的半导体粘合剂组合物，以通过降低低温弹性模量来提高低温个体化和切割性，并确保基材的嵌入性和粘合可靠性。 构成：用于隐形切割的半导体粘合剂组合物包括（a）100重量份玻璃化转变温度为5℃以上且小于30℃的聚合物树脂，（b）1-20重量份的 包括液相环氧树脂和固相环氧树脂的环氧树脂，（c）1-20重量份酚型环氧树脂固化剂，（d）10-80重量份无机填料，（e ）0.1-20重量份的固化催化剂，和（f）0.1-10重量份的硅烷偶联剂。
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公开(公告)号：KR101033044B1
公开(公告)日：2011-05-09
申请号：KR1020090134709
申请日：2009-12-30
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J163/02 , C09J7/02 , H01L21/58
CPC classification number: C08G59/38 , C08L21/00 , C08L63/00 , C08L63/04 , C08L2205/02 , C09J163/00 , Y10T428/287 , C09J7/22 , C09J7/35 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for a semiconductor device is provided to effectively remove voids caused by in a die attach process when molded with an epoxy molding agent. CONSTITUTION: An adhesive composition for a semiconductor device includes 80-50 parts by weight of elastomer resin, 10-20 parts by weight of epoxy resin, 1-10 parts by weight of hardened resin, 0.01-10 parts by weight of curing accelerator, 0.01-10 parts by weight of silane coupling agent, and 5-10 parts by weight of filler. The epoxy resin comprises 20-60 parts by weight of bifunctional epoxy resin and polyfunctional epoxy resin based on 100.0 parts by weight of the epoxy resin.
Abstract translation: 目的：提供一种用于半导体器件的粘合剂组合物，用于当用环氧树脂模制剂模制时，有效地去除在模具附接过程中引起的空隙。 构成：半导体装置用粘合剂组合物包含80〜50重量份的弹性体树脂，10〜20重量份的环氧树脂，1-10重量份的硬化树脂，0.01-10重量份的固化促进剂， 0.01-10重量份的硅烷偶联剂和5-10重量份的填料。 环氧树脂包含20-60重量份双官能环氧树脂和基于100.0重量份环氧树脂的多官能环氧树脂。
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公开(公告)号：KR101023240B1
公开(公告)日：2011-03-21
申请号：KR1020080126514
申请日：2008-12-12
Applicant: 제일모직주식회사
IPC: C09J179/06 , C09J123/06 , C09J175/04 , C09J163/00
Abstract: 본 발명은 스텔스 다이싱용 반도체용 접착 조성물에 관한 것으로, 보다 상세하게는 유리전이온도가 0~10℃인 제1 고분자 수지와 유리전이온도가 30~60℃인 제2 고분자 수지를 함유하는 고분자 성분, 에폭시계 수지, 페놀형 에폭시 수지 경화제, 무기 필러, 경화촉매 및 커플링제를 포함하는 접착 조성물에 관한 것이다. 본 발명에 따른 반도체용 접착 조성물은 유리전이온도가 서로 다른 2종의 고분자 수지를 사용하여 저온 탄성률의 증가로 저온 개별화 및 절단성이 용이하고 또한 경화 후 고온 탄성률의 저하로 기판 매입성 및 접착 신뢰성을 확보할 수 있다.
접착 조성물, 스텔스 다이싱, 유리전이온도-
公开(公告)号：KR101002488B1
公开(公告)日：2010-12-17
申请号：KR1020080103105
申请日：2008-10-21
Applicant: 제일모직주식회사
IPC: C08J5/18 , C08L33/14 , C08L63/00 , C09J133/08
CPC classification number: C09J163/00 , C08G59/621 , C08L33/08 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/04 , C09J133/08 , Y10T428/2848
Abstract: 본 발명은 아크릴계 고분자, 에폭시 수지, 페놀형 경화 수지, 경화 촉매, 실란 커플링제 및 충진제를 포함하고 경화 후 공-연속으로 상 분리되는 반도체 다이 접착제 조성물 및 이로부터 제조된 접착제 필름에 관한 것이다.
본 발명에 따르는 접착 필름은 경화부의 함량이 많더라도 연 구조성과 필름의 인장강도 증가를 동시에 만족시키므로, 필름이 끊어지지 않고 단단하여 반도체 조립시 높은 신뢰성을 확보할 수 있다.
공-연속 상, 가교성 관능기, 반도체 접착 필름, 다이 접착(die attach), 아크릴계 고분자, 페놀형 경화 수지, 경화 촉매, 실란 커플링제-
公开(公告)号：KR1020100075212A
公开(公告)日：2010-07-02
申请号：KR1020080133848
申请日：2008-12-24
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J7/00
Abstract: PURPOSE: A high temperature fast curable adhesive film composition, and an adhesive film using thereof are provided to prevent the crack of a bump and the shake between chips by reducing the mobility of the adhesive film when assembling a semiconductor device. CONSTITUTION: A high temperature fast curable adhesive film composition contains 30~70 parts of polymer resin by weight, 5~30 parts of epoxy resin by weight, 5~30 parts of phenol type epoxy resin hardener by weight, 0.5~20 parts of curing accelerator, 0.1~5 parts of silane coupling agent by weight, and 5~60 parts of filler by weight, for 100 parts of solid components of the adhesive film composition. The epoxy equivalent of the epoxy resin is the maximum 200 grams per eq.
Abstract translation: 目的：提供高温快速固化粘合膜组合物及其使用的粘合膜，以防止在组装半导体器件时粘合膜的迁移率降低时的凸起裂纹和芯片之间的抖动。 构成：高温快速固化粘合膜组合物含有30〜70重量份的聚合物树脂，5〜30重量份环氧树脂，5〜30重量份酚醛环氧树脂固化剂，固化剂0.5〜20份 促进剂，0.1〜5重量份的硅烷偶联剂和5〜60重量份的填料，用于粘合膜组合物的100份固体成分。 环氧树脂的环氧当量最大为200克/ eq。
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