Method for characterizing similarity between measurement values of entity, computer program, and data carrier
    4.
    发明专利
    Method for characterizing similarity between measurement values of entity, computer program, and data carrier 有权
    表征实体,计算机程序和数据载体的测量值之间的相似性的方法

    公开(公告)号:JP2009135425A

    公开(公告)日:2009-06-18

    申请号:JP2008238306

    申请日:2008-09-17

    CPC classification number: G03F9/7003 G03F9/7034

    Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently characterizing similarity between measurement values of a plurality of entities.
    SOLUTION: The method for characterizing similarity between the measurement values of a plurality of entities including the first entity and the second entity includes a step for receiving measurement values taken at a plurality of measurement points in each entity. A model provided with a probability process, a set of parameters and a model function having values depending on the measurement points is defined. Then a set (β) of parameters is estimated by fitting the model function to the measurement values. In a succeeding step, residual data are determined at least on a part of the plurality of measurement points for the first entity and the second entity by subtracting the fitted function from the measurement values. Then, a correlation coefficient of the first entity (i') and the second entity (i") is estimated based on the determined residual data and the estimated correlation coefficient is used to characterize the similarity between the measurement values. In the method, the model is defined so that the residual data are expected to have a deterministic component for controlling an estimation value of the correlation coefficient depending on the measurement points. The correlation coefficient is estimated by using an estimation value of an entity average residual averaged by the measurement points of the first entity and an estimation value of an entity average residual averaged by the measurement points of the second entity.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于有效地表征多个实体的测量值之间的相似性的方法。 解决方案:用于表征包括第一实体和第二实体的多个实体的测量值之间的相似度的方法包括用于接收在每个实体中的多个测量点处获取的测量值的步骤。 定义了具有概率过程,一组参数和具有取决于测量点的值的模型函数的模型。 然后通过将模型函数拟合到测量值来估计参数的集合(β)。 在接下来的步骤中,通过从测量值中减去拟合函数,至少在第一实体和第二实体的多个测量点的一部分上确定残差数据。 然后,基于所确定的残差数据来估计第一实体(i')和第二实体(i“)的相关系数,并且使用估计的相关系数来表征测量值之间的相似度,在该方法中, 模型被定义为使得残差数据被期望具有用于根据测量点来控制相关系数的估计值的确定性分量,通过使用由测量点平均的实体平均残差的估计值来估计相关系数 的第一个实体的平均估计值和由第二个实体的测量点平均的实体平均残差的估计值。版权所有:(C)2009,JPO&INPIT

    Method for characterizing process step and device manufacturing method
    5.
    发明专利
    Method for characterizing process step and device manufacturing method 有权
    用于表征工艺步骤和装置制造方法的方法

    公开(公告)号:JP2008211233A

    公开(公告)日:2008-09-11

    申请号:JP2008104954

    申请日:2008-04-14

    CPC classification number: G03F7/70616 G03F7/70633 G03F9/7003

    Abstract: PROBLEM TO BE SOLVED: To provide a device manufacturing method that improves the yield.
    SOLUTION: Deformation of a substrate wafer is measured by comparing positions of a plurality of reference marks with values of a data base after their exposure and process step. For taking into consideration the measured deformation and the compared results in step S1, the development step of an exposure and development step S2 is controlled using the feedforward loop. Then, a position alignment measurement step S3 is performed, in which the alignment relationship between the continuing two layers deposited on the substrate W during consecutive cycles is measured. If the positional control of a latest layer with respect to its preceding layer is insufficient, the latest layer is removed and a new layer is deposited.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供提高产量的装置制造方法。 解决方案:通过将多个参考标记的位置与其曝光和处理步骤之后的数据库的值相比较来测量衬底晶片的变形。 为了在步骤S1中考虑测量的变形和比较结果,使用前馈回路来控制曝光和显影步骤S2的显影步骤。 然后,进行位置对准测量步骤S3,其中测量在连续循环期间沉积在基板W上的连续两层之间的对准关系。 如果相对于其前一层的最新层的位置控制不足,则移除最新层并且存储新层。 版权所有(C)2008,JPO&INPIT

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