Lithography equipment and device manufacturing method
    6.
    发明专利
    Lithography equipment and device manufacturing method 有权
    LITHOGRAPHY设备和设备制造方法

    公开(公告)号:JP2006128682A

    公开(公告)日:2006-05-18

    申请号:JP2005310028

    申请日:2005-10-25

    Abstract: PROBLEM TO BE SOLVED: To provide lithography equipment and a device manufacturing method.
    SOLUTION: Lithography equipment has a substrate support formed such that it supports a substrate, and a projection system formed such that it projects a patterned radiation beam to a target part of the substrate. The substrate support is operated such that the substrate is moved along a specified path of the target part as the next target of the substrate. The substrate support has a duct fabric for thermally stabilizing the substrate. This duct fabric supplies a thermal stabilization medium to the substrate through the duct, and removes the thermal stabilization medium virtually using the duct from a portion of the substrate support that supports the target part via the substrate support part that supports the target part preceding the substrate, thereby maintaining the target part as a next target thermally stably.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供光刻设备和设备制造方法。 解决方案:平版印刷设备具有形成为支撑基板的基板支撑件和形成为使得其将图案化的辐射束投影到基板的目标部分的投影系统。 操作基板支撑件,使得基板沿着目标部件的指定路径移动,作为基板的下一个目标。 衬底支撑件具有用于热稳定衬底的管道织物。 这种管道织物通过管道向基底提供热稳定介质,并且通过经由基板支撑部分支撑目标部分的衬底支撑部分,基本上使用来自支撑目标部分的基板支撑件的管道的热稳定介质, 从而热稳定地将目标部分保持为下一个目标。 版权所有(C)2006,JPO&NCIPI

    METHOD AND ARRANGEMENT FOR PREDICTING THERMALLY-INDUCED DEFORMATION OF A SUBSTRATE, AND A SEMICONDUCTOR DEVICE

    公开(公告)号:SG131880A1

    公开(公告)日:2007-05-28

    申请号:SG2006071203

    申请日:2006-10-12

    Abstract: The invention provides a method for correcting thermally-induced field deformations of a lithographically exposed substrate. First, a model is provided to predict thermally- induced field deformation information of a plurality of fields of the substrate. The pre-specified exposure information used to configure an exposure of the fields is then modified based on the thermally-induced deformation information as predicted by the model. Finally a pattern is exposed onto the fields in accordance with the pre- specified exposure information as modified. The predicting of thermally-induced field deformation information by the model includes predicting of deformation effects of selected points on the substrate. It is based on a time-decaying characteristic as energy is transported across substrate; and a distance between the selected points and an edge of the substrate.

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