Flexible substrate
    95.
    发明授权

    公开(公告)号:US11956893B2

    公开(公告)日:2024-04-09

    申请号:US17450857

    申请日:2021-10-14

    Inventor: Takumi Sano

    CPC classification number: H05K1/028 H05K1/0283 H05K1/189 H05K2201/052

    Abstract: According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

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