公开(公告)号：US09949376B2

公开(公告)日：2018-04-17

申请号：US14563778

申请日：2014-12-08

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J Greenberg ,  Neil H Talbot ,  James S Little

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36 ,  A61N1/372 ,  H05K3/28 ,  H05K1/11 ,  H05K1/14 ,  A61B5/00 ,  A61B5/0478 ,  H05K1/18 ,  H01L23/055 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/282 ,  A61B5/0006 ,  A61B5/0478 ,  A61B5/4836 ,  A61B5/6868 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/3606 ,  A61N1/36071 ,  A61N1/36082 ,  A61N1/36139 ,  A61N1/375 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4061 ,  H05K2201/0245 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/10795 ,  H05K2201/10931 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/068 ,  H05K2203/082 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/1394 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

公开(公告)号：US20180098431A1

公开(公告)日：2018-04-05

申请号：US15689206

申请日：2017-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Yong PARK ,  Jeong Geun KIM ,  Si Young PARK

IPC: H05K1/18 ,  H01R4/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/184 ,  H01R4/58 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/73 ,  H05K1/0213 ,  H05K1/115 ,  H05K1/145 ,  H05K3/341 ,  H05K3/3457 ,  H05K7/142 ,  H05K2201/09072 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10409

Abstract: In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.

公开(公告)号：US09936588B2

公开(公告)日：2018-04-03

申请号：US13655135

申请日：2012-10-18

Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

Inventor： Mark E. Andresen ,  Virginia Ott

IPC: H05K3/30 ,  H05K3/00

CPC classification number: H05K3/308 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2201/10871 ,  H05K2203/0207 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

公开(公告)号：US09906200B2

公开(公告)日：2018-02-27

申请号：US14929874

申请日：2015-11-02

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shin-Chih Hsieh ,  Po-Jen Tsai ,  Chia-Chi Hsieh

IPC: H03H7/01 ,  H05K1/18 ,  H05K3/30 ,  H01R12/53 ,  H01R12/58 ,  H03H1/00 ,  H01F27/30 ,  H01R4/28

CPC classification number: H03H7/0115 ,  H01F27/306 ,  H01R4/28 ,  H01R12/53 ,  H01R12/58 ,  H03H1/00 ,  H03H2001/0035 ,  H03H2001/0057 ,  H05K1/182 ,  H05K3/306 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10962

Abstract: A power filter is provided, including a circuit board module, an insulating base, several connect terminals, and an inductor. The circuit board module includes a circuit board and several electronic components, wherein the circuit board forms several connect holes thereon and the electronic components are electrically connected to the circuit board. The connect terminals are fixed on the insulating base and each has a connecting part and a clamping part, wherein the connecting parts are joined with the connect holes of the circuit board. The inductor includes at least one wire with both terminals clamped by the clamping parts, and the wire is electrically connected to the circuit board module through the connecting parts.

公开(公告)号：US09899892B2

公开(公告)日：2018-02-20

申请号：US14809706

申请日：2015-07-27

Applicant: BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT, WUERZBURG

Inventor： Maurad Berkouk ,  Sebastien Labat ,  Eric Fournier

IPC: H02K5/22 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40 ,  H02K11/22 ,  H02K11/01 ,  H02K11/33 ,  H02K11/40

CPC classification number: H02K5/225 ,  H02K11/01 ,  H02K11/022 ,  H02K11/33 ,  H02K11/40 ,  H02K2211/03 ,  H05K1/0213 ,  H05K1/18 ,  H05K3/325 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/10303

Abstract: A rotary electric machine, in particular an electric motor, has a winding, an electronic control device, and an electrically conductive shielding plate arranged between the control device and the winding. A connection device which includes at least one coupling element for electrically connecting the control device to one or more lines and a mass element provided for connecting to an electric mass potential. In order to improve the machine with respect to electromagnetic interference, the shielding plate is electrically conductively connected to the mass element by way of a sheet metal tongue via a first electric pressure-contact.

公开(公告)号：US09844137B2

公开(公告)日：2017-12-12

申请号：US14850253

申请日：2015-09-10

Applicant: Advanced Powertrain Engineering, LLC

Inventor： Paul Fathauer

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  F16K31/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  F16K31/02 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

公开(公告)号：US09793887B2

公开(公告)日：2017-10-17

申请号：US14217179

申请日：2014-03-17

Applicant: Zonit Structured Solutions, LLC

Inventor： Steve Chapel ,  William Pachoud

IPC: H03K17/13 ,  H03K17/687 ,  H05K3/30 ,  H05K1/18 ,  H05K5/00 ,  H05K1/02

CPC classification number: H03K17/133 ,  H03K17/687 ,  H05K1/0204 ,  H05K3/306 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/2036 ,  Y10T29/4913 ,  Y10T307/937

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

公开(公告)号：US09763327B2

公开(公告)日：2017-09-12

申请号：US14834180

申请日：2015-08-24

Applicant: Multek Technologies Ltd.

Inventor： Kwan Pen ,  Pui Yin Yu

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

CPC classification number: H05K1/115 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/42 ,  H05K3/422 ,  H05K3/424 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4638 ,  H05K2201/095 ,  H05K2201/09545 ,  H05K2201/09554 ,  H05K2201/10303

Abstract: A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is plugged into an inner core through hole and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the inner core layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.

公开(公告)号：US20170257946A1

公开(公告)日：2017-09-07

申请号：US15602137

申请日：2017-05-23

Applicant: HE BEI SINOPACK ELECTRONIC TECH CO., LTD.

Inventor： Dongliang Zhao ,  Fei Ding ,  Linjie Liu

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K1/0306 ,  H01L23/13 ,  H05K1/0213 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/005 ,  H05K3/188 ,  H05K3/40 ,  H05K3/4038 ,  H05K3/4617 ,  H05K2201/0723 ,  H05K2201/09218 ,  H05K2201/09618 ,  H05K2201/10303

Abstract: The present application discloses a method for fabricating ceramic insulator for electronic packaging, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.

公开(公告)号：US20170256902A1

公开(公告)日：2017-09-07

申请号：US15509570

申请日：2015-06-19

Applicant: Robert Bosch GmbH

Inventor： Andreas Otto ,  Cynthia Halm

IPC: H01R43/20 ,  H05K3/32 ,  H01R12/58

CPC classification number: H01R43/205 ,  H01R9/092 ,  H01R12/585 ,  H05K3/328 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0285

Abstract: A method is described for solderless electrical press-in contacting of conductive press-in pins in circuit boards, the method comprising the following steps: Providing a circuit board having at least one contacting opening for press-in contacting; providing at least one press-in component having at least one conductive press-in pin; providing a sonotrode for exerting a force and for applying ultrasonic energy. In order to electrically and mechanically contact press-in pins to a circuit board by means of ultrasonic press-in technology, it is provided that the press-in component together with its press-in pin, is fixated during a press-in step, in particular held firmly in place, and that a force and ultrasonic energy are directly applied to the circuit board by means of the sonotrode such that the circuit board is pressed at the location of its contacting opening onto the press-in pin, not directly acted upon by the sonotrode, of the press-in component.