公开(公告)号：US5913109A

公开(公告)日：1999-06-15

申请号：US690532

申请日：1996-07-31

Applicant: Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

Inventor： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.

Abstract translation: 在用于安装用于制造微电子部件的片状多层元件的方法中，首先将片状元件接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 然后将组件冷却，并将膨胀环切掉。 在另一个实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的端子焊盘的方法。 首先将微电子元件放置在刚性板上，将已经结合到框架环的片状元件放置在微电子元件上。 然后将盘放置在片状元件上，并且将力施加到盘上，使得片状元件上的接合焊盘与微电子元件上的端子焊盘接触。 然后施加热量，形成粘结。

公开(公告)号：US5823800A

公开(公告)日：1998-10-20

申请号：US737988

申请日：1996-11-25

Applicant: Harry Suehrcke ,  Noel Wilhelmus Lovisa

Inventor： Harry Suehrcke ,  Noel Wilhelmus Lovisa

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H01R9/09

CPC classification number: H05K1/119 ,  H05K3/326 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10053 ,  H05K2201/1059 ,  H05K3/306

Abstract: An electrical socket is formed in a printed circuit board (PCR) using standard automated PCB production techniques. The socket (20) comprises a respective three legged slotted aperture (22) for each pin (11) of a male plug. The slotted aperture (22) defines two cantilevered portions (23) which receive a respective pin (11) in A slot defined therebetween. The slot is of slightly narrower width than the corresponding pin (11), but the cantilevered portions (23) are resiliently movable to enable the slot to receive and frictionally retain the pin therein. Plated contact surfaces are formed on either side of the slot to make physical and electrical contact with the pin. A modified socket (40) includes an integrally formed isolation switch. The cantilevered portions (41) extend beyond the point where the pin (11) is inserted therebetween. The distal ends of the cantilevered portions (41) are provided with respective contact surfaces (43, 44) which are normally spaced apart, but come into contact to close the switch when the cantilevered portions (41) are splayed apart by the insertion of a pin therebetween. Alternatively, contacts (32) on the cantilevered portions may be arranged to come into contact with corresponding contacts (33) on the circuit board.

Abstract translation: PCT No.PCT / AU95 / 00301 Sec。 371日期：1996年11月25日 102（e）日期1996年11月25日PCT提交1995年5月25日PCT公布。 出版物WO95 / 32605 日期1995年11月30日使用标准的自动化PCB生产技术，在印刷电路板（PCR）中形成电插座。 插座（20）包括用于公插头的每个销（11）的相应的三个有腿的开口孔（22）。 开槽孔（22）限定了两个悬臂部分（23），它们在其间限定的A槽中容纳相应的销钉（11）。 狭槽的宽度比对应的销（11）略窄，但是悬臂部分（23）是可弹性移动的，以使槽能够接收并摩擦地将销保持在其中。 电镀的接触表面形成在槽的任一侧，以与销物理和电接触。 改进的插座（40）包括一体形成的隔离开关。 悬臂部分（41）延伸超过销（11）插入其间的点。 悬臂部分（41）的远端设有各自的接触表面（43,44），其通常间隔开，但是当悬臂部分（41）通过插入 在它们之间。 或者，悬臂部分上的触点（32）可以布置成与电路板上的对应触点（33）接触。

公开(公告)号：US5759047A

公开(公告)日：1998-06-02

申请号：US653214

申请日：1996-05-24

Applicant: William Louis Brodsky ,  Glenn Lee Kehley ,  Glenn Edward Myrto ,  John Henry Sherman

Inventor： William Louis Brodsky ,  Glenn Lee Kehley ,  Glenn Edward Myrto ,  John Henry Sherman

IPC: H01R12/62 ,  H01R12/71 ,  H01R13/24 ,  H01R13/648 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H01L23/49811 ,  H01R12/62 ,  H01R12/714 ,  H01R13/648 ,  H05K1/118 ,  H05K3/326 ,  H01L2224/16225 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0373 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compressible portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. The support member may also be metallic, e.g., for use as an electrical ground shield. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56). Electrical assemblies including a pair of circuitized substrates electrically interconnected by the defined interposers are also described.

Abstract translation: 一种柔性电路插入器（50）及其制造方法，其中插入器包括至少一个柔性电路化衬底（53），其具有导体（55）和电镀元件（56）的电介质（例如，聚酰亚胺）层（54） 例如铜垫，其中可能具有用于增强连接的枝晶（57），与导体对准的有孔支撑构件（58）和在其上具有有孔构件的支撑构件（60）。 当插入件接合时，柔性电路化基板（53）在孔（59）内被压下。 公开了包括延伸到支撑构件（58）中的相应孔（59）中的可压缩部分（69）形成的支撑件（60“）和一个临时的可压缩支撑件（60”）， 。 支撑构件也可以是金属的，例如用作电接地屏蔽。 通过利用柔性基板中的一个或多个孔（64）的图案相对于并且基本上围绕定位的导体（56）也增强了弯曲。 还描述了包括通过限定的插入体电互连的一对电路化基板的电气组件。

公开(公告)号：US5562472A

公开(公告)日：1996-10-08

申请号：US406928

申请日：1995-03-29

Applicant: Dieter Dubois ,  Franz Wandinger

Inventor： Dieter Dubois ,  Franz Wandinger

IPC: H01R13/74 ,  H01R12/71 ,  H01R12/77 ,  H01R12/81 ,  H01R24/64 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H01R13/62

CPC classification number: H05K3/326 ,  H01R12/714 ,  H01R12/778 ,  H01R12/81 ,  H01R24/64 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K3/0058

Abstract: In the case of the conductor film (4) resting on a base the contact conductor tracks are arranged on a tab attachment (5) so as to run parallel to each other. Furthermore, in the base an open shaft (6) which runs obliquely downward is provided, on whose obliquely sloping bottom surface the tab attachment (5) with the contact conductor tracks which are free at the top comes to rest. For making contact, a plug socket, together with its contact spring element (8) passed outward and facing the bottom surface of the shaft (6), is inserted into the shaft (6) in the direction of the free tab end and is fastened in the end position in a locking manner.

Abstract translation: PCT No.PCT / DE93 / 00873 Sec。 371日期1995年3月29日 102（e）1995年3月29日PCT PCT 1993年9月16日PCT公布。 出版物WO94 / 08366 日期1994年04月14日在导电膜（4）搁置在基座上的情况下，接触导体轨道布置在突片附件（5）上以便彼此平行地延伸。 此外，在基座中设置有倾斜向下延伸的开放轴（6），在其倾斜倾斜的底表面上，具有在顶部自由的接触导体轨道的突片附件（5）静止。 为了接触，插头插座与其向外通过并面向轴（6）的底表面的接触弹簧元件（8）沿着自由突出端的方向插入轴（6）中并被紧固 在最终位置以锁定方式。

公开(公告)号：US5557075A

公开(公告)日：1996-09-17

申请号：US266150

申请日：1994-06-27

Applicant: Steven F. Nugent

Inventor： Steven F. Nugent

IPC: H01B7/08 ,  H01R35/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01R35/02 ,  H01R12/91 ,  H01R31/005 ,  H05K1/118 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/115 ,  H05K2201/046 ,  H05K2201/0715 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K3/3447

Abstract: A parallel flexible transmission cable accommodating three degrees of displacement and one degree of rotation. The cable has two connectors attached to a flexible, planar cable. A plurality of conductors in the planar cable electrically connect corresponding pins of the two conductors. The cable is bent or formed in the middle of its length to be composed solely of a vane or vanes, that is, planar sections which project othogonally to the common plane of the cable at the connectors. The vanes can flex cooperatively into parallel "S" shapes, allowing the connectors to move transversely with respect to each other. The cable can be made from different normally-planar materials such as flexible circuit boards, or "flex circuits," or ribbon cable.

Abstract translation: 并联的柔性传输电缆，其容纳三个位移和一个旋转角度。 电缆具有连接到柔性平面电缆的两个连接器。 平面电缆中的多个导体电连接两个导体的相​​应引脚。 电缆在其长度的中间弯曲或形成，仅由叶片或叶片组成，即在连接器处垂直于电缆的公共平面突出的平面部分。 叶片可以协同地弯曲成平行的“S”形状，允许连接器相对于彼此横向移动。 电缆可以由不同的常平面材料制成，例如柔性电路板或“柔性电路”或带状电缆。

公开(公告)号：US5518964A

公开(公告)日：1996-05-21

申请号：US271768

申请日：1994-07-07

Applicant: Thomas H. DiStefano ,  John W. Smith

Inventor： Thomas H. DiStefano ,  John W. Smith

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/20

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

Abstract translation: 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US5504273A

公开(公告)日：1996-04-02

申请号：US328040

申请日：1994-10-24

Applicant: Ryuji Nakanishi

Inventor： Ryuji Nakanishi

IPC: H01B7/08 ,  H01B7/00 ,  H01B11/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K9/00 ,  H01B11/02

CPC classification number: H05K9/0039 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/0262 ,  H05K1/118 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/048 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/09263 ,  H05K2201/097 ,  Y10T29/49124

Abstract: In an electrical wiring system, a typical process for suppressing noise due to electric current consists in preparing a pair of flat circuit units comprising respectively an insulation layer and at least one circuit conductor therein or thereon which undulates to form wave-like patterns and in superposing fixedly said conductor of the first unit with that of the second unit in such that at least one insulation layer is interposed between the superposed conductors and whereby peaks of the second unit conductor face troughs of the first unit conductor; according to the invention, fixing is performed by means enabling to interweave said peaks with said troughs. One such means consists in providing the first flat circuit unit with trough-side slits and the second with peak-side slits and in inserting the tongues formed by the trough-side slits in the peak-side slits. Another such means consists in forming a pair of flat circuit units and corresponding circuit conductors into an undulation and in interweaving the pair in alternate upside and downside fashion.

Abstract translation: 在电气布线系统中，用于抑制由电流引起的噪声的典型工艺包括制备一对扁平电路单元，该平面电路单元分别包括绝缘层和至少一个在其中或其上的电路导体，波纹形成波状图案并叠加 固定所述第一单元的导体与所述第二单元的所述导体，使得至少一个绝缘层插入在所述叠置导体之间，并且由此所述第二单元导体的峰面朝向所述第一单元导体的波谷; 根据本发明，通过能够将所述峰与所述槽交织的装置进行固定。 一种这样的装置在于提供具有槽侧狭缝的第一平面电路单元和具有峰侧狭缝的第一平面电路单元，以及将由槽侧狭缝形成的舌片插入峰侧狭缝中。 另一种这样的方式在于将一对扁平电路单元和对应的电路导体形成为起伏并以交替的上下颠倒方式交织在一起。

公开(公告)号：US5471016A

公开(公告)日：1995-11-28

申请号：US215441

申请日：1994-03-18

Applicant: Erich Krainer ,  Martin Sonnek

Inventor： Erich Krainer ,  Martin Sonnek

IPC: H01M2/10 ,  H01M2/20 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K7/12

CPC classification number: H05K1/18 ,  H01M2/1055 ,  H01M2/20 ,  H05K1/0293 ,  H05K1/116 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10651 ,  H05K2203/175 ,  H05K2203/176 ,  H05K3/3447

Abstract: In an apparatus (1) with at least one battery (12, 13) mounted on a printed circuit board (14) the printed circuit board (14) has mounting portions (23, 24, 25, 26) which can be broken off this printed circuit board, solder lugs (19, 20, 21, 22) which project from terminals (15, 16, 17, 18) of the battery (12, 13) being fixedly connected to said mounting portions by a soldered joint (27) each. Each mounting portion (23, 24, 25, 26) of the printed circuit board (14) is surrounded by the remainder of the printed circuit board (14) and an opening (28, 29, 30, 31), which partly surrounds the relevant mounting portion (23, 24, 25, 26), is formed between each mounting portion (23, 24, 25, 26) and the remainder of the printed circuit board (14) and each mounting portion (23, 24, 25, 26) is connected to the remainder of the printed circuit board (14) by a connecting portion (40, 41, 42, 43) of the printed circuit board (14), which connecting portion is situated between the two ends (32, 33, 34, 35, 36, 37, 38, 39) of an opening (28, 29, 30, 31).

Abstract translation: 在具有安装在印刷电路板（14）上的至少一个电池（12,13）的装置（1）中，印刷电路板（14）具有安装部分（23,24,25,26），其可以被断开 印刷电路板，从电池（12,13）的端子（15,16,17,18）突出的焊接凸块（19,20,21,22）通过焊接接头（27）固定地连接到所述安装部分， 每。 印刷电路板（14）的每个安装部分（23,24,25,26）被印刷电路板（14）的其余部分和一个开口（28,29,30,31）包围，该开口部分包围 相应的安装部分（23,24,25,26）形成在每个安装部分（23,24,25,26）与印刷电路板（14）的其余部分和每个安装部分（23,24,25,26）之间， 26）通过印刷电路板（14）的连接部分（40,41,42,43）连接到印刷电路板（14）的其余部分，该连接部分位于两端（32,33）之间 ，34,35,36,37,38,39）的开口（28,29,30,31）。

公开(公告)号：US5449862A

公开(公告)日：1995-09-12

申请号：US111673

申请日：1993-08-25

Applicant: Mark S. Spencer

Inventor： Mark S. Spencer

IPC: H01B7/08 ,  H01R12/62 ,  H01R12/77 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H05K7/14 ,  H01B7/00

CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/361 ,  H05K3/365 ,  H01R12/774 ,  H05K1/0271 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: This invention provides a high-density planar contact array capable of interconnecting various electronic devices using a pad to pad approach or pad to pin, and which is capable of accommodating non-coplanarity in the Z axis of printed circuit boards but which still maintains good electrical contact.The array comprises a flat, flexible insulative substrate sheet that has a plurality of parallel conductive lines or an array of circles or polygons of which each has had insulative material surrounding or on at least two sides of the conductive lines or polygons removed in the Z axis. The insulative material is removed in such a way as to create a generally trapezoid shape having a greater length side opposite the conductor when viewed through a cross-section of the X or Y axis. This trapezoid shape allows free Z axis motion while limiting X and Y axis motion.

Abstract translation: 本发明提供了一种高密度平面接触阵列，其能够使用衬垫到衬垫接近或衬垫到引脚互连各种电子器件，并且能够在印刷电路板的Z轴上容纳非共面性，但是仍然保持良好的电 联系。 该阵列包括平坦的，柔性的绝缘基片，其具有多个平行的导线或圆形或多边形阵列，它们各自具有围绕导电线或至少两侧的绝缘材料或在Z轴上移除的多边形 。 绝缘材料以通过X或Y轴的横截面观察时形成具有与导体相对的较大长度侧的大致梯形的方式被去除。 这种梯形形状允许自由的Z轴运动，同时限制X和Y轴运动。

公开(公告)号：US5369551A

公开(公告)日：1994-11-29

申请号：US148292

申请日：1993-11-08

Applicant: John G. Gore ,  Neal J. Tolar

Inventor： John G. Gore ,  Neal J. Tolar

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/0243 ,  H05K1/141 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/3447 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613

Abstract: An interface printed circuit board is configured to be placed between a leadless component such as a surface mount package used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The interface device is made using materials having similar characteristic thermal expansion properties as that of the printed circuit to with it is affixed. Solder pads are placed in offset pairs and interface board material is removed such that the combination causes the interface board to flex from the forces caused by the differing expansion coefficients of the solder, the package and the printed circuit boards. The configuration causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of epoxy and glass board material by bending the epoxy and glass as opposed to applying tensional or compressive forces to the solder joints. Such an approach relieves the stress and resulting creep seen at solder joints in the typical solder joint or column. In addition, by segregating the input and output pads and placing a metal shield between them, crosstalk rejection of the components is improved.

Abstract translation: 接口印刷电路板被配置为放置在诸如用于容纳SAW器件的表面安装封装的无引线部件和被配置为与印刷电路板无引线接触的焊接点的标准印刷电路板之间。 接口装置使用具有与印刷电路相似的特性热膨胀特性的材料制成，以便将其固定。 焊盘被放置在偏移对中，并且移除接口板材料，使得组合使得接口板从由焊料，封装和印刷电路板的不同膨胀系数引起的力弯曲。 通过弯曲环氧树脂和玻璃，这种结构使得无引线载体和印刷电路板之间的相对运动沿环氧树脂和玻璃板材料的长度发生，而不是向焊点施加张力或压缩力。 这种方法减轻了典型焊点或柱中焊点处的应力和结果蠕变。 此外，通过分离输入和输出焊盘并在它们之间放置金属屏蔽，组件的串扰抑制被改善。