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公开(公告)号：US20140367154A1
公开(公告)日：2014-12-18
申请号：US14300797
申请日：2014-06-10
Applicant: Toyota Jidosha Kabushiki Kaisha
Inventor： Jun Muto
CPC classification number: H05K1/181 , H05K1/0296 , H05K1/0298 , H05K1/11 , H05K1/162 , H05K1/165 , H05K3/247 , H05K2201/0305 , H05K2201/09236 , H05K2201/09254 , H05K2201/09727 , H05K2201/09736 , H05K2201/0979 , H05K2201/10015 , H05K2201/10522 , H05K2203/043 , Y02P70/611 , Y10T29/43
Abstract: A capacitor arrangement structure includes: a first wiring pattern; a second wiring pattern; a first electrode pattern that protrudes from the first wiring pattern toward the second wiring pattern; a second electrode pattern that protrudes from the second wiring pattern toward the first wiring pattern so as to run in parallel to the first electrode pattern; and a plurality of capacitors that are arranged in parallel between the first electrode pattern and the second electrode pattern.
Abstract translation: 电容器配置结构包括：第一布线图案; 第二布线图案; 从所述第一布线图案朝向所述第二布线图案突出的第一电极图案; 第二电极图案，其从所述第二布线图案朝向所述第一布线图案突出以与所述第一电极图案平行; 以及平行布置在第一电极图案和第二电极图案之间的多个电容器。
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172.发明申请ELECTRICAL CIRCUIT BOARD TRACE PATTERN TO MINIMIZE CAPACITOR CRACKING AND IMPROVE RELIABILITY 有权电路板跟踪图最小化电容器开裂和提高可靠性公开(公告)号：US20140311791A1
公开(公告)日：2014-10-23
申请号：US14206750
申请日：2014-03-12
Applicant: HIQ SOLAR, INC.
Inventor： Andre P. WILLIS
CPC classification number: H05K1/111 , H05K3/3442 , H05K2201/0311 , H05K2201/0394 , H05K2201/09254 , H05K2201/09381 , H05K2201/09427 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
Abstract: A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.
Abstract translation: 具有诸如焊盘的部件连接焊盘的印刷线路板，为表面安装电路部件提供热应力补偿以及制造这种焊盘的方法。 部件连接焊盘包括相对的多个导电指状物组，它们在其远端相互连接并且在它们的近端分开，在它们的近端具有用于安装单个表面安装电路部件的表面。
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公开(公告)号：US08866782B2
公开(公告)日：2014-10-21
申请号：US13946434
申请日：2013-07-19
Inventor： Kouichi Anno
CPC classification number: H03K17/9622 , G06F3/044 , G06F2203/04111 , H05K1/118 , H05K2201/09245 , H05K2201/09254 , H05K2201/09781 , H05K2201/10128
Abstract: An electrostatic-capacitance touch panel includes of X electrodes which are formed above a front surface of the electrostatic-capacitance touch panel, Y electrodes which intersect with the X electrodes, a back-surface electrode which is formed above a back surface of the electrostatic-capacitance touch panel, X-electrode signal lines which supply signals to the X electrodes from both ends of each X electrode, Y-electrode signal lines which supply signals to the Y electrodes from both ends of each Y electrode, a flexible printed circuit board connected to the X-electrode signal lines and the Y-electrode signal lines at a connection portion, intersecting portions where the X electrodes and the Y electrodes overlap with each other, and electrode portions each of which is formed between two intersecting portions. A back-surface-connection-use terminal is formed outside of the connection portion, and the back-surface-connection-use terminal and the back-surface electrode are connected to each other using a conductive member.
Abstract translation: 静电电容触摸面板包括形成在静电电容触摸面板的前表面上方的X电极，与X电极相交的Y电极，形成在静电电容触摸面板的背面上方的背面电极， 电容式触摸面板，从各X电极的两端向X电极供给信号的X电极信号线，从各Y电极的两端向Y电极供给信号的Y电极信号线，连接有柔性印刷电路板 在与X电极和Y电极重叠的交叉部分的连接部分处的X电极信号线和Y电极信号线以及在两个相交部分之间形成的电极部分。 背面连接用端子形成在连接部的外侧，背面连接用端子和背面电极使用导电部件连接。
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公开(公告)号：US08766106B2
公开(公告)日：2014-07-01
申请号：US13434162
申请日：2012-03-29
Applicant: Kota Noda , Tsutomu Yamauchi , Satoru Kawai
Inventor： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
IPC: H05K1/00
CPC classification number: H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
Abstract: A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.
Abstract translation: 一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路 所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。 所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔 和第二孔，其直径小于R1和R2中的至少一个。
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公开(公告)号：US08629550B2
公开(公告)日：2014-01-14
申请号：US13206084
申请日：2011-08-09
Applicant: Naohiro Hirose , Takashi Kariya , Yoji Mori
Inventor： Naohiro Hirose , Takashi Kariya , Yoji Mori
CPC classification number: H01R9/09 , H01L23/12 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H05K1/0256 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/113 , H05K1/115 , H05K1/116 , H05K3/184 , H05K3/241 , H05K3/382 , H05K3/4602 , H05K3/4661 , H05K2201/09227 , H05K2201/09236 , H05K2201/09254 , H05K2201/09272 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09727 , H05K2201/09781 , H05K2201/10734 , H05K2203/0594 , Y10T29/49155 , Y10T29/49194 , Y10T428/31504
Abstract: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.
Abstract translation: 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。
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Patent Agency Ranking
176.发明申请公开(公告)号：US20130052099A1
公开(公告)日：2013-02-28
申请号：US13572001
申请日：2012-08-10
Applicant: Burkhardt REICHMUTH
Inventor： Burkhardt REICHMUTH
IPC: B01L3/02
CPC classification number: H05K1/0296 , B01L3/0227 , B01L2200/087 , B01L2200/12 , G01F11/021 , G01N35/1002 , H05K1/0393 , H05K2201/053 , H05K2201/09027 , H05K2201/09063 , H05K2201/09236 , H05K2201/09254 , H05K2201/0939 , H05K2201/09672 , H05K2201/097 , H05K2201/09972 , H05K2201/10151
Abstract: The invention relates to a laboratory sample instrument with a cable holding space in which a printed circuit board cable device is arranged. The printed circuit board cable device has at least one printed circuit board with first and second sides and, arranged in succession, at least one first circuit board section, at least one second circuit board section and at least one third circuit board section, and with the circuit board having a number of conductor tracks arranged in parallel with respect to one another and extending from a first track section arranged in the first circuit board section, via the second circuit board section to the third circuit board section, in which a second track section is arranged, wherein, in the second circuit board section, at least one conductor track is arranged on the first side of the board and at least one track is arranged on the second side.
Abstract translation: 本发明涉及具有电缆保持空间的实验室样品仪器，其中布置有印刷电路板电缆装置。 印刷电路板电缆装置具有至少一个具有第一和第二侧面的印刷电路板，并且连续地布置有至少一个第一电路板部分，至少一个第二电路板部分和至少一个第三电路板部分，并且具有 所述电路板具有相对于彼此并联布置并从布置在所述第一电路板部分中的第一轨道部分经由所述第二电路板部分延伸到所述第三电路板部分的多个导体轨迹，所述第二轨道 其中，在第二电路板部分中，至少一个导体轨道布置在板的第一侧上，并且至少一个轨道布置在第二侧上。
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公开(公告)号：US08269322B2
公开(公告)日：2012-09-18
申请号：US13069520
申请日：2011-03-23
Applicant: Dong-Han Kim
Inventor： Dong-Han Kim
IPC: H01L23/495
CPC classification number: H01L23/4985 , H01L23/552 , H01L24/49 , H01L2224/05553 , H01L2224/49175 , H01L2924/00014 , H01L2924/01079 , H05K1/0216 , H05K1/111 , H05K1/189 , H05K2201/09254 , H05K2201/09781 , H05K2201/10674 , Y02P70/611 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween. Connecting wiring patterns may be configured to connect the dispersion wiring patterns to a first end of the adjacent input/output wiring pattern.
Abstract translation: 带状布线基板可以具有分散布线图案。 可以在输入/输出布线图案组之间设置色散布线图案，以补偿它们之间的间隔。 连接布线图案可以被配置为将色散布线图案连接到相邻输入/输出布线图案的第一端。
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公开(公告)号：US08263875B2
公开(公告)日：2012-09-11
申请号：US11901078
申请日：2007-09-13
Applicant: Takamasa Nodo , Haruo Takagi
Inventor： Takamasa Nodo , Haruo Takagi
IPC: H05K1/16
CPC classification number: H05K1/111 , H05K3/3442 , H05K2201/09254 , H05K2201/09281 , H05K2201/09381 , H05K2201/09727 , H05K2201/10522 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: A surface mounting structure for a surface mounting electronic component has an electronic component, a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.
Abstract translation: 用于表面安装电子部件的表面安装结构具有电子部件，焊盘，布线和电连接图案。 电子部件在其相对端具有电极。 焊盘通过焊料连接到每个电极。 布线连接到台面，其宽度小于电子部件的宽度方向的宽度。 接线连接到电气连接图案。 电连接图案具有在电连接图案的与电子部件的宽度方向的宽度大的宽度上连接的一侧。
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公开(公告)号：US08247704B2
公开(公告)日：2012-08-21
申请号：US12503680
申请日：2009-07-15
Applicant: Chia-Nan Pai , Han-Long Chen , Ning Li , Shou-Kuo Hsu
Inventor： Chia-Nan Pai , Han-Long Chen , Ning Li , Shou-Kuo Hsu
CPC classification number: H05K1/0239 , H05K1/0245 , H05K1/0295 , H05K1/113 , H05K3/429 , H05K2201/044 , H05K2201/09254 , H05K2201/10015 , H05K2201/10545 , H05K2201/10636 , Y02P70/611 , Y10T29/4913
Abstract: A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.
Abstract translation: 母板互连装置包括顶层，底层，位于顶层上的第一和第三电子元件以及位于底层上的第二和第四电子元件。 顶层上的第一电子元件的第一端通过第一通孔连接到底层上的第二电子元件的第一端，并且顶层上的第三电子元件的第一端连接到 第四电子元件的第一端部具有第二通孔。 顶层上的两个电子元件的第二端连接到第一部分，底层上的两个电子元件的第二端连接到第二部分。
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公开(公告)号：US20120181076A1
公开(公告)日：2012-07-19
申请号：US13434162
申请日：2012-03-29
Applicant: Kota NODA , Tsutomu Yamauchi , Satoru Kawai
Inventor： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
IPC: H05K1/11
CPC classification number: H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
Abstract: A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.
Abstract translation: 一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路 所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。 所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔 和第二孔，其直径小于R1和R2中的至少一个。
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