公开(公告)号：US20190215948A1

公开(公告)日：2019-07-11

申请号：US15866301

申请日：2018-01-09

Applicant: Searete LLC

Inventor： Daniel Arnitz ,  Joseph Hagerty ,  Russell J. Hannigan ,  Guy S. Lipworth ,  David R. Nash ,  Matthew S. Reynolds ,  Yaroslav A. Urzhumov

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0206 ,  H01P7/065 ,  H02J50/20 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: According to various embodiments, heat can be dissipated from a heat producing component mounted on a first side of a printed circuit board through a securing post extending out of the first side of the printed circuit board. The securing post can be configured to attach to a heat sink through a fastening mechanism. Subsequently, the securing post can transfer heat received from the heat producing component to the heat sink as part of dissipating the heat from the heat product component. The securing post can receive heat from the heat producing component through a printed circuit board heat transfer path integrated as part of the printed circuit board. The heat transfer path can include one or more thermal vias and one or more thermally conductive layers used to transfer the heat from the heat producing component to the securing post.

公开(公告)号：US20190200446A1

公开(公告)日：2019-06-27

申请号：US16329200

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Brian J. Long

IPC: H05K1/02 ,  G06F1/20 ,  H05K7/20 ,  G06F1/18 ,  H05K1/18 ,  H05K1/14 ,  H05K3/36 ,  H01L23/367

CPC classification number: H05K1/0204 ,  G06F1/181 ,  G06F1/203 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15321 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/144 ,  H05K1/181 ,  H05K3/36 ,  H05K7/20336 ,  H05K7/20818 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10734 ,  H01L2924/014 ,  H01L2224/29099

Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

公开(公告)号：US20190021160A1

公开(公告)日：2019-01-17

申请号：US16031029

申请日：2018-07-10

Applicant: Shimadzu Corporation

Inventor： Kazuyuki HASHIZUME

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H03F3/45 ,  G01K7/16

CPC classification number: H05K1/0201 ,  G01K7/16 ,  H03F3/45071 ,  H03F3/45475 ,  H03F2200/129 ,  H03F2203/45116 ,  H03F2203/45528 ,  H03F2203/45594 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: On a circuit board, a metal thin film is formed on a surface 101 of a board body. A linear slit is formed in a metal thin film, so that the metal thin film is separated into a first region and a second region with the slit interposed therebetween. The circuit board 1 includes a heat generation source (for example, an IC) arranged in the first region and an element arranged in the second region. A current flows through the element in a direction parallel to the slit.

公开(公告)号：US20180263537A1

公开(公告)日：2018-09-20

申请号：US15728597

申请日：2017-10-10

Applicant: Abbott Diabetes Care Inc.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: A61B5/1486 ,  A61B5/1473 ,  A61B5/1468 ,  A61B5/145

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

公开(公告)号：US20180255633A1

公开(公告)日：2018-09-06

申请号：US15902071

申请日：2018-02-22

Applicant: Sony Interactive Entertainment Inc.

Inventor： Tetsufumi Nozawa ,  Shinya Tsuchida

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01R12/724 ,  H05K1/0224 ,  H05K9/0033 ,  H05K2201/0715 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: Electronic equipment includes a printed board having a front surface on which a ground pattern is formed and a shield member disposed opposed to the front surface of the printed board. The shield member has a strip-shaped region that is opposed to the ground pattern and protrudes toward the printed board, and is fastened to the printed board by screws that pass through a respective one of a plurality of screw holes made in the strip-shaped region. Either one of the shield member and the printed board has a protruding part that is formed projectingly toward the other and causes the strip-shaped region and the ground pattern to get contact with each other at a position sandwiched by adjacent two screw holes in the strip-shaped region in plan view.

公开(公告)号：US20180249585A1

公开(公告)日：2018-08-30

申请号：US15901497

申请日：2018-02-21

Applicant: Toshiba Memory Corporation

Inventor： Kazuhiro YOSHIDA

IPC: H05K5/00 ,  H05K1/18 ,  H05K5/03 ,  H05K5/04 ,  H05K5/02

CPC classification number: H05K5/0052 ,  B22C9/06 ,  G11C5/00 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0008 ,  H05K5/006 ,  H05K5/0247 ,  H05K5/03 ,  H05K5/04 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: An electronic apparatus includes a base that includes a flat portion and a side wall provided upright on a part of an outer edge of the flat portion, a printed circuit board disposed in the base and including a device, and a cover covering the base. The base includes a hole that is contiguous to the side wall and provided in the flat portion, a support portion, one end of the support portion being supported by the side wall, and a positioning member provided on the support portion and positioning the cover with respect to the base.

公开(公告)号：US10064267B2

公开(公告)日：2018-08-28

申请号：US15169311

申请日：2016-05-31

Applicant: LG Display Co., Ltd.

Inventor： UnSeung Pyun

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  G02F1/13

CPC classification number: H05K1/0259 ,  G02F1/13 ,  G02F1/133617 ,  G02F1/13452 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/092 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/10128 ,  H05K2201/10409

Abstract: A PCB underneath the display panel includes a plurality of insulation layers and one or more metal layers disposed between two adjacent insulation layers out of the plurality of insulation layers. A lower structure is disposed between the display panel and the PCB. At least a portion of a metal layer among the one or more metal layers that is most adjacent to the lower structure is exposed, and the lower structure is electrically connected to the exposed portion of the metal layer. Such exposed portion of the metal layer is electrically connected to the lower structure, so that the area where the PCB is referenced to the ground potential is increased. As a result, residual voltage, residual current in the PCB and noise caused by electromagnetic fields generated thereby can be reduced.

公开(公告)号：US20180220533A1

公开(公告)日：2018-08-02

申请号：US15833527

申请日：2017-12-06

Applicant: DR. Johannes Heidenhain GmbH

Inventor： Lutz Rissing ,  Marc Oliver Tiemann ,  Alexander Frank

IPC: H05K1/16 ,  H05K1/02 ,  H01R12/63 ,  H01R4/02 ,  H01R4/34 ,  H05K1/18 ,  G01D5/20 ,  G01D5/14 ,  G01D5/16 ,  G01D5/24 ,  G01D5/26

CPC classification number: H05K1/165 ,  G01D5/142 ,  G01D5/16 ,  G01D5/20 ,  G01D5/2013 ,  G01D5/24 ,  G01D5/26 ,  H01L21/00 ,  H01R4/023 ,  H01R4/027 ,  H01R4/34 ,  H01R12/63 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: A sensor for measuring the position of a component that is displaceable relative to the sensor, includes a circuit board and a metal body. The circuit board includes a first region in which a detector is located, and a second region in which electronic components are located, which are electrically connected to the detector. The metal body includes a first layer having a first area as well as a second layer having a second area. The first region of the circuit board is fixed in place in the first area and the second region of the circuit board is fixed in place in the second area. The first layer and the second layer of the metal body are situated between the first region and the second region of the circuit board so that the first region is located in a first plane and the second region is located in a second plane.

公开(公告)号：US20180220521A1

公开(公告)日：2018-08-02

申请号：US15421709

申请日：2017-02-01

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/40

CPC classification number: H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K1/0203 ,  H05K1/0209 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

公开(公告)号：US09989235B2

公开(公告)日：2018-06-05

申请号：US14373971

申请日：2013-01-17

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Waltherus Emericus Johannes Van Gompel ,  Winand Hendrik Anna Maria Friederichs

IPC: F21V19/00 ,  F21V29/70 ,  H05K3/00 ,  F21V17/10 ,  F21V17/12 ,  F21V29/00 ,  F21Y115/10

CPC classification number: F21V29/70 ,  F21V17/101 ,  F21V17/12 ,  F21V19/005 ,  F21V19/0055 ,  F21Y2101/02 ,  F21Y2115/10 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409

Abstract: A LED module comprising at least one LED mounted on a thermo-conducting flat substrate, said LED module being adapted for being used together with a TIM and a heat sink, said thermo-conducting flat substrate being adapted for spreading heat from said LED module through said TIM to said heat sink, said thermo-conducting flat substrate comprising a plurality of fastener eyes, each of said fastener eyes being adopted for receiving a fastener such as a screw or a rivet for mounting said thermo-conducting flat substrate to said heat sink, wherein said thermo-conducting flat substrate comprises integrally formed deformable zones in vicinity of each of said plurality of fastener eyes, said integrally formed deformable zones being coherent with said thermo-conducting flat substrate.