公开(公告)号：US09531209B2

公开(公告)日：2016-12-27

申请号：US14822478

申请日：2015-08-10

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H01L21/44 ,  H02J7/00 ,  H01L23/64 ,  H01L23/552 ,  H01L23/50 ,  H01L23/498 ,  H01L23/36 ,  H01L23/367 ,  H01L25/16 ,  H01L25/065 ,  H02J7/34 ,  H01L23/00 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16

CPC classification number: H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1624 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H02J7/0042 ,  H02J7/0052 ,  H02J7/345 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/0999 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/014 ,  H01L2924/00

Abstract: Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

公开(公告)号：US20160359426A1

公开(公告)日：2016-12-08

申请号：US15103617

申请日：2014-12-11

Applicant: ROMPOWER ENERGY SYSTEMS INC.

Inventor： Ionel Jitaru ,  Ian Poynton ,  Enrique Velasco

IPC: H02M7/00 ,  H02M7/21 ,  H05K1/14 ,  H05K1/02 ,  H05K9/00 ,  H05K1/18

CPC classification number: H02M7/003 ,  H02M7/21 ,  H05K1/0203 ,  H05K1/0256 ,  H05K1/14 ,  H05K1/181 ,  H05K3/366 ,  H05K9/0071 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10166

Abstract: Meeting todays requirement in power supply technology demands significant technological advancement in optimizing circuit topology, components and materials, thermal and packaging designs. These requirements are being pushed mainly by continuously increasing power density and efficiency requirements. Ultimately, these trends will come to a point whereby limitations from the above mentioned technological advancements is dependent on one of the above, which is the packaging design. To realize this dependence, we need to look at the growing power systems for modern equipment out there. Let us enumerate some of the available AC adapters in terms of power densities of a 45 W adapter. Firstly, square type architecture introduced by Apple is about 7 W/in3, considering the packaging has a profile limitation whereby its AC plug is removable thus occupying relatively bigger chunk of the volume. The next one is by Asus of similar profile to Apple incorporating the AC Plug eliminating the socket assembly in the packaging; which packs about 9 W/in3. Lastly, the typical rectangular profile by Eos which is about 7 W/in3. As for this particular embodiment it is about 40% smaller in profile, in contrast to the 45 W Apple packaging, with increase power density of about 12 W/in3. Packaging design method plays a great role in achieving the above requirements for a very high density converters.

Abstract translation: 电源技术的今天要求在优化电路拓扑，组件和材料，热和封装设计方面需要显着的技术进步。 这些要求主要是通过不断提高功率密度和效率要求来推动的。 最终，这些趋势将会出现，上述技术进步的限制取决于上述之一，即包装设计。 为了实现这种依赖，我们需要看现在的设备不断增长的电力系统。 在45 W适配器的功率密度方面，我们列举一些可用的交流适配器。 首先，Apple推出的Square型架构约为7W / in3，考虑到封装具有配置限制，其AC插头可拆卸，因此占据相对较大的块体积。 接下来的一个是华硕与苹果相似的配置，包括交流插头，消除了包装中的插座组件; 其中包装约9 W / in3。 最后，Eos的典型矩形轮廓约为7 W / in3。 对于这个特定的实施例，与45W苹果包装相比，其功率密度增加约为12W / in3，约为40％。 包装设计方法对于实现上述高密度转换器的要求起着重要作用。

公开(公告)号：US20160341368A1

公开(公告)日：2016-11-24

申请号：US15114831

申请日：2015-01-27

Applicant: SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD ,  SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD ,  JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO. , LTD

Inventor： Bishou ChEN ,  Li XU ,  Peng WANG ,  Xiaoliang HE ,  Sheng LI ,  Haibo LIU

IPC: F21K9/232 ,  F21V29/74 ,  F21V29/83 ,  F21K9/238 ,  B05D3/02 ,  F21V17/10 ,  F21K9/237 ,  F21V3/02 ,  F21K9/235 ,  F21V19/00 ,  F21V3/04 ,  F21V23/00

CPC classification number: F21K9/232 ,  B05D3/0254 ,  F21K9/20 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21V3/02 ,  F21V3/061 ,  F21V3/10 ,  F21V17/101 ,  F21V19/006 ,  F21V23/00 ,  F21V23/005 ,  F21V29/506 ,  F21V29/74 ,  F21V29/83 ,  F21V29/86 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/097 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base, an LED light unit, and a lamp shade. The LED light-emitting unit and the lamp shade are arranged on the base. The lamp shade covers the LED light-emitting unit inside. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 μm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000° C. until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling.

Abstract translation: 提供了一种LED灯装置及其电路制备方法。 LED灯装置包括基座，LED灯单元和灯罩。 LED发光单元和灯罩布置在基座上。 灯罩内置LED发光单元。 电路准备方法包括以下步骤：在其表面上提供具有三维结构的物理实体的基座; 通过可编程涂层设备，手动涂层或组合模式在基底表面上涂覆电路层，其中电路层是含有金属材料的液体或粉末涂层，电路层的厚度为20μm以上; 在100-1,000℃的高温下烘烤涂覆有电路层的基底，直到电路层干燥; 并在冷却后获得具有三维电路的基底。

公开(公告)号：US09448678B2

公开(公告)日：2016-09-20

申请号：US14403522

申请日：2013-05-28

Applicant: NISSHA PRINTING CO., LTD.

Inventor： Katsumi Tokuno ,  Takanori Yoshida ,  Yoshihiro Nii ,  Takako Ueno ,  Yuhei Abe ,  Tsunetomo Aisaka ,  Eiko Seki ,  Yoko Kawashima ,  Kaori Maenaka ,  Kazumasa Takahashi

IPC: G06F3/044 ,  H01R4/04 ,  H01Q1/40 ,  H01R43/24 ,  H01Q1/24 ,  B29C45/14 ,  H05K3/10 ,  H05K7/02 ,  G06F1/16 ,  H05K3/00 ,  H05K3/40 ,  B29L31/34 ,  H05K1/02

CPC classification number: G06F3/044 ,  B29C45/14065 ,  B29C45/14467 ,  B29C45/14639 ,  B29C2045/14114 ,  B29L2031/3437 ,  B29L2031/3481 ,  G06F1/16 ,  G06F2203/04112 ,  H01Q1/243 ,  H01Q1/40 ,  H01R4/04 ,  H01R43/24 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/101 ,  H05K3/4015 ,  H05K7/02 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10318

Abstract: A capacitive transparent touch sheet has excellent visibility and durability without changing the sensitivity, size, or the like of a touch panel. The capacitive transparent touch sheet comprises: a first conductive sheet including a first substrate to be adhered to the hard substrate, and a plurality of strip shaped first electrodes formed separately on a surface of the first substrate to be adhered to the hard substrate; a second conductive sheet including a second substrate disposed to oppose the first substrate, a plurality of strip shaped second electrodes formed on a surface of the second substrate opposing the first substrate and arranged to cross the first electrodes, and at least one insulation part formed continuously with the second electrodes, the at least one insulation part having a thickness the same as that of the second electrodes; and an adhesive layer that bonds the first and second conductive sheets together.

Abstract translation: 电容式透明触摸片具有优异的可视性和耐久性，而不改变触摸面板的灵敏度，尺寸等。 电容性透明触摸片包括：第一导电片，其包括要粘附到硬质基底的第一基底和分别形成在第一基底的表面上以粘附到硬质基底的多个条形第一电极; 第二导电片，包括与第一衬底相对设置的第二衬底;多个条形第二电极，形成在第二衬底的与第一衬底相对的表面上并布置成与第一电极交叉;以及至少一个绝缘部分，连续形成 与所述第二电极，所述至少一个绝缘部分具有与所述第二电极相同的厚度; 以及将第一和第二导电片粘合在一起的粘合剂层。

公开(公告)号：US09258918B2

公开(公告)日：2016-02-09

申请号：US12676935

申请日：2008-08-04

Applicant: Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

Inventor： Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

IPC: H05K7/00 ,  H05K13/00 ,  H05K5/06 ,  B60R16/023 ,  H05K5/00 ,  F16H61/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K5/069 ,  B60R16/0239 ,  F16H61/0006 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/365 ,  H05K3/4691 ,  H05K5/0082 ,  H05K2201/0999 ,  H05K2201/10598 ,  H05K2203/1147 ,  Y10T29/49002

Abstract: A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

Abstract translation: 用于集成控制电子器件的壳体概念，包括壳体底部，安装有中央控制电子器件的电子部件的电路载体，以及作为中央控制电子设备和外围部件之间的电连接的信号和电流分配部件。 壳体底部构造为盆形，用于中央控制电子器件的电子部件的电路载体设置在其中，使得其可以在至少一个向上弯曲的边缘区域上电连接到信号和电流分布部件 设置在同一经过接触点上方，并且其中壳体底部也可以与信号和电流分布部件周向连接。

公开(公告)号：US20160007495A1

公开(公告)日：2016-01-07

申请号：US14322295

申请日：2014-07-02

Applicant: GOOGLE TECHNOLOGY HOLDINGS LLC

Inventor： Allen B. McKittrick

IPC: H05K7/02 ,  H05K1/02 ,  G06F1/16

CPC classification number: H05K1/02 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1658 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: The present invention provides an assembly for attaching a circuit substrate to a housing. The assembly includes a fastener having a first end and a second end opposite the first end, where the first end is larger than a second end. The assembly further includes a circuit substrate including a through hole having a first opening on a first side of the circuit substrate and a second opening on a second side of the circuit substrate, the through hole for receiving the fastener. The assembly still further includes a mounted structure attached to the circuit substrate, which at least partially covers the second opening of the through hole on the second side of the circuit substrate, wherein the mounted structure restricts the size of an exposed portion of the second opening of the through hole. The second end of the fastener, which is received in the through hole of the circuit substrate is sized to extend through the through hole, as well as the restricted size of the exposed portion of the second opening restricted by the mounted structure. The larger first end of the fastener is sized to extend through the through hole, but not through the restricted size of the exposed portion of the second opening. The assembly further includes a housing having a boss adapted and aligned for receiving the second end of the fastener after the second end of the fastener has been received by the through hole of the circuit substrate, and extends therethrough, wherein the boss is adapted to grip the received second end of the fastener.

Abstract translation: 本发明提供了一种用于将电路基板附接到壳体的组件。 该组件包括具有第一端和与第一端相对的第二端的紧固件，其中第一端大于第二端。 组件还包括电路基板，其包括通孔，该通孔在电路基板的第一侧上具有第一开口，在电路基板的第二侧具有第二开口，用于接收紧固件的通孔。 组件还包括附接到电路基板的安装结构，其至少部分地覆盖电路基板的第二侧上的通孔的第二开口，其中安装结构限制第二开口的暴露部分的尺寸 的通孔。 容纳在电路基板的通孔中的紧固件的第二端的尺寸设置成延伸穿过通孔，以及限制由安装结构限制的第二开口的暴露部分的尺寸。 紧固件的较大的第一端的尺寸被设计成延伸穿过通孔，但不能穿过第二开口的暴露部分的受限尺寸。 所述组件还包括壳体，所述壳体具有凸台，所述凸台适于并对准以在所述紧固件的第二端被所述电路基板的通孔接收并且延伸穿过所述凸台之后接收所述紧固件的所述第二端，其中所述凸台适于夹紧 接收的紧固件的第二端。

公开(公告)号：US20150282304A1

公开(公告)日：2015-10-01

申请号：US14226593

申请日：2014-03-26

Applicant: Apple Inc.

Inventor： Colin M. Ely ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf ,  Stephen Brian Lynch

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0281 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0305 ,  H05K2201/055 ,  H05K2201/057 ,  H05K2201/09109 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10128 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1194 ,  H05K2203/1327 ,  H05K2203/1366

Abstract: An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

Abstract translation: 电子设备可以设置有印刷电路。 电气部件可以使用由印刷电路中的金属迹线形成的信号路径互连。 印刷电路可以包括具有弯曲构型的柔性印刷电路。 柔性印刷电路可以设置有整体弯曲保持结构。 弯曲保持结构可以由聚合物层，焊料层，由金属或聚合物形成的加强件形成，金属或聚合物通过粘合剂附接到柔性印刷电路层，保形塑料涂层覆盖弯曲处的暴露的金属迹线，金属加强件 具有螺孔，形状记忆合金，柔性印刷电路电介质基底层的一部分，屈服值下降的伸长率或这些结构的组合。 弯曲保持结构在弯曲的柔性印刷电路中保持弯曲。

公开(公告)号：US20150275906A1

公开(公告)日：2015-10-01

申请号：US14555276

申请日：2014-11-26

Applicant: DELTA ELECTRONICS, INC.

Inventor： Sheng-Wei YEH ,  Chiu-Kung CHEN ,  Cheng-Chieh LIU ,  Shao-Chang TU

IPC: F04D25/06 ,  F04D29/32 ,  F04D29/54 ,  F04D19/00

CPC classification number: H05K3/182 ,  F04D17/16 ,  F04D19/002 ,  F04D25/0693 ,  F04D29/281 ,  F04D29/325 ,  F04D29/541 ,  F04D29/626 ,  H05K3/105 ,  H05K3/341 ,  H05K2201/0215 ,  H05K2201/0999 ,  Y10T29/49147

Abstract: A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a part surface of the housing and forming a layout area and an extended circuit on the housing, wherein one terminal of the extended circuit connects to the layout area; disposing a first signal connecting structure on the housing, wherein the first signal connecting structure connects to the other terminal of the extended circuit; and disposing a metal layer on the layout area and the extended circuit.

Abstract translation: 薄风扇的制造方法包括以下步骤：提供包含多个金属颗粒的塑料材料; 处理塑料材料以形成外壳; 去除所述壳体的部分表面并且在所述壳体上形成布局区域和扩展电路，其中所述扩展电路的一个端子连接到所述布局区域; 在壳体上设置第一信号连接结构，其中第一信号连接结构连接到扩展电路的另一端; 并在布局区域和扩展电路上设置金属层。

公开(公告)号：US20150229025A1

公开(公告)日：2015-08-13

申请号：US14620108

申请日：2015-02-11

Applicant: Pulse Finland OY

Inventor： Esa Kalistaja ,  Elli Galla ,  Dan Kuehler ,  Winthrop Childers

IPC: H01Q9/04 ,  H05K3/32

CPC classification number: H01Q1/38 ,  H05K3/125 ,  H05K2201/0245 ,  H05K2201/0999 ,  H05K2201/10098

Abstract: A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a “thick” antenna element can be formed in one pass of a dispensing head or nozzle, thereby reducing manufacturing cost and increasing manufacturing efficiency.

Abstract translation: 用于电子设备的诸如天线的导电元件，包括诸如蜂窝电话，智能电话，个人数字助理（PDA），膝上型计算机和无线平板电脑的移动设备。 在一个示例性方面，本公开涉及使用导电流体的沉积形成的导电天线以及用于形成导电流体的方法和设备。 在一个实施例中，可以在分配头或喷嘴的一次通道中形成“厚”天线元件，从而降低制造成本并提高制造效率。

公开(公告)号：US20150077951A1

公开(公告)日：2015-03-19

申请号：US14382516

申请日：2013-03-01

Applicant: Novalia Ltd

Inventor： Kate Stone

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/147 ,  H01L23/145 ,  H01L23/4985 ,  H01L2224/16 ,  H05K1/0306 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/361 ,  H05K2201/0314 ,  H05K2201/0999 ,  H05K2201/10151 ,  H05K2201/10477 ,  H05K2203/1545

Abstract: A circuit board assembly is described. The circuit board assembly (1) comprises a module (2) which comprises a first flexible substrate (7) and a device mounted on the first flexible substrate and a circuit board (3) which comprises a second flexible substrate (4), wherein the module is mounted on the circuit board.

Abstract translation: 描述电路板组件。 电路板组件（1）包括模块（2），其包括第一柔性基板（7）和安装在第一柔性基板上的装置和包括第二柔性基板（4）的电路板（3），其中 模块安装在电路板上。