Aqueous electroless nickel plating bath and method of using the same

    公开(公告)号:US11685999B2

    公开(公告)日:2023-06-27

    申请号:US14293216

    申请日:2014-06-02

    CPC classification number: C23C18/36

    Abstract: An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

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