公开(公告)号：US09474160B2

公开(公告)日：2016-10-18

申请号：US14400261

申请日：2012-05-18

Applicant: Logan Peter Palmer

Inventor： Logan Peter Palmer

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/28 ,  H05K9/00 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/189 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/4691 ,  H05K9/0022 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/042 ,  H05K2201/055 ,  H05K2201/056 ,  Y10T29/49124

Abstract: Printed circuit board apparatus with electromagnetic interference shields and methods of making the same.

Abstract translation: 具有电磁干扰屏蔽的印刷电路板装置及其制造方法。

公开(公告)号：US20160219354A1

公开(公告)日：2016-07-28

申请号：US15004669

申请日：2016-01-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Il Nam KIM ,  Won Sang PARK ,  Yi Joon AHN ,  Byeong-Hee WON

IPC: H04R1/02 ,  H05K1/02 ,  G02B5/30 ,  H05K1/18

CPC classification number: H04R1/028 ,  G02B5/3033 ,  H04R1/025 ,  H04R2201/029 ,  H04R2499/15 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.

Abstract translation: 提供了一种扬声器和麦克风集成显示面板，包括：显示面板，具有显示区域和围绕显示区域的非显示区域; 以及安装成对应于非显示区域中的空气孔的同时可转换的薄膜型扬声器或薄膜式麦克风，其中显示面板和胶片型扬声器或薄膜式麦克风至少部分地被集成，以便 被驱动连接。

公开(公告)号：US20160163428A1

公开(公告)日：2016-06-09

申请号：US14559057

申请日：2014-12-03

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： STEPHEN C. BLACKMER ,  STEVEN A. LIBURDI

IPC: H01B13/00

CPC classification number: H01B13/0036 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/2027 ,  Y10T29/532

Abstract: An apparatus is configured to shape a flat flexible cable (FFC). The apparatus is configured such that a first end and a second end of the FFC can be positioned, respectively, at a first location and a second location of a circuit board assembly (CBA). The apparatus includes a radiused portion configured to determine a bend radius of the FFC when the FFC is installed into the apparatus. The apparatus also includes a clamp portion configured to urge the FFC around the radiused portion when the FFC is installed into the apparatus.

Abstract translation: 一种装置被配置成使扁平柔性电缆（FFC）成形。 该装置被配置为使得FFC的第一端和第二端分别位于电路板组件（CBA）的第一位置和第二位置处。 该装置包括被配置为当FFC被安装到设备中时确定FFC的弯曲半径的圆角部分。 该装置还包括夹紧部分，其构造成当FFC安装到该装置中时，该FFC围绕圆弧部分推动FFC。

公开(公告)号：US09226689B2

公开(公告)日：2016-01-05

申请号：US13751032

申请日：2013-01-25

Applicant: Medtronic Xomed, Inc.

Inventor： Brad Jacobsen ,  Bruce M. Burg ,  Orey G. Block ,  Andrew Bzostek ,  Vince J. Doerr ,  Abhishek Jain ,  Brandon Merkl ,  Joseph Thomas Cilke

IPC: A61B5/055 ,  A61B5/06 ,  H05K1/02 ,  A61B19/00 ,  A61M1/00 ,  A61B17/24 ,  A61B17/00

CPC classification number: A61B34/20 ,  A61B5/062 ,  A61B5/065 ,  A61B17/24 ,  A61B2017/00946 ,  A61B2034/2051 ,  A61B2034/2072 ,  A61B2090/397 ,  A61B2090/3983 ,  A61B2217/005 ,  A61B2562/166 ,  A61M1/008 ,  A61M2205/3561 ,  A61M2205/3576 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/056 ,  H05K2201/2027

Abstract: A surgical instrument is disclosed having an elongated body portion having a proximal end and a distal end. The body portion is formed from a plastically deformable material such that the body portion can be bent between the proximal and distal ends from a first configuration to a second bent configuration and maintains the bent configuration. A flexible circuit having at least a pair of lead wires disposed around the body portion. The pair of lead wires are configured to conform to the bent configuration of the body portion such that they do not break during bending of the body portion. A tracking device adapted to cooperate with a navigation system to track the distal end of the instrument is coupled to the flexible circuit.

Abstract translation: 公开了一种具有细长主体部分的手术器械，其具有近端和远端。 主体部分由可塑性变形的材料形成，使得主体部分可以在近端和远端之间从第一构造弯曲到第二弯曲构造并且保持弯曲构型。 一种柔性电路，具有至少一对设置在主体部分周围的引线。 一对引线构造成符合主体部分的弯曲构造，使得它们在主体部分的弯曲期间不会断裂。 适于与导航系统协作跟踪仪器的远端的跟踪装置被耦合到柔性电路。

公开(公告)号：US09147875B1

公开(公告)日：2015-09-29

申请号：US14671814

申请日：2015-03-27

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown

IPC: B29C65/48 ,  B32B37/26 ,  B32B38/04 ,  B32B38/10 ,  H01M4/139 ,  H05K3/00 ,  H05K3/40 ,  H05K3/02 ,  H01M4/04

CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

Abstract translation: 提供了用于互连电池单元阵列的互连电路以及形成这些互连电路的方法以及将这些电路连接到电池单元。 互连电路可以包括导电层和一个或多个绝缘层。 导电层可以用限定接触焊盘的开口图案化，使得每个焊盘用于连接到不同的电池单元端子。 在一些实施例中，每个接触垫通过由与接触垫相同的导电层形成的可熔连接件附接到导电层的其余部分。 熔断链路控制来自该接触焊盘的电流。 绝缘层被层压到导电层上并提供对接触垫的支撑。 绝缘层也可以用开口图案化，这允许通过绝缘层在接触焊盘和电池端子之间形成电连接。

公开(公告)号：US20150270227A1

公开(公告)日：2015-09-24

申请号：US14218384

申请日：2014-03-18

Applicant: Apple Inc.

Inventor： Richard H. Dinh ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H01L23/552 ,  H01L23/58 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H01L23/538 ,  H05K1/18

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K1/0218 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09145 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/014 ,  H01L2924/00

Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。

公开(公告)号：US20150243937A1

公开(公告)日：2015-08-27

申请号：US14712024

申请日：2015-05-14

Applicant: Apple Inc.

Inventor： Richard Hung Minh Dinh ,  Richard P. Howarth ,  Peggy J. Jensen ,  John Chan ,  Patrick Kwok-Yeung Ng

IPC: H01M2/02 ,  B41F17/00

CPC classification number: H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

Abstract translation: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 散热片和其他导热结构可用于去除多余的部件热量。 也可以在电子设备中提供结构以检测湿气。 集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

公开(公告)号：US20150223327A1

公开(公告)日：2015-08-06

申请号：US14684857

申请日：2015-04-13

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Shunjiro TAKEMORI ,  Shigeru NARAKINO

IPC: H05K1/02

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0213 ,  H05K1/141 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/0314 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/178

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

Abstract translation: 终端单元包括主板，在主板上实现的电子部件，覆盖在电子部件上的子板，以及围绕电子部件设置在主板和子板之间的框架部件。 柔性印刷电路覆盖框架构件的壁部的外侧，并且被从壁部的上侧和下侧卷绕在框架构件上以覆盖壁部的内侧的至少一部分。 形成在柔性印刷电路上的布线图案电连接到电子部件，并且如果布线图案被切断或短路，则存储在电子部件上的要被保护的信息变得不可读。

公开(公告)号：US20150136448A1

公开(公告)日：2015-05-21

申请号：US14459134

申请日：2014-08-13

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kazuyoshi Sasaki

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/118 ,  H05K1/025 ,  H05K1/0281 ,  H05K3/361 ,  H05K3/403 ,  H05K2201/056 ,  H05K2201/0989 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: According to one embodiment, a flexible printed wiring board includes a first conductor layer formed on the first surface of an insulation base, a second conductor layer formed on the second surface of the insulation base, a first insulation layer covering the first conductor layer, and a second insulation layer covering the second conductor layer. The first insulation layer has an opening formed in a position corresponding to a connecting terminal portion to expose the first conductor layer. A metal layer is provided in a region ranging from the connecting terminal portion to a bending presumed portion. The metal layer is positioned behind the opening between the second surface and the second insulation layer to avoid the first conductor layer.

Abstract translation: 根据一个实施例，柔性印刷布线板包括形成在绝缘基底的第一表面上的第一导体层，形成在绝缘基底的第二表面上的第二导体层，覆盖第一导体层的第一绝缘层，以及 覆盖第二导体层的第二绝缘层。 第一绝缘层具有形成在与连接端子部分相对应的位置以露出第一导体层的开口。 在从连接端子部到弯曲部的范围内设置有金属层。 金属层位于第二表面和第二绝缘层之间的开口之后，以避免第一导体层。

公开(公告)号：US08998450B2

公开(公告)日：2015-04-07

申请号：US13384541

申请日：2010-06-16

Applicant: Thomas Preuschl

Inventor： Thomas Preuschl

IPC: F21S4/00 ,  F21V21/14 ,  H05K1/03 ,  H05K3/20 ,  H05K1/18 ,  F21Y111/00 ,  F21S8/08 ,  F21W131/103 ,  F21Y101/02 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/189 ,  F21S8/08 ,  F21W2131/103 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y10T29/49128 ,  Y10T156/10 ,  Y10T156/1002

Abstract: A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).

Abstract translation: 一种光模块（1; 14），包括用于安装至少一个半导体源（5）的载体（8,10），特别是发光二极管，其中：所述载体（8,10）具有柔性印刷电路板 （10）中，柔性印刷电路板（10）面对至少一个基板（8）接合，并且载体（8,10）可以沿着至少一个预定弯曲线（3; 3a）弯曲 -3e），所述基板（8）可以沿着所述至少一条弯曲线（3,3a-3e）弯曲，所述基板（8）沿着所述弯曲线（3; 3a-3e）具有至少一个切口（9） 3a-3e）和柔性印刷电路板（10）具有至少一个穿过至少一个切口（9）的条带（11; 15）。