公开(公告)号：US20180166203A1

公开(公告)日：2018-06-14

申请号：US15832415

申请日：2017-12-05

Applicant: Astec International Limited

Inventor： Kwong Kei CHIN

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H01F41/02

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F27/29 ,  H01F41/02 ,  H01F2027/2819 ,  H05K1/0256 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/1003

Abstract: According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.

公开(公告)号：US09980388B2

公开(公告)日：2018-05-22

申请号：US14974242

申请日：2015-12-18

Applicant: California Institute of Technology

Inventor： Yu-Chong Tai ,  Han-Chieh Chang

IPC: A61N1/36 ,  H05K1/18 ,  A61N1/05 ,  H05K3/06

CPC classification number: H05K1/189 ,  A61N1/0543 ,  A61N1/36046 ,  H05K3/064 ,  H05K2201/0154 ,  H05K2201/052 ,  H05K2201/1003 ,  H05K2201/10151

Abstract: A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array.

公开(公告)号：US09974158B2

公开(公告)日：2018-05-15

申请号：US15410081

申请日：2017-01-19

Applicant: Qorvo US, Inc.

Inventor： Tarak A. Railkar ,  Kevin J. Anderson ,  Walid M. Meliane

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L25/00 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/144 ,  H05K1/18 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

公开(公告)号：US09972599B2

公开(公告)日：2018-05-15

申请号：US14558955

申请日：2014-12-03

Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.

Inventor： Shih-Ping Hsu ,  Chao-Chung Tseng

IPC: H05K1/18 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L25/16 ,  H01L25/00 ,  H01L23/538 ,  H05K3/46 ,  H01L23/28 ,  H01L23/29 ,  H05K3/00 ,  H01L23/498 ,  H01L21/48 ,  H05K1/16 ,  H05K3/28 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16112 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2924/15153 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/183 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/3431 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/10 ,  H05K2201/10007 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10545 ,  Y10T29/49131 ,  H01L2924/014

Abstract: A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming up plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

公开(公告)号：US20180131330A1

公开(公告)日：2018-05-10

申请号：US15808014

申请日：2017-11-09

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Naoki ITABASHI

IPC: H03F1/14 ,  H03F3/45 ,  H03F3/54 ,  H05K1/18 ,  H05K1/11 ,  H01F27/29

CPC classification number: H03F1/14 ,  H01F27/29 ,  H01F2005/006 ,  H03F3/245 ,  H03F3/45475 ,  H03F3/45928 ,  H03F3/54 ,  H03F3/68 ,  H03F2200/391 ,  H03F2200/42 ,  H03L7/0807 ,  H04B10/50 ,  H04B10/502 ,  H04B10/504 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An amplifier includes a printed circuit board that includes an output terminal for outputting a electrical signal to an outside and a bias terminal for receiving a bias of the electrical signal from the outside, and an integrated circuit, a capacitor, an inductor, and a ferrite bead element mounted on the printed circuit board. The integrated circuit includes a driving circuit and an output end, and outputs the electrical signal generated by the driving circuit from the output end. The capacitor is connected between the output end and the output terminal A series circuit including the inductor and the ferrite bead element connected to each other in series, the inductor is connected to the output end, and the ferrite bead element is connected to the bias terminal.

公开(公告)号：US20180122547A1

公开(公告)日：2018-05-03

申请号：US15337180

申请日：2016-10-28

Applicant: XFMRS, Inc,

Inventor： Tung Kong Luk ,  Yu kun Liao

IPC: H01F27/04 ,  H01R12/57 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H01F27/027 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10689 ,  H05K2201/10765

Abstract: An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.

公开(公告)号：US20180110123A1

公开(公告)日：2018-04-19

申请号：US15844107

申请日：2017-12-15

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  David Jew ,  Joe Meyer ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.

公开(公告)号：US09942987B2

公开(公告)日：2018-04-10

申请号：US15229354

申请日：2016-08-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Yoon ,  Dong Hwan Lee ,  Young Ghyu Ahn

IPC: H01F27/02 ,  H01F5/00 ,  H01F27/28 ,  H05K1/18 ,  H01F27/29 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/085 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/1003 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A coil component includes: an internal coil; a magnetic body having the internal coil embedded therein, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes connected to the internal coil and disposed on outer surfaces of the magnetic body. 0

公开(公告)号：US09939455B2

公开(公告)日：2018-04-10

申请号：US15436051

申请日：2017-02-17

Applicant: Roche Diagnostics Operations, Inc.

Inventor： Hans Schneider ,  Christian Riether

IPC: B65G54/02 ,  G01N35/04 ,  H01F5/04 ,  H05K3/32 ,  H01F7/20

CPC classification number: G01N35/04 ,  B65G54/02 ,  G01N2035/0477 ,  H01F5/04 ,  H01F7/206 ,  H05K3/325 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10962

Abstract: A laboratory sample distribution system and to a laboratory automation system comprising a printed circuit board arrangement and a coil are presented. The printed circuit board arrangement and the coil are configured such that assembly and maintenance of the laboratory automation system are greatly simplified.

公开(公告)号：US20180092212A1

公开(公告)日：2018-03-29

申请号：US15702046

申请日：2017-09-12

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Curtis C. Mead ,  Scott D. Morrison ,  Giancarlo F. De La Cruz ,  Lin Chen ,  Albert Wang ,  Brad W. Simeral

IPC: H05K1/18 ,  H05K3/34 ,  H03H7/01 ,  H03H7/38 ,  H03H1/00

CPC classification number: H05K1/181 ,  H01F27/29 ,  H01G2/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H01G4/40 ,  H03H1/00 ,  H03H7/0115 ,  H03H7/38 ,  H03H2001/0085 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10515 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.