公开(公告)号：US09072176B2

公开(公告)日：2015-06-30

申请号：US13904000

申请日：2013-05-28

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Yuan-Yi Lin

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/10598 ,  H01L2924/00

Abstract: An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board.

Abstract translation: 将散热装置的组装结构应用于电路板。 发电单元设置在电路板的一侧。 散热装置的组装结构包括散热单元，至少一个闩锁构件和至少一个保持构件。 散热单元安装在发热单元的一侧，该侧远离电路板。 从散热单元的边缘向外延伸的至少一个闩锁部分。 闩锁构件固定地布置在电路板上并形成有至少一个开口和至少一个穿孔。 闩锁部分相应地锁定在开口中。 弹性构件安装在保持构件上。 保持构件相应地穿过穿孔，以将闩锁构件固定在电路板上。

公开(公告)号：US20150173192A1

公开(公告)日：2015-06-18

申请号：US14405094

申请日：2013-05-23

Applicant: SAGEMCOM BROADBAND SAS

Inventor： Stephane Kohn

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.

Abstract translation: 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设有螺纹孔，另一端设置有横向支承表面，该横向支承表面具有从其突出的平滑的定中心钉，所述栓具有纵向外部通道， 其长度为横向支承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔件的模块。

公开(公告)号：US20150118872A1

公开(公告)日：2015-04-30

申请号：US14591637

申请日：2015-01-07

Applicant: IDEAL Industries, Inc.

Inventor： Benjamin David Swedberg

IPC: H01R12/51 ,  H01R12/73 ,  H01R12/52

CPC classification number: H01R12/515 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R4/4818 ,  H01R12/52 ,  H01R12/523 ,  H01R12/7005 ,  H01R12/732 ,  H01R13/64 ,  H05K1/117 ,  H05K1/142 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/09172 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A connector for electrically connecting a first printed circuit board (PCB) with a second PCB wherein, in one example, the connector includes a housing having a keyed feature adapted to mate with a correspondingly keyed feature provided to each of the first and second PCBs and at least one connecting terminal carried by the housing having at least partially exposed opposed ends each of which electrically engages a contact pad formed on an underside of the respective PCBs. The connecting terminal may be arranged to accept a conductor and to thereby electrically couple the conductor to the first and second PCBs.

Abstract translation: 一种用于将第一印刷电路板（PCB）与第二PCB电连接的连接器，其中在一个示例中，所述连接器包括壳体，所述壳体具有适于与提供给所述第一和第二PCB中的每一个的相应的键入特征配合的键合特征，以及 由壳体承载的至少一个连接端子具有至少部分暴露的相对端，每个端部电接合形成在各个PCB的下侧上的接触焊盘。 连接端子可以被布置成接受导体，从而将导体电耦合到第一和第二PCB。

公开(公告)号：US20150083456A1

公开(公告)日：2015-03-26

申请号：US14372871

申请日：2013-01-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Tony Y. Chen ,  Song Lu ,  Mohiuddin Ahmed

IPC: H02G15/007

CPC classification number: H02G15/007 ,  F16F1/376 ,  H05K1/0215 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10606

Abstract: The present invention is a conductive isolator including a damping structure, a conductive bridge component positioned within the damping structure, axial contact points between the damping structure and the conductive bridge component and radial contact points between the damping structure and the conductive bridge component.

Abstract translation: 本发明是一种导电隔离器，其包括阻尼结构，位于阻尼结构内的导电桥组件，阻尼结构和导电桥组件之间的轴向接触点以及阻尼结构与导电桥组件之间的径向接触点。

公开(公告)号：US20150082822A1

公开(公告)日：2015-03-26

申请号：US14395644

申请日：2013-04-26

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Junichi Teraki ,  Akihiko Oguri

IPC: H05K7/20

CPC classification number: H05K7/2029 ,  F24F1/24 ,  F25B13/00 ,  F25B31/006 ,  F25B2313/0254 ,  F25B2700/21153 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/0271 ,  H05K3/22 ,  H05K3/306 ,  H05K3/3468 ,  H05K7/20936 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10409 ,  H05K2203/044 ,  H01L2924/00

Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.

Abstract translation: 设置有电源模块的印刷电路板，作为制冷剂回路的制冷剂配管的冷却管，以及安装在电源模块和冷却管上的冷却器。 使用冷却器连接到印刷电路板并支撑在印刷电路板上的支撑部件，以及固定部件，通过该固定部件将印刷电路板固定到壳体并支撑在壳体上。

公开(公告)号：US20150076570A1

公开(公告)日：2015-03-19

申请号：US14127187

申请日：2013-05-27

Applicant: NSK LTD.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H01L23/00 ,  H01L29/78

CPC classification number: H01L24/43 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/75 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/41175 ,  H01L2224/43848 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/494 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/75272 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/85815 ,  H01L2224/9221 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/3701 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

Abstract: There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Abstract translation: 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。

公开(公告)号：US08981790B2

公开(公告)日：2015-03-17

申请号：US13375742

申请日：2010-05-26

Applicant: Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uematsu

Inventor： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uematsu

IPC: G01R29/26 ,  G01R31/08 ,  G01R31/00 ,  G01R31/28 ,  H05K9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32

CPC classification number: G01R31/001 ,  G01R29/26 ,  G01R31/281 ,  H05K1/0215 ,  H05K1/0234 ,  H05K1/141 ,  H05K3/325 ,  H05K9/0039 ,  H05K9/0069 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate (103) on which an electronic component is mounted is secured to a housing (102) by a metal spacer (108) and a screw (104). A noise control member (100) mainly composed of an insulation substance is disposed between the metal spacer (108) and the substrate (103). A first conductive film is formed on the metal spacer-side of the noise control member (100), and a second conductive film is formed on the substrate-side of the noise control member (100). A resistance member (101) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

Abstract translation: 通过其中安装有电子部件的基板的噪声电流被抑制在壳体中，以提供电子设备的故障。 其上安装有电子部件的基板（103）通过金属间隔件（108）和螺钉（104）固定到壳体（102）。 主要由绝缘物质组成的噪声控制构件（100）设置在金属间隔件（108）和基板（103）之间。 第一导电膜形成在噪声控制部件（100）的金属间隔件侧上，第二导电膜形成在噪声控制部件（100）的基板侧。 电阻构件（101）设置在第一导电膜和第二导电膜之间。 可以通过电阻元件来抑制从外壳引入基板的噪声电流。

公开(公告)号：US20140226296A1

公开(公告)日：2014-08-14

申请号：US14129399

申请日：2012-02-10

Applicant: KABUSHIKI KAISHA TOYOTA , JIDOSHOKKI

Inventor： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0263 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/18 ,  H05K3/202 ,  H05K3/4092 ,  H05K3/46 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2203/0195

Abstract: This multi-layer wiring board is provided with an insulating substrate, an inner layer copper sheet, and an outer layer copper foil. The inner layer copper sheet is disposed within the insulating substrate and has been patterned. The outer layer copper foil is disposed in a state of having been patterned at the surface of the insulating substrate, is thinner than the inner layer copper sheet, and has a cross-sectional area of the current path that is smaller than the cross-sectional area of the current path of the inner layer copper sheet. As a result, provided are: a multi-layer wiring board that can flow a large current and a smaller current while suppressing an increase in the projected area of the substrate; and a method for producing the multi-layer wiring board.

Abstract translation: 该多层布线板设置有绝缘基板，内层铜板和外层铜箔。 内层铜片设置在绝缘基板内并被图案化。 外层铜箔被设置在绝缘基板的表面被图案化的状态下，比内层铜片薄，并且具有小于横截面的电流路径的截面积 内层铜片电流通路面积。 结果，提供了：能够抑制基板的投影面积的增加而能够流过大电流和小电流的多层布线基板; 以及多层布线基板的制造方法。

公开(公告)号：US08779297B2

公开(公告)日：2014-07-15

申请号：US13482495

申请日：2012-05-29

Applicant: Shinya Sato ,  Hiroshi Fukasaku

Inventor： Shinya Sato ,  Hiroshi Fukasaku

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0204 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K2201/10303 ,  H05K2201/10409 ,  H01L2924/00

Abstract: A heat release device is for use with a multilayer board that has an inner layer serving as a power layer. The heat release device includes a heat release member thermally and electrically connected to the power layer, and a heat release board having a heat release layer and a shield layer electrically insulated from each other. The heat release layer is thermally and electrically connected to the heat release member. The shield layer serves to shield against electromagnetic noise radiated from the heat release layer. The shield layer is electrically insulated from the heat release member connected to the heat release layer. The heat release device also includes an electrically conductive member electrically connected to the shield layer and grounded, and an insulator through which the heat release layer is thermally connected to the electrically conductive member.

Abstract translation: 散热装置用于具有作为功率层的内层的多层板。 散热装置包括热电连接到功率层的散热构件，以及具有彼此电绝缘的隔热层和隔离层的散热板。 散热层与散热构件热电连接。 屏蔽层用于屏蔽从放热层辐射的电磁噪声。 屏蔽层与连接到放热层的散热构件电绝缘。 散热装置还包括电连接到屏蔽层并接地的导电构件，以及绝热体，隔热层热连接到导电构件。

公开(公告)号：US08766099B2

公开(公告)日：2014-07-01

申请号：US12569871

申请日：2009-09-29

Applicant: Kyle H. Yeates

Inventor： Kyle H. Yeates

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/1461 ,  H05K1/141 ,  H05K1/147 ,  H05K1/182 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4691 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/09781 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact event, the electronic component can be isolated using a groove in the printed circuit board. The electronic component may be mounted to a component mounting region using solder balls. The component mounting region may be surrounded on some or all sides by the groove. Flex circuit structures that bridge the groove or a portion of the rigid printed circuit board may be used to hold the component mounting region in place. The flex circuit structures may be provided in the form of separate structures or may be provided as an integral portion of the printed circuit board.

Abstract translation: 敏感电子部件可以安装在电子设备内的印刷电路板上。 为了将敏感元件与在非预期的冲击事件期间可能出现的应力隔离，可以使用印刷电路板中的凹槽来隔离电子部件。 电子部件可以使用焊球安装到部件安装区域。 部件安装区域可以在一些或所有侧面被凹槽包围。 桥接凹槽或刚性印刷电路板的一部分的柔性电路结构可用于将部件安装区域保持在适当位置。 柔性电路结构可以以单独结构的形式提供，或者可以设置为印刷电路板的整体部分。