Abstract:
An electron microscope has a spherical aberration correction system having transfer optics inserted between a spherical aberration corrector and the objective lens. The transfer optics consists of first and second lenses each of which is made of a magnetic lens. Electrons passing across a point located at distance r0 from the optical axis are made to enter the first lens within the multipole element. Electrons are made to enter the second lens at distance r1 of the incident point to the objective lens from the optical axis. The ratio M (=r1/r0) is greater than 1.
Abstract translation:电子显微镜具有球面像差校正系统,其具有插入球面像差校正器和物镜之间的传输光学器件。 传输光学器件由第一和第二透镜组成,每个透镜由磁性透镜制成。 通过位于离开光轴的距离r 0的点的电子进入多极元件内的第一透镜。 使电子从光轴入射到物镜的入射点的距离r 1进入第二透镜。 比值M(= r 1 / r 0)大于1。
Abstract:
An ultrafast system (and methods) for characterizing one or more samples. The system includes a stage assembly, which has a sample to be characterized. The system has a laser source that is capable of emitting an optical pulse of less than 1 ps in duration. The system has a cathode coupled to the laser source. In a specific embodiment, the cathode is capable of emitting an electron pulse less than 1 ps in duration. The system has an electron lens assembly adapted to focus the electron pulse onto the sample disposed on the stage. The system has a detector adapted to capture one or more electrons passing through the sample. The one or more electrons passing through the sample is representative of the structure of the sample. The detector provides a signal (e.g., data signal) associated with the one or more electrons passing through the sample that represents the structure of the sample. The system has a processor coupled to the detector. The processor is adapted to process the data signal associated with the one or more electrons passing through the sample to output information associated with the structure of the sample. The system has an output device coupled to the processor. The output device is adapted to output the information associated with the structure of the sample.
Abstract:
System and a method for electrically testing a semiconductor wafer, the method including: (a) scanning a charged particle beam along at least one scan line while maintaining an electrode located at a vicinity of the wafer at a first voltage that differs from a voltage level of a first scanned portion of the wafer, and collecting charged particles scattered from the first scanned portion; (b) scanning a charged particle beam along at least one other scan line while maintaining the electrode at a second voltage that differs from a voltage level of a second scanned portion such as to control a charging state of at least an area that comprises the first and second scanned portions; and (c) repeating the scanning stages until a predefined section of the wafer is scanned.
Abstract:
One embodiment disclosed relates to a method for inspecting a substrate. The method includes exposing the substrate to an incident beam, inducing relative motion between the incident beam and the substrate, and detecting charged particles emitted from the substrate. The relative motion is such that the beam travels over a surface of the substrate along a substantially spiral shaped path.
Abstract:
A charged particle optics for a charged particle beam apparatus having a charged particle beam and a beam propagation direction of the charged particle beam apparatus is described. The charged particle optics includes a focusing lens. The focusing lens includes a first electrode with a first aperture; a second electrode with a second aperture, the second electrode being mechanically movable at least in a first direction perpendicular to the beam propagation direction; and an actuator coupled to the second electrode to move the second electrode in at least the first direction for displacement of the second aperture with respect to the first aperture. The charged particle optics further includes a deflection system positioned upstream of the second electrode to deflect the charged particle beam, based on the displacement, to guide the charged particle beam through the second aperture.
Abstract:
A system includes a multi-beam particle microscope for imaging a 3D sample layer by layer, and a computer system with a multi-tier architecture is disclosed. The multi-tier architecture can allow for an optimized image processing by gradually reducing the amount of parallel processing speed when data exchange between different processing systems and/or of data originating from different detection channels takes place. A method images a 3D sample layer by layer. A computer program product includes a program code for carrying out the method.
Abstract:
A method of measuring a critical dimension (CD) includes forming a plurality of patterns in a substrate, creating first to n-th images, where n is a natural number greater than 1, for first to n-th areas in the substrate, respectively, where the first to n-th areas do not overlap with each other, where each of the first to n-th areas comprising at least some of the plurality of patterns, creating a merged image for the first to n-th images, and measuring a CD for a measurement object from the plurality of patterns using the merged image. The merged image has a higher resolution than each of the first to n-th images.
Abstract:
We describe a super-resolution optical microscopy technique in which a sample is located on or adjacent to the planar surface of an aplanatic solid immersion lens and placed in a cryogenic environment.
Abstract:
A scanning electron microscope of the present invention performs scanning by changing a scanning line density in accordance with a sample when an image of a scanned region is formed by scanning a two-dimensional region on the sample with an electron beam or is provided with a GUI having sample information input means which inputs information relating to the sample and display means which displays a recommended scanning condition according to the input and performs scanning with a scanning line density according to the sample by selecting the recommended scanning condition. As a result, in observation using a scanning electron microscope, a suitable scanning device which can improve contrast of a profile of a two-dimensional pattern and suppress shading by suppressing the influence of charging caused by primary charged particle radiation and by improving a detection rate of secondary electrons and a scanning method are provided.
Abstract:
Protein layers (1) repeating regularly in two dimensions comprise protein protomers (2) which each comprise at least two monomers (5), (6) genetically fused together. The monomers (5), (6) are monomers of respective oligomer assemblies (3), (4) into which the monomers are assembled to assembly of the protein layer. The first oligomer assembly (3) belongs to a dihedral point group of order O, where O equals (3), (4) or (6) and has a set of O rotational symmetry axes of order (2). The second oligomer assembly (4) has a rotational symmetry axis of order (2). Due to the symmetry of the oligomer assemblies (3), (4), the rotational symmetry axes of each second oligomer assembly (4) is aligned with one of said set of O rotational symmetry axes of a first oligomer assembly (3) with (2) protomers being arranged symmetrically therearound. Thus, an 2-fold fusion between the oligomer assemblies (3), (4) is produced and the arrangements of the rotational symmetry axes of the oligomer assemblies (3), (4) cause the protein layer to repeat regularly. The protein layer has many uses, for example to support molecular entities for biosensing, x-ray crystallography or electron microscopy.