公开(公告)号：US20140177180A1

公开(公告)日：2014-06-26

申请号：US13726509

申请日：2012-12-24

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/02 ,  H05K1/11 ,  H05K13/00 ,  H05K9/00

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

Abstract translation: 电子设备中的电气部件安装在诸如印刷电路的基板上。 印刷电路包含由金属迹线形成的信号路径。 印刷电路的信号路径中的信号线通过诸如印刷电路板对板连接器，由各向异性导电膜连接的触点或使用焊料连接的触点之类的电连接结构耦合在一起。 电连接结构可以由诸如导电泡沫结构或弹簧结构的导电弹性环形结构围绕。 导电泡沫结构可以设置有金属层，导电泡沫结构通过该金属层焊接到印刷电路上的金属环。 应变消除结构可以由围绕电连接结构或包覆成型的塑料结构的弹性体环形成。 涂层和导电塑料可用于提供具有电磁干扰屏蔽能力的应变消除结构。

公开(公告)号：US20140168913A1

公开(公告)日：2014-06-19

申请号：US14104576

申请日：2013-12-12

Applicant: Enphase Energy, Inc.

Inventor： Martin Fornage

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10409

Abstract: A continuous substrate including a first portion with a plurality of electronic components, and at least one strain relief area located proximate a fastening location, wherein the at least one strain relief area is located between the first portion and the fastening location.

Abstract translation: 包括具有多个电子部件的第一部分和至少一个位于紧固位置附近的应变消除区域的连续基板，其中所述至少一个应变消除区域位于所述第一部分和所述紧固位置之间。

公开(公告)号：US20140160681A1

公开(公告)日：2014-06-12

申请号：US13708876

申请日：2012-12-07

Applicant: WINTEC INDUSTRIES, INC.

Inventor： Kong-Chen Chen

IPC: H05K1/02 ,  H05K13/00

CPC classification number: H05K3/366 ,  H01R12/718 ,  H01R12/721 ,  H01R12/737 ,  H05K1/0201 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/1034 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10787 ,  H05K2201/1081 ,  Y10T29/49117

Abstract: An electric apparatus for connecting to a first printed circuit includes a second printed circuit, which includes a first surface substantially parallel to a first plane and a second surface substantially parallel to a second plane perpendicular to the first plane. The first surface includes a first area and the second surface includes a smaller second area. The second printed circuit includes conductive traces in a layer of the second printed circuit. The electric apparatus further includes first and second conductive pins including first and second longitudinal axes, respectively. First and second notches in the second printed circuit include respective first and second openings through the second surface adapted to receive portions of the first and second pins and adapted to electrically connect the pins to first and second respective ones of the conductive traces. The first and second longitudinal axes are installed substantially parallel to the first plane.

Abstract translation: 用于连接到第一印刷电路的电气设备包括第二印刷电路，其包括基本上平行于第一平面的第一表面和基本上平行于垂直于第一平面的第二平面的第二表面。 第一表面包括第一区域，第二表面包括较小的第二区域。 第二印刷电路在第二印刷电路的一层中包括导电迹线。 电气设备还包括分别包括第一和第二纵向轴线的第一和第二导电销。 第二印刷电路中的第一和第二凹口包括通过第二表面的相应的第一和第二开口，其适于接收第一和第二引脚的部分，并且适于将引脚电连接到第一和第二相应的导电迹线。 第一和第二纵轴基本上平行于第一平面安装。

公开(公告)号：US20140104776A1

公开(公告)日：2014-04-17

申请号：US13573976

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  G06F1/16

CPC classification number: G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/62 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

Abstract translation: 电互连系统包括在分叉的内表面上具有电极焊盘的分叉的多层柔性电路。 电子部件通过常规方式安装在柔性电路的一侧或两侧。 当分叉分开时，电极焊盘可与印刷电路板上的各个触点对准。 在通过焊接，导电粘合剂或其他方式将焊盘接合到触点之后，保持牢固的电连接，同时仍然允许柔性电路从一侧到另一侧弯曲一些，从而产生不具有刚性安装的部件和模块的附加设计选项。

公开(公告)号：US08668355B2

公开(公告)日：2014-03-11

申请号：US13665227

申请日：2012-10-31

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Takayoshi Moriyama ,  Kazunari Higuchi ,  Sumio Hashimoto ,  Shinichi Kumashiro

IPC: F21S4/00 ,  H05K1/05

CPC classification number: F21V29/00 ,  F21S8/026 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V21/00 ,  F21V29/50 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.

Abstract translation: 描述了安装有多个发光元件的基板。 基板可以安装在照明装置中，并且可以包括其上安装有多个发光元件的表面和可以从基板的第一表面到另一个表面传导热量的一个或多个孔。 例如，导热和非导电材料可以覆盖一个或多个孔的表面。 根据一些布置，衬底的表面可以包括非导电层和导电层，使得非导电层与导电层电隔离或分离。

公开(公告)号：US20140008105A1

公开(公告)日：2014-01-09

申请号：US14021053

申请日：2013-09-09

Applicant: FURUKAWA AUTOMOTIVE SYSTEMS INC. ,  FURUKAWA ELECTRIC CO., LTD.

Inventor： Kyutaro ABE ,  Hiroyuki FUKAI ,  Yasushi KIHARA ,  Juro UTSUMI ,  Naomi TAKAHASHI

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0263 ,  H05K1/141 ,  H05K1/142 ,  H05K1/183 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10409 ,  Y10T29/49144

Abstract: A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board mounting part. Through holes are provided in the printed circuit board. The conductor part is formed substantially perpendicular to the circuit board mounting part, and is inserted into a through hole. A female screw part is formed in the vicinity of the conductor part in the printed circuit board mounting part. The female screw part can be screwed together with a bolt, which is a securing member. The printed circuit board is connected to the conductor part by solder. A hole is formed in advance in the vicinity of the solder on the printed circuit board. The bolt passes through the hole and is secured to the female screw part.

Abstract translation: 电路板形成为使得印刷电路板连接到注塑电路板。 内部电路导体在印刷电路板安装部的导体部露出。 印刷电路板上设有通孔。 导体部分基本上垂直于电路板安装部分形成，并被插入到通孔中。 在印刷电路板安装部分中的导体部分附近形成有内螺纹部分。 内螺纹部分可以用作为固定构件的螺栓拧紧在一起。 印刷电路板通过焊料连接到导体部分。 预先在印刷电路板上的焊料附近形成孔。 螺栓穿过孔并固定到内螺纹部分。

公开(公告)号：US20130344712A1

公开(公告)日：2013-12-26

申请号：US13632135

申请日：2012-09-30

Applicant: APPLE INC.

Inventor： Jared M. KOLE ,  Michael B. WITTENBERG ,  Shayan MALEK

IPC: H05K1/11

CPC classification number: H05K3/363 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A low-height connectorless interconnection system includes a first substrate, the first substrate having a first plurality of exposed portions of underlying circuit traces and a second substrate, the second substrate having a second plurality of exposed portions of underlying circuit traces. The system further includes a plurality of conductive formations formed on at least one of the first and second pluralities of exposed portions of underlying circuit traces and a clamping member arranged to join the first and second substrate such that the first and second pluralities of exposed portions of circuit traces are in severable electrical communication.

Abstract translation: 低高度无连接器互连系统包括第一基板，第一基板具有下面的电路迹线的第一多个暴露部分和第二基板，第二基板具有第二多个底层电路迹线的暴露部分。 该系统还包括形成在下面的电路迹线的第一和第二多个暴露部分中的至少一个上的多个导电结构，以及被布置成接合第一和第二基板的夹持构件，使得第一和第二多个暴露部分 电路迹线处于可分离的电气通信中。

公开(公告)号：US20130335292A1

公开(公告)日：2013-12-19

申请号：US13611221

申请日：2012-09-12

Applicant: WEI-LU HUNG

Inventor： WEI-LU HUNG

IPC: H01Q1/38 ,  H01Q7/00

CPC classification number: H01Q1/2266 ,  H01Q9/42 ,  H05K3/0058 ,  H05K3/36 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10356 ,  H05K2201/10409

Abstract: A circuit board having antenna structure for use with portable communication devices includes a substrate and an antenna body provided on the substrate. The substrate has a first, a second and a third surface that adjoin one another, and has a ground metallic element mounted thereon parallel to the third surface. The antenna body includes a radiation portion located on the first and second surfaces, a feed-in portion located on the third surface and connected to the radiation portion, and a ground portion located on the third surface and connected to the radiation portion and the ground metallic element. With these arrangements, the antenna structure provided on the circuit board overcomes the problems of limited antenna position and insufficient antenna area without being hindered by other electronic components or structural elements on the circuit board, and is operable at both higher and lower frequency bands.

Abstract translation: 具有用于便携式通信设备的天线结构的电路板包括衬底和设置在衬底上的天线体。 衬底具有彼此邻接的第一，第二和第三表面，并且具有平行于第三表面安装在其上的接地金属元件。 所述天线体包括位于所述第一表面和所述第二表面上的辐射部分，位于所述第三表面上并连接到所述辐射部分的馈入部分，以及位于所述第三表面上并连接到所述辐射部分和所述地面的接地部分 金属元素。 利用这些布置，电路板上提供的天线结构克服了天线位置有限和天线面积不足的问题，而不受其他电子部件或电路板上的结构元件的阻碍，并可在高频段和低频段进行操作。

公开(公告)号：US08602593B2

公开(公告)日：2013-12-10

申请号：US12579946

申请日：2009-10-15

Applicant: Joshua Josiah Markle ,  Robert Edward Higley

Inventor： Joshua Josiah Markle ,  Robert Edward Higley

IPC: F21V21/00

CPC classification number: F21K9/00 ,  F21V19/0055 ,  F21V29/76 ,  F21V29/763 ,  F21V29/85 ,  H01L25/0753 ,  H01L2224/48227 ,  H01L2924/19107 ,  H05K1/021 ,  H05K3/0058 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409

Abstract: Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.

Abstract translation: 提供灯组件及其制造方法。 这种灯组件可以包括可以安装到散热器的散热器和发光二极管封装。 发光二极管封装可以包括具有顶表面和底表面的基板，透镜以及在基板表面上的电触点。 灯组件还可以包括具有面表面的印刷电路板，与表面相对的后表面和从表面延伸到后表面的开口。 印刷电路板可以在其上具有电接触以与发光二极管封装的电触点电连接。 发光二极管封装的基板可以接合印刷电路板的开口以将发光二极管封装机械耦合到印刷电路板。 当组装时，衬底的底表面可以与印刷电路板的后表面齐平并对齐。

公开(公告)号：USRE44595E1

公开(公告)日：2013-11-12

申请号：US13749331

申请日：2013-01-24

Applicant: Roche Diagnostics Operations, Inc.

Inventor： Michel Cadio ,  Bryan Rolfs ,  Aleksey Pirkhalo ,  James Wolford

IPC: G01N33/00

CPC classification number: H05K3/301 ,  A61B5/00 ,  A61B5/14532 ,  A61B5/742 ,  A61B2560/04 ,  A61B2562/0295 ,  G01N33/48785 ,  H05K2201/10128 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/0271

Abstract: The present invention provides an innovative means for efficient and secure component assembly and for ensuring secure electrical connections in a small diagnostics device where available space for fasteners is limited. In one embodiment, principles of leverage are employed to produce a force at a location where space is available. The force is transferred to a different location of the assembly where it is used to maintain secure connections between components.

Abstract translation: 本发明提供了一种创新的装置，用于有效和安全的部件组装以及用于确保用于紧固件的可用空间有限的小型诊断装置中的安全电连接。 在一个实施例中，利用杠杆的原理在空间可用的位置产生力。 该力传递到组件的不同位置，在该位置用于维护组件之间的安全连接。