公开(公告)号：US3757028A

公开(公告)日：1973-09-04

申请号：US3757028D

申请日：1972-09-18

Applicant: SCHLESSEL J

Inventor： SCHLESSEL J

IPC: H01B7/08 ,  H01B11/02 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K9/0039 ,  H01B7/08 ,  H01B11/02 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/097

Abstract: A novel transmission-line structure, particularly adapted for printed circuit sheets and the like, and embodying zig-zag line conductors formed of conductive strips successively disposed on opposite sides of the insulating sheet and interconnected transversely through the sheet, with the corresponding strips of each line conductor crossing those of the other line conductor, through on opposite sides of said sheet, effectively to provide a twist of the line conductors through at least a turn to effect magnetic field cancellation, self-shielding and interference suppression.

公开(公告)号：US09907171B2

公开(公告)日：2018-02-27

申请号：US14905728

申请日：2014-07-24

Applicant: LG Display Co., Ltd.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H01L51/52 ,  H05K1/02 ,  H05K3/36 ,  H05K7/00 ,  H05K3/40

CPC classification number: H05K1/142 ,  H01L51/5203 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/05 ,  H05K2201/097 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US09831575B2

公开(公告)日：2017-11-28

申请号：US15409689

申请日：2017-01-19

Applicant: Lear Corporation

Inventor： Bert W. Eakins ,  George E. Fox

IPC: H05K1/11 ,  H01R12/70 ,  H01R4/02

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

公开(公告)号：US09775231B2

公开(公告)日：2017-09-26

申请号：US14947091

申请日：2015-11-20

Applicant: Amphenol Corporation

Inventor： Marc B. Cartier, Jr.

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H01R43/20

CPC classification number: H05K1/0222 ,  H01R43/205 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/07 ,  H05K2201/09063 ,  H05K2201/09318 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/097 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.

公开(公告)号：US09736945B2

公开(公告)日：2017-08-15

申请号：US14813218

申请日：2015-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya Takahashi

IPC: H05K1/09 ,  H05K3/18 ,  H05K3/16 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538

CPC classification number: H05K3/18 ,  H01L21/4857 ,  H01L23/49866 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/111 ,  H05K1/141 ,  H05K3/16 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0391 ,  H05K2201/0769 ,  H05K2201/09236 ,  H05K2201/0929 ,  H05K2201/094 ,  H05K2201/09654 ,  H05K2201/097 ,  H05K2201/09736 ,  H05K2201/098 ,  H01L2924/014

Abstract: A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.

公开(公告)号：US20170072835A1

公开(公告)日：2017-03-16

申请号：US15362703

申请日：2016-11-28

Applicant: UUSI, LLC

Inventor： David W. Shank ,  John M. Washeleski ,  Edward J. Cox, II

IPC: B60Q1/00 ,  H05B33/08 ,  B60R16/02 ,  H05B37/02 ,  H05K1/14 ,  H05K7/14

CPC classification number: B60Q1/0088 ,  H01R12/62 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0854 ,  H05B33/086 ,  H05B37/0227 ,  H05K1/02 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/04 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10356

Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

Abstract translation: 车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。 第一电路板各自具有支撑在基板上的多个电路元件的基板。 第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。 第二电路板各自具有支撑在它们上的多个电路元件的基板。 第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。 第二电路板基板包括与外边缘轮廓的多个第二偏差。 第二偏差的至少一部分不同于第一电路板的第一偏差。

公开(公告)号：US09575607B2

公开(公告)日：2017-02-21

申请号：US14622357

申请日：2015-02-13

Applicant: MStar Semiconductor, Inc.

Inventor： Guo-Kiang Hung ,  Chien-Chuan Chen ,  Chao-Yang Kuo

IPC: G06F3/044 ,  H05K1/11 ,  H05K1/16

CPC classification number: G06F3/044 ,  H05K1/11 ,  H05K1/167 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/097 ,  H05K2201/10053

Abstract: An electrode of a self-capacitive touch panel is provided. The electrode, coupled to a control circuit of the self-capacitive touch panel via a conducting wire, includes: a serpentine portion, having a first side; a main portion, having a second side; and a connecting portion, connected to the first side and the second side to connect the serpentine portion and the main portion. A length of the connecting portion is smaller than a length of the first side and a length of the second side.

Abstract translation: 提供了一种自电容式触摸面板的电极。 经由导线与电容式触摸屏的控制电路相连的电极包括：具有第一侧的蛇形部分; 主要部分，具有第二面; 以及连接部分，连接到第一侧和第二侧以连接蛇形部分和主要部分。 连接部分的长度小于第一侧的长度和第二侧的长度。

公开(公告)号：US09538589B2

公开(公告)日：2017-01-03

申请号：US14168036

申请日：2014-01-30

Applicant: UUSI, LLC

Inventor： David W. Shank ,  John M. Washeleski ,  Edward J. Cox, II

IPC: B60Q1/14 ,  H05B33/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05B33/0803 ,  H05B33/086 ,  H05K1/02 ,  H05K1/117 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10356

Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

Abstract translation: 车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。 第一电路板各自具有支撑在基板上的多个电路元件的基板。 第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。 第二电路板各自具有支撑在它们上的多个电路元件的基板。 第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。 第二电路板基板包括与外边缘轮廓的多个第二偏差。 第二偏差的至少一部分不同于第一电路板的第一偏差。

公开(公告)号：US20160349553A1

公开(公告)日：2016-12-01

申请号：US14437826

申请日：2015-01-12

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Hongrui CAO

IPC: G02F1/1345 ,  H05K1/09 ,  H05K1/02

CPC classification number: G02F1/1345 ,  G02F1/13452 ,  G02F1/13458 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/09 ,  H05K1/11 ,  H05K1/117 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/094 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10136

Abstract: The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the widths of the gold fingers are different. By the above manner, the disclosure is able to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board.

Abstract translation: 本公开涉及柔性印刷电路板。 柔性印刷电路板包括设置在连接区域内的连接区域和多个金指，其中金手指的宽度不同。 通过上述方式，本发明能够增加金手指的数量而不改变柔性印刷电路板的尺寸，以便解决柔性印刷电路板的金指的阻抗匹配问题。

公开(公告)号：US09454982B2

公开(公告)日：2016-09-27

申请号：US13660477

申请日：2012-10-25

Applicant: NHK SPRING CO., LTD.

Inventor： Hajime Arai

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  G11B5/48

CPC classification number: G11B5/4846 ,  G11B5/1272 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/18 ,  H05K2201/05 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/2009 ,  Y10T29/49194

Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities. The wiring structure further comprises a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.

Abstract translation: 包括支撑头部并附接到负载束施加负载到头上的弯曲部的头部悬架的布线结构包括形成在挠曲件上并连接到头部上的写入布线和读取布线，每个布线具有相反极性的导线。 所述布线结构还包括层叠的交错部分，其包括电连接到所述写入布线的相应导线的部分，所述片段通过电绝缘层堆叠在并面对所述线，使得所述相对的线和片段具有相反的极性。