Abstract:
PURPOSE: A composition for forming an oxide semiconductor, an inkjet printing process using the same, and an electronic device including the oxide semiconductor thin film are provided to obtain an oxide semiconductor without defects through an inkjet printing process by using a composition containing a fixed quantity of sol stabilizer. CONSTITUTION: A gate electrode(20) and a gate insulation layer(21) covering the gate electrode are formed on a substrate(10). A channel layer(22) corresponding to the gate electrode is formed on the gate insulation layer. A source electrode(24a) and a drain electrode(24b) are formed on both sides of the channel layer. An etch stopper is formed between the source electrode and the drain electrode. The gate electrode controls the current flow between the source electrode and the drain electrode.
Abstract:
게이트 전극, 상기 게이트 전극과 중첩하며 제1 금속 산화물을 포함하는 반도체, 상기 게이트 전극과 상기 반도체 사이에 위치하며 제2 금속 산화물을 포함하는 게이트 절연막, 그리고 상기 반도체와 전기적으로 연결되어 있는 소스 전극 및 드레인 전극을 포함하고, 상기 제1 금속 산화물 및 상기 제2 금속 산화물은 하나 이상의 금속을 공통적으로 포함하는 박막 트랜지스터 및 그 제조 방법과 상기 박막 트랜지스터를 포함하는 표시 장치를 제공한다.
Abstract:
PURPOSE: An organic light emitting display device and a driving method thereof are provided to display the images with various colors by the gray scale of various steps by inserting at least one additional bit signal for an additional sub frame. CONSTITUTION: A driving transistor(T2) switches the current supply to an OLED by an image signal. A current controller includes a plurality of current control transistors(T3,T4) controlling an amount of currents to the OLED. A driving transistor operates in a linear region. Current control transistors operate at a saturation region. A storage capacitor stores an image signal. A switching transistor stores the image signal in a storage capacitor.
Abstract:
An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode, and a method for preparing an oxide semiconductor thin film transistor by using the etchant are provided to prevent the back etching of an oxide semiconductor and the dissolution of an oxide semiconductor and to improve etching rate. An etchant for the source of an oxide semiconductor thin film transistor and a drain electrode comprises hydrogen peroxide, ammonium hydroxide, and water. A manufacturing method of an oxide semiconductor thin film transistor comprises the steps of forming a gate on a substrate(110), and forming a gate insulating layer(114) on the substrate so as to cover the gate; forming a channel layer(116) comprising an oxide semiconductor on the gate insulating layer; and forming a metal layer for the formation of a source and a drain electrode at on both surfaces of the channel layer, and pattering it by using the etchant to form a source and drain electrodes(118a,118b).
Abstract:
A plasma processing apparatus having linear antennas is provided to improve density uniformity of plasma by changing a thickness of a dielectric for surrounding the linear antenna. A plasma processing apparatus having linear antennas includes a reaction chamber(110), a substrate supporting plate(120), linear antennas(132), an RF power source(138), and a dielectric(142). The substrate supporting plate is installed in a lower side of the inside of the reaction chamber in order to support a substrate to be processed. The linear antennas are used for inducing electric field to generate electric field. The linear antennas are installed in parallel to each other at an upper side of the inside of the reaction chamber. The RF power source is connected to the linear antennas in order to supply RF power to the linear antennas. The dielectric is formed to surround each of the linear antennas. The thickness of the dielectric is gradually reduced from a RF power input terminal of each linear antenna to a grounding terminal(132b).
Abstract:
A method for manufacturing an oxide semiconductor thin film transistor is provided to improve stability and reliability of the semiconductor thin film transistor by using an oxide semiconductor made of a channel material. A gate insulating layer(114) is formed on a substrate with a gate(112). A channel layer(116) made of the oxide semiconductor is formed on a gate insulating layer. A source electrode(118a) and a drain electrode(118b) are formed in both sides of the channel layer. The plasma process is performed to supply the oxygen to the channel layer. The protection layer covering the source and drain electrodes, and the channel layer is formed. After forming the protection layer, the thermal process is performed.
Abstract:
A polycrystalline silicon thin film and a method of thin film transistor applying the same are provided to obtain medium quality of a poly-crystal silicon and a amorphous silicon in order to be used in a high quality electronic product. A silicon thin film(20) is formed with high density plasma chemical vapor deposition having plasma density more than 2.00E+11cm-3 on a substrate(10). Hydrogen gas is included to reaction gas. The gas forming the silicon thin film comprises one selected from the group of Ar and He. A polycrystalline silicon thin film and a method of thin film transistor applying the same comprises a step for forming a channel region and active layer having a source region and a drain region of the both sides of the channel regions.
Abstract:
A thin film transistor and a manufacturing method thereof are provided to change doping level for respective semiconductor layer regions by adjusting thickness and location of first, second, and third insulation layers. A thin film transistor comprises a lower structure(11), a semiconductor layer(12), first and second insulation layers(14a,14b), and a third insulation layer(16), and a gate electrode layer(17). The semiconductor layer includes a plurality of doped regions(12b,12c,12d) on the lower structure. The first and second insulation layers are formed on the semiconductor layer, separated from each other. The third insulation layer is formed on the first and second insulation layers. The gate electrode layer is formed on the third insulation layer between the first and second insulation layers. The width of the third insulation layer is longer than that between the first and second insulation layers and shorter than that between the left part of the first insulation layer and the right part of the second insulation layer.
Abstract:
An organic electro-luminescent display and a fabrication method thereof are provided to obtain an active layer with a low mobility and an active layer with a high mobility by obtaining different poly crystal silicon islands. An organic electro-luminescent display includes an amorphous silicon(2), a capping layer(3), a driving transistor, and a switching transistor. The capping layer is formed on the amorphous silicon and has two parts(3a,3b) having different thicknesses. The driving transistor is formed under a thick part of the capping layer and drives the organic electro-luminescent display. The switching transistor is formed under a thinner part of the capping layer and controls operation of the driving transistor.
Abstract:
셀프얼라인에 의한 오프셋 구조를 가지는 박막트랜지스터 및 그 제조방법에 관해 개시한다. 박막트랜지스터는 기판과; 기판 상에 형성되는 것으로 폭이 넓은 부분과 좁은 부분을 가지는 것으로 그 양측에 경사면이 형성된 돌출부를 가지는 버퍼층과; 상기 버퍼층의 돌출부상에 마련되는 채널과 돌출부의 양측에 위치하는 소스 및 드레인을 가지는 것으로 상기 돌출부의 양측 경사부에 대응하는 오프렛 구조를 가지는 반도체층과; 상기 돌출부의 상방에 마련되는 것으로 상기 돌출부의 좁은 부분에 비해 큰 폭을 가지는 게이트 절연층 및 게이트를 구비한다. 오프셋, LDD, 박막트랜지스터