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公开(公告)号：US20240098880A1
公开(公告)日：2024-03-21
申请号：US18525872
申请日：2023-12-01
Applicant: KMW INC.
Inventor： Bae Mook JEONG , Kyo Sung JI , Seong Min AHN , Chi Back RYU , Jae Eun KIM , Seung Min LEE , Ki Hun PARK , Won Jun PARK , Jun Woo YANG
CPC classification number: H05K1/0212 , H05K1/184 , H05K3/321 , H05K2201/0355 , H05K2201/06 , H05K2201/0715 , H05K2201/10409
Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.
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公开(公告)号：US20230358615A1
公开(公告)日：2023-11-09
申请号：US18356772
申请日：2023-07-21
Applicant: LISA DRÄXLMAIER GMBH
Inventor： Stephan SCHAFFERHANS , Krzysztof MURGOTT
CPC classification number: G01K1/143 , H05K1/0201 , H05K1/028 , H05K1/05 , G01K2217/00 , H05K2201/05 , H05K2201/06 , H05K2201/10303
Abstract: The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.
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公开(公告)号：US20230300970A1
公开(公告)日：2023-09-21
申请号：US18324439
申请日：2023-05-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Dongming Yu , Zhenming Hu , Peihua Cui , Lei Xiang
IPC: H05K1/02 , H05K7/12 , H05K7/20 , B60R16/023 , H05K1/18
CPC classification number: H05K1/0203 , B60R16/023 , H05K1/181 , H05K7/12 , H05K7/2039 , H05K2201/06
Abstract: An electronic device includes a housing assembly, a circuit board, an electronic component, and a floating support assembly that are assembled together. Installation space is formed in the housing assembly. The circuit board, the electronic component, and the floating support assembly are all accommodated in the installation space. The circuit board is installed in the housing assembly. The electronic component is supported by the circuit board and is in signal communication with the circuit board. The floating support assembly is disposed on the circuit board to support the electronic component or disposed in the housing assembly to support the circuit board, so that the electronic component abuts against the housing assembly under an action of a pre-loading force of the floating support assembly.
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公开(公告)号：US10064265B2
公开(公告)日：2018-08-28
申请号：US15027177
申请日：2014-09-29
Inventor： David Robert , Yves Royer
CPC classification number: H05K1/0201 , G01J5/06 , G01J5/061 , G01J5/10 , H01R12/77 , H05K1/0209 , H05K1/0218 , H05K1/028 , H05K1/0296 , H05K1/11 , H05K1/147 , H05K2201/06 , H05K2201/066 , H05K2201/0715
Abstract: A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks.
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公开(公告)号：US20180206328A1
公开(公告)日：2018-07-19
申请号：US15633994
申请日：2017-06-27
Applicant: Northrop Grumman Systems Corporation
Inventor： John A. Starkovich , Jesse B. Tice , Xianglin Zeng , Andrew D. Kostelec , Hsiao-Hu Peng , Edward M. Silverman
CPC classification number: H05K1/0204 , F28F21/02 , F28F21/086 , F28F21/089 , F28F2255/06 , F28F2275/02 , H05K1/0207 , H05K3/4608 , H05K2201/0323 , H05K2201/0338 , H05K2201/06
Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
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Patent Agency Ranking
公开(公告)号：US09736923B1
公开(公告)日：2017-08-15
申请号：US15407299
申请日：2017-01-17
Applicant: Northrop Grumman Systems Corporation
Inventor： John A. Starkovich , Jesse B. Tice , Xianglin Zeng , Andrew D. Kostelec , Hsiao-Hu Peng , Edward M. Silverman
CPC classification number: H05K1/0204 , F28F21/02 , F28F2255/06 , F28F2275/02 , H05K1/0207 , H05K3/4608 , H05K2201/0323 , H05K2201/0338 , H05K2201/06
Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
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公开(公告)号：US20170145213A1
公开(公告)日：2017-05-25
申请号：US15322929
申请日：2015-07-14
Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
Inventor： Kentaro NOMIZU , Mitsuru OHTA , Masanobu SOGAME , Yoshinori MABUCHI
CPC classification number: C08L79/04 , B32B15/08 , B32B27/20 , C08J5/24 , C08J2379/04 , C08J2463/04 , C08J2479/08 , C08K3/34 , C08K5/3415 , C08K9/02 , C08L101/00 , C08L2203/20 , C08L2205/025 , C08L2205/035 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2201/0257 , H05K2201/0266 , H05K2201/06
Abstract: A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.
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公开(公告)号：US20170094790A1
公开(公告)日：2017-03-30
申请号：US15310530
申请日：2015-03-05
Applicant: Auto-Kabel Management GmbH
Inventor： Wacim Tazarine , Simon Betscher , Frank Gronwald , Sohejl Rafati
CPC classification number: H05K1/14 , F02N11/0862 , F02N11/087 , F02N2011/0874 , F02N2250/02 , H05K1/0204 , H05K1/0263 , H05K1/0287 , H05K1/056 , H05K1/09 , H05K1/111 , H05K1/142 , H05K1/145 , H05K2201/04 , H05K2201/06 , H05K2201/07 , H05K2201/10166 , H05K2201/10174 , H05K2201/10272
Abstract: Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.
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公开(公告)号：US20170094773A1
公开(公告)日：2017-03-30
申请号：US15215849
申请日：2016-07-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Il-Jong SEO , Ogura ICHIRO , Myung-Sam KANG , Tae-Hong MIN
CPC classification number: H05K1/0206 , H05K1/0207 , H05K1/115 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K2201/0338 , H05K2201/049 , H05K2201/06 , H05K2201/09536 , H05K2201/09609 , H05K2201/09645 , H05K2201/10674
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.
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公开(公告)号：US09609741B1
公开(公告)日：2017-03-28
申请号：US15272201
申请日：2016-09-21
Applicant: CANON KABUSHIKI KAISHA
Inventor： Koji Noguchi
CPC classification number: H05K1/0203 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K2201/06 , H05K2201/09227 , H05K2201/09372 , H05K2201/10015 , H05K2201/10545
Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.
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