公开(公告)号：EP1570496A1

公开(公告)日：2005-09-07

申请号：EP03721372.5

申请日：2003-03-14

Applicant: Bourns, Inc.

Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

IPC: H01C1/14 ,  H01C7/02

CPC classification number: H01C7/027 ,  H01C1/1406 ,  H01C1/148 ,  H01C7/02 ,  H01C17/28 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09181 ,  H05K2201/09554 ,  H05K2201/09845

Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.

公开(公告)号：EP1507448A1

公开(公告)日：2005-02-16

申请号：EP03405588.9

申请日：2003-08-12

Applicant: Elmicron AG

Inventor： Schmidt, Walter ,  Steiert, Philippe

IPC: H05K3/46 ,  H05K3/44

CPC classification number: H05K3/4641 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/068 ,  H05K2201/09518 ,  H05K2201/09554 ,  H05K2201/09945

Abstract: Das Basismaterial (101) für elektrische Verbindungselemente, also Leiterplatten, HDIs, Chip Carriers etc. besitzt als Kern eine mit Löchern (104) versehene elektrisch leitende Folie (102), beispielsweise aus Kupfer. Die Folie ist ein Dielektrikum (103) eingebettet. Die Löchern (104) können in einem regelmässigen Raster angeordnet sein. Durch die verstärkende elektrisch leitende Schicht besitzt das Basismaterial hervorragende mechanisch Eigenschaften. Die leitende Schicht wirkt überdies abschirmend, kann also bei kleinen Schichtdicken cross-talk zwischen beidseitig des Basismaterials angebrachten Leiterbahnen verhindern.

Abstract translation: 薄铜箔（102）形成层状基板材料（101）的芯层或中间层。 层状基材的总厚度为25〜150微米。 铜箔具有规则的穿孔阵列（104），为2-70微米厚。 穿孔特别是300,500或800微米的标准间距。 穿孔的直径可以为50-150微米。

公开(公告)号：EP1261028A2

公开(公告)日：2002-11-27

申请号：EP02011192.8

申请日：2002-05-21

Applicant: Hitachi, Ltd.

Inventor： Hasebe, Takehiko, Hitachi, Ltd., Intl.Prop. Group ,  Yokozuka, Takehide, Hitachi,Ltd., Intl.Prop. Group ,  Ushifusa, Nobuyuki, Hitachi,Ltd., Intl.Prop. Group ,  Harada, Masahide, Hitachi,Ltd., Intl.Prop. Group ,  Matsuzaki, Eiji, Hitachi,Ltd., Intl.Prop. Group ,  Hozoji, Hiroshi, Hitachi,Ltd., Intl.Prop. Group

IPC: H01L23/367 ,  H01L23/373

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate (101), an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract translation: 本发明提供一种具有金属芯基板的电子设备，该金属芯基板包括金属板（101），形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和 电子部件的端子连接。 在电子设备中，具有高导热性的构件被布置成与金属板和电子部件两者接触。 因此，电子设备的散热性提高。

公开(公告)号：EP1092248A4

公开(公告)日：2001-08-22

申请号：EP99912421

申请日：1999-03-11

Applicant: OSRAM SYLVANIA INC

Inventor： DOIKAS PETER ,  GEIS DAVID ,  MERWIN JEFFREY D

IPC: H01R12/04 ,  H01R43/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H01R9/00 ,  B21K1/62 ,  H01L21/48 ,  H01L23/498 ,  H05K3/36

CPC classification number: H05K3/4038 ,  H01R43/0256 ,  H05K1/111 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10416 ,  H05K2203/033 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

公开(公告)号：EP0969706A2

公开(公告)日：2000-01-05

申请号：EP99119308.7

申请日：1995-07-19

Applicant: TESSERA, INC.

Inventor： Distefano, Thomas H. ,  Smith, John W. ,  Karavakis, Konstantine ,  Kovak, Zlata ,  Fjelstad, Joseph

IPC: H05K3/46 ,  H05K3/42 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

Abstract translation: 用于微电子电路板（260）之间的互连的插入器在其表面具有触点（250）。 每个触点具有垂直于表面的中心轴线，以及适于根据由接合电路板上的焊盘（262）施加的力从中心轴线径向向外扩张的周边部分。 因此，当电路板（260）用插入件压缩时，触头径向膨胀并擦拭穿过焊盘（262）。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身承载的导电接合材料（246）。

公开(公告)号：EP0638225B1

公开(公告)日：1999-04-07

申请号：EP94907837.2

申请日：1994-01-18

Applicant: MOTOROLA, INC.

Inventor： OSTREM, Fred, E. ,  OCKEN, Alfred, G.

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/44 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/363 ,  H05K3/4038 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2201/10977

Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101). A solderable contact area (103), is located on the plate (101). Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109) is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. A quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

公开(公告)号：EP0399161B1

公开(公告)日：1995-01-11

申请号：EP90105309.0

申请日：1990-03-21

Applicant: International Business Machines Corporation

Inventor： Bregman, Mark Fielding ,  Buchwalter, Stephen Leslie ,  Hermann, Karl ,  Kovac, Caroline Ann ,  Poore, Paige Adams ,  Viehbeck, Alfred

IPC: H05K1/05 ,  H05K1/00

CPC classification number: H05K3/462 ,  H01L23/5385 ,  H01L24/00 ,  H01L2924/14 ,  H05K1/0272 ,  H05K1/056 ,  H05K1/144 ,  H05K3/321 ,  H05K3/325 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/0154 ,  H05K2201/0314 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/1184 ,  H05K2203/1438 ,  H01L2924/00

公开(公告)号：EP0575292A1

公开(公告)日：1993-12-22

申请号：EP93810414.8

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG

Inventor： Schmidt, Walter, Dr. ,  Martinelli, Marco

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H05K3/42 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: Das Verfahren zur Herstellung von verfluchteten Durchführungen durch Substratmaterialien, bei denen die Projektion der Ein- und Ausmündungen sich nicht decken, wird einerseits durch versetztes Anlegen von Ätzfenstern auf beiden Seiten und durch entsprechend starkes Unterätzen dieser Fenster charakterisiert. Durch Anlegen von zueinander verschobenen Ätzfenstern auf beiden Seiten des Substrates und Durchätzen des Substrates durch die angelegten Fenster ergeben sich im Substrat "schräge" Durchführungen. Man kann, allein durch entsprechende Anlage der Fenster auch verzweigte Durchführungen mit mehr als einer Ausmündung herstellen.

Abstract translation: 其特征在于，通过基板材料生产不对齐的通孔的过程，其中入口和出口的突起不重合，首先，通过在两侧以偏移方式设置蚀刻窗口，其次， ，通过足够强的所述窗口的底切。 通过布置相对于彼此移位的蚀刻窗，在基板的两侧和被蚀刻的基板上，通过布置的窗口，“倾斜”通孔导致基板。 也可以通过以适当的方式布置窗户来产生具有多个出口的分支通孔。

公开(公告)号：EP0540451A2

公开(公告)日：1993-05-05

申请号：EP92480153.3

申请日：1992-10-09

Applicant: International Business Machines Corporation

Inventor： Sachdev, Krishna Gandhi ,  McGuire, Kathleen Mary ,  Kellner, Benedikt Maria Johannes ,  Sorce, Peter Jerome

IPC: H01L21/48 ,  H05K3/46

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/007 ,  H05K3/388 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/445 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4641 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0152 ,  Y10T29/49165 ,  Y10T428/12361 ,  Y10T428/12382 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/24777 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure (75) with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures (75). The individual thin film structure (50) is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator (50) is comprised primarily of a metal sheet (17) having a metallized via pattern (41) and high-temperature stable polymer (25) as an insulator.

Abstract translation: 本发明一般涉及薄膜互连的结构和工艺，更具体地说涉及具有改进的尺寸稳定性和电性能的多层薄膜互连结构的结构和工艺。 本发明还涉及多层薄膜结构的制造方法。 单个薄膜结构被称为补偿器，并且在尺寸完整性方面起到地面/参考平面和稳定实体的作用。 补偿器主要包括具有金属化通孔图案和作为绝缘体的高温稳定聚合物的金属片。

公开(公告)号：EP0164392B1

公开(公告)日：1988-12-07

申请号：EP85900239.6

申请日：1984-12-05

Applicant: DAHLBERG, Rolf ,  DAHLBERG, Tomas

Inventor： DAHLBERG, Rolf ,  DAHLBERG, Tomas

IPC: H05K1/05 ,  H05K1/00

CPC classification number: H05K1/0203 ,  H05K1/053 ,  H05K3/0061 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10303 ,  H05K2201/10553 ,  H05K2201/10689 ,  H05K2203/0315

Abstract: A printed circuit board having a supporting base element (2) of anodized aluminum. A glue film (4) is interposed between the supporting base element and a laminate layer (7) which has a printed circuit (6a, 6b), the glue film sealing any pores in the anodic film of the supporting base element.

Abstract translation: 一种印刷电路板，具有阳极氧化铝的支撑底座元件（2）。 在支撑基体元件和具有印刷电路（6a，6b）的层压层（7）之间插入胶膜（4），胶膜密封支撑基体元件的阳极膜中的任何孔隙。