Abstract:
The present invention relates to a method for forming an aligned metal oxide nanostructure. The method for the aligned metal oxide nanostructure using an imprint lithography process or a KrF stepper, a KrF scanner, an i-line stepper, and an i-line scanner comprises: forming a metal oxide seed layer on a substrate; forming a resin pattern layer by the imprinting process; and exposing the metal oxide seed layer through a dry etching process or exposing the metal oxide seed layer by forming the resin pattern layer using the KrF stepper, the KrF scanner, the i-line stepper, and the i-line scanner to develop the metal oxide nanostructure from the metal oxide seed layer using a hydrothermal synthesis method. So the present invention has the advantage of making metal nanostructure of various shapes, sizes, and patterning; providing at a relatively low price; facilitating an alignment of large-scaled metal oxide nanostructure; preventing adhesion or deformation of the metal oxide nanostructure; and enabling an uniform formation and alignment of the nanostructure.
Abstract:
PURPOSE: A cooling apparatus for a wafer and a wafer cover using a gas is provided to prevent thermal damage to a wafer by forming a through hole in a tray for mounting a wafer. CONSTITUTION: A through hole (130) is formed in a tray. The tray transfers a low temperature gas to a wafer and a wafer cover. A tray body (110) is formed around a tray central part (120). An O-ring is in contact with the lower part of the wafer cover. An O-ring accommodating groove is formed along the cylindrical surface of the tray body.
Abstract:
PURPOSE: A 3-dimensional aligned nanostructure prepared by both imprint lithography and lift-off processes is provided to have a uniform size, various shape and constant arrangement by controlling the ratio of dry etching. CONSTITUTION: A manufacturing method a 3-dimensional aligned nanostructure comprises: a step of forming a polymer layer(102) on a substrate(101); a step of forming a photosensitive metal-organic material precursor layer on the upper part of the polymer layer; a step of preparing an imprint stamp; a step of pressurizing the photosensitive metal-organic precursor layer by the imprint stamp; and a step of forming a metal oxide thin-film pattern(105)by hardening the metal-organic precursor layer; a step of removing the imprint stamp from the metal oxide thin film pattern; a step of forming an undercut(106) by etching the polymer layer; a step of forming a metal oxide film(107); and a step of lift-offing the metal oxide thin film pattern and etching the polymer layer with an under cut.
Abstract:
기계적 강도가 우수하면서도 다공성 구조를 가져 내부 응력을 조절하기 쉬운 제올라이트 진동판을 채택해 감도 조절이 용이한 정전용량형 MEMS 마이크로폰 및 그 제조 방법을 제공한다. 본 발명에 따른 정전용량형 MEMS 마이크로폰은 관통홀이 형성된 기판, 상기 관통홀을 덮도록 상기 기판 상에 형성된 제올라이트 진동판, 상기 제올라이트 진동판 상에 형성된 하부 전극, 및 상기 기판에 지지되어 상기 하부 전극 위로 부상되며 복수의 공기유입구를 가지는 상부 전극을 포함한다.
Abstract:
PURPOSE: A solar cell having a p-n tunnel diode is provided to lower serial resistance by using an N-type substrate having small defect in comparison with a P-type substrate and forming an upper electrode and a lower electrode with an n-ohmic contact electrode. CONSTITUTION: In a solar cell having a p-n tunnel diode, a p-n diode tunnel(220) is formed on an n-type substrate(210) by successively laminating an n-type semiconductor and a p-type semiconductor to form a p-n junction. A photovoltatic cell(230) is formed on the p-n diode tunnel by successively laminating an n-type semiconductor and a p-type semiconductor to convert an optical signal into an electrical signal. A bottom electrode(270) is formed on the N-type substrate. A top electrode(260) is formed on the photovoltatic cell.
Abstract:
PURPOSE: A method for manufacturing a light emitting diode using a metal protection layer is provided to reduce the number of processes by forming an n-ohmic metal layer and a protection layer made of the same materials. CONSTITUTION: A photoresist pattern(260) is formed on an n type nitride semiconductor(240) to expose the part on which an n-ohmic metal layer is formed. A metal protection layer(250) is formed on the n type nitride semiconductor to cover the photoresist pattern and the n type nitride semiconductor. The surface of the n type nitride semiconductor is partially exposed by removing the photoresist pattern and a metal protection layer formed on the photoresist pattern. The surface of the n type nitride semiconductor is roughened by processing the exposed surface of the n type nitride semiconductor.