33.
    发明专利
    未知

    公开(公告)号:DE502005008192D1

    公开(公告)日:2009-11-05

    申请号:DE502005008192

    申请日:2005-06-29

    Abstract: The invention describes a method for producing a reflective layer system and a reflective layer system for application to a III/V compound semiconductor material, wherein a first layer, containing phosphosilicate glass, is applied directly to the semiconductor substrate Disposed thereon is a second layer, containing silicon nitride. A metallic layer is then applied thereto.

    37.
    发明专利
    未知

    公开(公告)号:DE102005047168A1

    公开(公告)日:2007-04-12

    申请号:DE102005047168

    申请日:2005-09-30

    Inventor: WIRTH RALPH

    Abstract: An optoelectronic semiconductor chip is disclosed which emits electromagnetic radiation from its front side (7) during operation, comprising: a semiconductor layer sequence (1) having an active region (4) suitable for generating the electromagnetic radiation, and a self-supporting and electrically conductive mechanical supporting layer (10) formed on the semiconductor layer sequence, which supporting layer mechanically supports the semiconductor layer sequence (1) and is transmissive to radiation of the semiconductor chip.

    39.
    发明专利
    未知

    公开(公告)号:DE102004040968A1

    公开(公告)日:2006-03-23

    申请号:DE102004040968

    申请日:2004-08-24

    Abstract: A luminescence diode ( 1 ) having an active zone ( 7 ) which emits electromagnetic radiation in a main radiating direction ( 15 ). A reflection-reducing layer sequence ( 16 ) is arranged downstream of the active zone ( 7 ) in the main radiating direction ( 15 ). The reflection-reducing layer sequence includes a DBR mirror ( 13 ), which is formed by at least one layer pair ( 11, 12 ), an antireflective layer ( 9 ) downstream of the DBR mirror ( 13 ) in the main radiating direction ( 15 ) and an intermediate layer ( 14 ) arranged between the DBR mirror ( 13 ) and the antireflective layer ( 9 ).

    40.
    发明专利
    未知

    公开(公告)号:DE102004021175A1

    公开(公告)日:2005-11-24

    申请号:DE102004021175

    申请日:2004-04-30

    Abstract: A semiconductor chip (1) for optoelectronics comprises a thin film containing a radiation-emitting zone with sides connecting rear and radiating sides and a film carrier at the back. There is a front contact (2) and a rear trench (3) with contact that does not overlap it and forms an inclined inner wall to turn the radiation. Independent claims are also included for the following: (A) a further semiconductor chip as above;and (B) production processes for these chips.

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