Abstract:
PURPOSE: A method for manufacturing a device and a lithography apparatus are provided to reduce the unbalance of the intensity of radiated ray by regulating the phases of diffracted radiation ray. CONSTITUTION: Radiation ray beam is used for illuminating the mask pattern of an alternating phase shift mask in order to obtain diffracted radiation ray beam(DB). The mask pattern is formed on a substrate using a projection system. The phases of the diffracted radiation ray beam are regulated using an optical phase regulator.
Abstract:
PURPOSE: An immersion lithography device and a manufacturing method thereof are provided to effectively and efficiently remove undesirable droplets from the surface of a substrate or a substrate table. CONSTITUTION: An immersion lithography device comprises the following: a projection system having an optical axis; a substrate table formed to maintain a substrate, defining the facing surface of the substrate and the substrate table itself; and a fluid handling structure for supplying an immersion liquid to an immersion space located on the surface facing the projection system. The fluid handling structure includes a fluid removal device(400), and a droplet removal device to remove droplets(200) form the immersion liquid.
Abstract:
PURPOSE: A lithography apparatus and a method for manufacturing a device are provided to control the flow of fluid through a fluid inlet by varying the flux of the fluid. CONSTITUTION: An illuminator(IL) receives a radiation beam(B) from a radiation source(SO). The illuminator includes an adjusting unit(AD) which adjusts the angular intensity distribution of the radiation beam. The radiation beam passes through a projection system(PS) and is focused on the target parts(C) on a substrate(W). A first location setting unit(PM) accurately locates a pattern device(MA). A substrate table(WT) moves to locate the target parts in the path of the radiation beam.
Abstract:
A displacement measuring system, a lithography device, and a manufacturing method thereof are provided to reduce sensitivity against an error and to decrease an installation space thereof. A displacement measuring system comprises first and second diffraction lattices, a sensor(216), and at least one linear polarizer(217,218). The first diffraction lattice is used to divide a first beam of inputted radiation into first positive and negative diffraction radiation beams(212,213). The first positive and negative diffraction radiation beams are diffracted more by the second diffraction lattice. The sensor is used to decide a relative displacement between the first and second diffraction lattices from a decision of a phase difference between a first component of the second beam deduced from the first positive diffraction radiation beam, and a second component of the second beam deduced from the first negative diffraction radiation beam. The linear polarizer is formed to diffract the first and second components of the second beam linearly and to position and cross the first and second components mutually. A lithography device is used to detect the displacement of the first component thereof against the second component thereof.
Abstract:
A method and a system for enhanced lithographic patterning are provided to print a pattern having a feature interval less than a printable minimum interval within a hard mask by using a single exposure method. A patterned radiation beam is applied to a hard mask layer provided on a substrate. First parts of the hard mask layer are exposed by using a first dose of radiation necessary for enhancing etch characteristics of the first parts from the patterned radiation beam. Second parts different from the first parts of the hard mask layer are exposed by using a second dose of radiation necessary for enhancing etch characteristics of the second parts from the patterned radiation beam. An etch process for the hard mask layer is performed. The first parts and the second parts are removed. Parts of the hard mask layer except the first and second parts are not damaged.
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus that enables accurate focus positioning of a substrate.SOLUTION: A lithographic apparatus includes: an illumination system configured to adjust a radiation beam; and a support medium constructed to support a patterning device capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The lithographic apparatus further includes: a substrate table constructed to hold a substrate; a positioner constructed to position the substrate table; a projection system configured to project the patterned radiation beam onto a target portion of the substrate; a substrate surface actuator arranged to engage a part of a surface of the substrate facing the projection system; and a position controller configured to control a position of the substrate table and arranged to drive the positioner and the substrate surface actuator.
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus in which the occurrence of thermal expansion/contraction effects is reduced, and more specifically, provide a system configured to reduce thermal expansion/contraction effects in an immersion system which uses a supply system which provides immersion fluid to a localized area of a substrate and/or substrate table.SOLUTION: The lithographic apparatus comprises a substrate table configured to support a substrate on a substrate supporting area and to support a heater and/or temperature sensor on a surface adjacent to the substrate supporting area.
Abstract:
PROBLEM TO BE SOLVED: To provide an efficient method to thermally condition an optical element that can be subjected to high heat loads during its operation, without impairing accuracy of the operation of the element.SOLUTION: A method for thermally conditioning an optical element includes irradiating the optical element with radiation, not irradiating the optical element with the radiation, allowing a heat flow between the optical element and a conditioning fluid that is held in a conditioning fluid reservoir, and providing a fluid flow of the conditioning fluid, to supply thermally conditioned fluid to the reservoir. A flow rate of the fluid during the irradiation of the optical element is lower than a flow rate of the fluid when the optical element is not irradiated.