Abstract:
Resists for use in ultraviolet, electron beam and x-ray exposure devices comprising a polymeric or molecular composition the solubility of which is dependent upon the presence of acid removable protecting groups and a sulfonic acid precursor which generates a strong acid upon exposure to such radiation. The preferred sulfonic acid precursors are triflate esters or benzenesulfonyloxy esters of N-hydroxyimides.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces cross-talk between conducting lines for wiring. SOLUTION: A method of forming a cavity in a semiconductor device 300 comprises a step for depositing an anti-nucleating layer 318 on the interior surface of the cavity in an ILD layer of the semiconductor device. This anti-nucleating layer prevents a subsequently-deposited dielectric layer from being formed in the cavity. By preventing the formation of these layers, capacitance is reduced, thereby resulting in improved semiconductor performance. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
A radiation sensitive resist compsn. comprises: (a) bis (lower alkyl phenyl) iodonium camphor sulphonate; and (b) a copolymer comprising hydroxystyrene and (meth)acrylate having an acid-clearable substituent.
Abstract:
A radiation sensitive resist compsn. comprises: (a) bis (lower alkyl phenyl) iodonium camphor sulphonate; and (b) a copolymer comprising hydroxystyrene and (meth)acrylate having an acid-clearable substituent.
Abstract:
A lithographic imaging process is provided for use in the manufacture of integrated circuits. A substrate is coated with a polymeric film comprising a vinyl polymer, a photosensitive acid generator, and acid labile groups. It is then heated to typically just above the glass transition temperature of the polymer, but below the cleavage temperature of the acid labile groups. The film is then expose imagewise to radiation to generate free acid, and the film is once more heated, again to typically just above the glass transition temperature of the polymer, but below the cleavage temperature of the acid labile groups. Finally the image is developed. The process provides protection to the photoresist film from airborne chemical contaminants.
Abstract:
A radiation sensitive resist compsn. comprises: (a) bis (lower alkyl phenyl) iodonium camphor sulphonate; and (b) a copolymer comprising hydroxystyrene and (meth)acrylate having an acid-clearable substituent.
Abstract:
Vorgesehen wird ein Verfahren zur Depolymerisation von Polyester aus gebrauchten Produkten, wie Getränkeflaschen, zur Herstellung eines hochreinen Reaktionsprodukts. Für die Depolymerisationsreaktion werden die Polyester mit einem Alkohol mit 2 bis 5 Kohlenstoffen und einem Amin-Organokatalysator bei einer Temperatur von etwa 150 °C bis etwa 250 °C miteinander reagiert. In einer Anwendung ermöglicht die Verwendung eines Organokatalysators mit einem Siedepunkt, der wesentlich unter dem Siedepunkt des Alkohol-Reaktants liegt, das einfache Recycling des Amin-Organokatalysators. In einer anderen Anwendung ermöglicht die Durchführung der Depolymerisationsreaktion unter Druck bei einer Temperatur über der des Alkohols beschleunigte Depolymerisationsraten und die Rückgewinnung des Organokatalysators ohne weitere Wärmezufuhr. In einer weiteren Anwendung erzeugt die glykolitische Depolymerisation von Poly(ethylenterephthalat)(PET) aus gebrauchten Getränkeflaschen ein reines Reaktionsprodukt von Bis(2-hydroxyethyl)terephthalat (BHET), was wiederum zur Herstellung eines hochreinen PET in Getränkeflaschenqualität verwendet werden kann, in einem Closed Loop-Prozess mit minimalem Ausstoß und Abfall.
Abstract:
The present invention relates to an improved chemically amplified photoresist composition comprising (i) a photosensitive acid generator and (ii) a polymer comprising the reaction product of hydroxystyrene with acrylate, methacrylate or a mixture of acrylate and methacrylate.
Abstract:
The present invention relates to a hybrid photoresist composition for improved resolution and a pattern forming method using the photoresist composition. The photoresist composition includes a radiation sensitive acid generator, a crosslinking agent and a polymer having a hydrophobic monomer unit and a hydrophilic monomer unit containing a hydroxyl group. At least some of the hydroxyl groups are protected with an acid labile moiety having a low activation energy. The photoresist is capable of producing a hybrid response to a single exposure. The patterning forming method utilizes the hybrid response to form a patterned structure in the photoresist layer. The photoresist composition and the pattern forming method of the present invention are useful for printing small features with precise image control, particularly spaces of small dimensions.