公开(公告)号：US5690270A

公开(公告)日：1997-11-25

申请号：US745782

申请日：1996-11-08

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A device and method for mounting a surface mount package onto a printed circuit board includes inserting a pin through a printed circuit board feedthrough for providing movement of the pin within the feedthrough. One end of the pin is soldered to conductive surfaces on the bottom side of the printed circuit board while the other end of the pin id soldered to a surface mount package pad. The package is mounted in a spaced relation with a printed circuit board top surface. The pin is soldered to the board conductive surface using a high temperature solder for forming a solder joint which remains solid during subsequent soldering using a low temperature solder such as a lead tin solder type. The pin is then soldered to the pad of the surface mount package using the low temperature lead tin solder for forming a solder joint between the pad and pin. The pin is sized for loosely fitting within the feedthrough and thus movement caused by a coefficient of thermal expansion mismatch between materials of the pad, pin, and printed circuit board is absorbed by movement of the pin within the feedthrough. As a result, stress relief is provided for the solder joints.

Abstract translation: 用于将表面贴装封装安装到印刷电路板上的装置和方法包括将引脚插入穿过印刷电路板馈通以提供销在馈通内的运动。 引脚的一端焊接到印刷电路板底部的导电表面，而引脚ID的另一端焊接到表面贴装封装焊盘。 封装以与印刷电路板顶表面间隔的关系安装。 使用高温焊料将引脚焊接到板导电表面，用于形成焊接接头，在使用诸如铅锡焊料类型的低温焊料的后续焊接期间保持固体。 然后使用低温铅锡焊料将引脚焊接到表面贴装封装的焊盘，以在焊盘和引脚之间形成焊接接头。 该销的尺寸适于松动地配合在馈通内，并且因此由焊盘，销和印刷电路板的材料之间的热膨胀失配系数引起的移动被引脚内的引脚的移动所吸收。 因此，为焊点提供了应力消除。

公开(公告)号：US5533665A

公开(公告)日：1996-07-09

申请号：US360403

申请日：1994-12-21

Applicant: William Y. Sinclair ,  James P. Walter

Inventor： William Y. Sinclair ,  James P. Walter

IPC: H01R12/58 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K1/141 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K3/341 ,  H05K3/3447 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract translation: 用于连接到印刷电路板的适配销包括细长的导电针，其具有与一端相邻的扩大部分，用于形成与通过电路板部分钻孔的机械过盈配合。 该销在销的扩大部分和相对端之间具有扩大的横截面焊接部分，以限制销进入电路板的孔的程度。 每个引脚的放大部分通过焊接电连接到电路板上的电路路径上。 通过这种布置，可实现销和电路板之间的刚性机械连接，因此用于将表面安装的芯片连接到板的相对侧的板的后续再加热将不会干扰适配器之间的电气和机械连接 引脚和电路板。

公开(公告)号：US5521427A

公开(公告)日：1996-05-28

申请号：US340807

申请日：1994-11-17

Applicant: Chok J. Chia ,  Seng-Sooi Lim

Inventor： Chok J. Chia ,  Seng-Sooi Lim

IPC: H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H01L23/544

CPC classification number: H05K3/303 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K2201/10303 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10962 ,  H05K2203/167 ,  H05K3/3421 ,  Y02P70/613 ,  Y10S438/975 ,  Y10T29/49121 ,  Y10T29/49133

Abstract: A packaged semiconductor device, leadframe for making same, and method of mounting same to a printed circuit board are described. The device has a body, and a plurality of leads extending from the body. One or more alignment features are formed on the exterior of the package body, for maintaining precise alignment of the device with respect to a printed wiring board. The alignment feature is a tab formed as part of portion of the leadframe external to the package body. The tab may have various shapes, and may be provided with a hole for registering with a pin on an underlying substrate, such as a printed wiring board. The pin and the tab may be electrically connected.

Abstract translation: 描述了一种封装的半导体器件，用于制造其的引线框，以及将其安装到印刷电路板的方法。 该装置具有主体和从主体延伸的多个引线。 一个或多个对准特征形成在包装体的外部上，以保持装置相对于印刷线路板的精确对准。 对准特征是形成为包装体外部的引线框架的一部分的突片。 突片可以具有各种形状，并且可以设置有用于与诸如印刷线路板的下面的基板上的销对准的孔。 引脚和突片可以电连接。

公开(公告)号：US5410452A

公开(公告)日：1995-04-25

申请号：US199764

申请日：1994-02-18

Applicant: William Y. Sinclair ,  James P. Walter

Inventor： William Y. Sinclair ,  James P. Walter

IPC: H01R12/58 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K1/141 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K3/341 ,  H05K3/3447 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract translation: 用于连接到印刷电路板的适配销包括细长的导电针，其具有与一端相邻的扩大部分，用于形成与通过电路板部分钻孔的机械过盈配合。 该销在销的扩大部分和相对端之间具有扩大的横截面焊接部分，以限制销进入电路板的孔的程度。 每个引脚的放大部分通过焊接电连接到电路板上的电路路径上。 通过这种布置，可实现销和电路板之间的刚性机械连接，因此用于将表面安装的芯片连接到板的相对侧的板的后续再加热将不会干扰适配器之间的电气和机械连接 引脚和电路板。

公开(公告)号：US5370540A

公开(公告)日：1994-12-06

申请号：US141579

申请日：1993-10-27

Applicant: Shigeyuki Kobayashi

Inventor： Shigeyuki Kobayashi

IPC: H01R12/55 ,  H01R13/40 ,  H01R13/533 ,  H01R24/00 ,  H01R43/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01R9/09

CPC classification number: H01R12/58 ,  H01R43/205 ,  H05K3/306 ,  H05K1/0271 ,  H05K1/18 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K3/301

Abstract: Disclosed are a circuit board connector which neither brings upon any defective conductivity due to the generation of crack and the like nor requires any separation even when the number of connector pins is great, and a board having a strong resistance against thermal effect. The circuit board connector is constructed so that a plurality of connector pins 1 held by a holder member 20 arranged in the longitudinal direction are inserted into holes 17 of circuit patterns in circuit board 7 for a subsequent soldering, and the holder member is constructed to be expandable, contractive, and deformable in the longitudinal direction.

Abstract translation: 公开了一种电路板连接器，即使当连接器针数很多时也不会产生由于裂纹等的产生导致的导电性，也不需要任何分离，并且具有很强的耐热效应的板。 电路板连接器被构造成使得由沿纵向布置的保持器构件20保持的多个连接器针脚1插入到电路板7中的电路图案的孔17中用于随后的焊接，并且保持器构件被构造为 在纵向可膨胀，收缩和变形。

公开(公告)号：US5368220A

公开(公告)日：1994-11-29

申请号：US925086

申请日：1992-08-04

Applicant: Howard Mizuhara ,  P. C. Smith

Inventor： Howard Mizuhara ,  P. C. Smith

IPC: C04B37/02 ,  B23K1/00 ,  H01L21/48 ,  H01L21/683 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H01B17/26 ,  B23K35/30 ,  B23K101/38

CPC classification number: H01L21/6831 ,  B23K1/0008 ,  H01L21/486 ,  H05K3/4046 ,  H05K1/0306 ,  H05K2201/10303 ,  H05K3/3447

Abstract: A method of manufacturing a hermetically sealed conductive feedthrough, particularly for use in ceramic substrates or housing, comprises the steps of inserting an active alloy containing preform into a predetermined insertion hole in a presintered ceramic article and heating the assembly to a temperature to achieve a brazing reaction at the interface of the article and active alloy to produce a hermetically sealed conductive feedthrough. The invention further discloses a non-melting connector pin which may be fixed to the active alloy feedthrough during the above heating step.

Abstract translation: 特别是用于陶瓷基板或壳体的气密密封导电馈通件的制造方法包括以下步骤：在预烧结的陶瓷制品中将含有活性合金的预成型体插入到预定的插入孔中，并将组件加热至达到钎焊的温度 在物品和活性合金的界面处的反应以产生气密密封的导电馈通。 本发明还公开了一种在上述加热步骤中可固定到活性合金馈通的非熔化连接器销。

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。

公开(公告)号：US5303119A

公开(公告)日：1994-04-12

申请号：US60677

申请日：1993-05-11

Applicant: Johan O. Hilbrink

Inventor： Johan O. Hilbrink

IPC: H01L23/538 ,  H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L23/5385 ,  H01L23/5383 ,  H01L23/5387 ,  H05K3/363 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/141 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/36

Abstract: The invention concerns a carrier for Integrated Circuits (ICs). The ICs are carried by a multi-layer board, constructed of individual layers. Some layers carry conductive traces, and the traces are connected together to form a 3-dimensional network connecting the ICs. The individual layers are constructed of a flexible material, which is commercially available in large sheets, thus allowing multiple copies of the trace patterns to be printed simultaneously. The multi-layer board is attached to a standard printed circuit board, by pins which are driven through them both, and soldered into place.

Abstract translation: 本发明涉及集成电路（IC）的载体。 IC由多层板承载，由多层构成。 一些层携带导电迹线，并且迹线连接在一起以形成连接IC的3维网络。 单个层由柔性材料构成，该材料可在大片材上商购，从而允许同时印刷迹线图案的多个拷贝。 多层板通过两个驱动的引脚连接到标准印刷电路板上，并焊接到位。

公开(公告)号：US5045642A

公开(公告)日：1991-09-03

申请号：US509833

申请日：1990-04-17

Applicant: Hideo Ohta ,  Kenji Miyamoto ,  Wilson O. W. San ,  Alfred M. Martini

Inventor： Hideo Ohta ,  Kenji Miyamoto ,  Wilson O. W. San ,  Alfred M. Martini

IPC: H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/44

CPC classification number: H05K1/021 ,  H01L23/3672 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/0206 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/10303 ,  H05K3/445

Abstract: The invention provides a printed wiring board having a plurality of copper foil cores superposed over one another and spaced away from one another. The portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. Another printed wiring board has a plurality of copper foil cores superposed over one another and spaced away from one another. The end portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. The underside of the copper foil core at the lowermost position is exposed at a recess formed on the rear side of the board. Plating is formed which extends from the lowermost copper foil core to the rear side of the board.

Abstract translation: 本发明提供了一种印刷线路板，其具有彼此叠置并彼此分开的多个铜箔芯。 芯的部分在板的端面处露出。 多个孔垂直延伸穿过铜箔芯，并且具有孔定义的内表面，如此电镀以将芯彼此连接。 另一印刷布线板具有彼此叠置并彼此分开的多个铜箔芯。 芯的端部在板的端面处露出。 多个孔垂直延伸穿过铜箔芯，并且具有孔定义的内表面，如此电镀以将芯彼此连接。 在最下位置的铜箔芯的下侧露出在形成在板背面的凹部。 形成从最下面的铜箔芯延伸到板的后侧的电镀。

公开(公告)号：US5044966A

公开(公告)日：1991-09-03

申请号：US355749

申请日：1989-05-23

Applicant: Peter Friesen

Inventor： Peter Friesen

IPC: H01R4/58 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/20 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K3/027 ,  H01R12/58 ,  H01R4/58 ,  H05K3/202 ,  H05K3/281 ,  H05K3/308 ,  H05K1/0254 ,  H05K1/056 ,  H05K2201/0355 ,  H05K2201/09118 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2203/107 ,  H05K3/0061 ,  H05K3/107

Abstract: An electrical panel for particularly supporting and supplying electrical connections for a plurality of electrical components comprises a sandwich formed by a central conducting layer computer design to form a plurality of conducting paths which are laser cut from a sheet of cooper and a pair of covering plastic layers of insulating material. Mechanical anchoring points extend through the sandwich missing the conducting paths into an optional supporting steel sheet. Electrical connecting points comprise screw threaded pins which engage into female screw threads formed in the front insulating layer and into the conducting layer.

Abstract translation: 用于特别支撑和供应用于多个电气部件的电连接的电气面板包括由中心导电层计算机设计形成的夹层，以形成多个导电路径，这些导电路径是从铜板和一对覆盖塑料层激光切割的 的绝缘材料。 机械锚定点延伸穿过夹层，将导电路径丢弃到可选的支撑钢板中。 电连接点包括螺纹销，其接合形成在前绝缘层中并进入导电层的内螺纹螺纹。