公开(公告)号：US11744018B2

公开(公告)日：2023-08-29

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32 ,  H01L29/20 ,  H01G4/30 ,  H01L25/07 ,  H01L29/16

CPC classification number: H05K1/181 ,  H01G4/38 ,  H05K1/0272 ,  H05K1/145 ,  H05K3/328 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US20230217593A1

公开(公告)日：2023-07-06

申请号：US17927797

申请日：2021-05-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Il Sik NAM ,  Dong Keun LEE ,  Hye Jin JO

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L23/49827 ,  H05K1/186 ,  H05K1/0271 ,  H05K3/3415 ,  H05K3/4007 ,  H05K3/4697 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/11462 ,  H01L2224/11912 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2203/0723

Abstract: A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact portion disposed on the first connection portion; a first device disposed on the first connection portion through the first contact portion; a second contact portion disposed under a lower surface of a second-first circuit pattern of the second outer circuit pattern; a second device attached to the second-first circuit pattern through the second contact portion; and a second connection portion disposed under a lower surface of a second-second circuit pattern of the second outer circuit pattern; wherein the first connection portion is disposed with a first width and a first interval, and wherein the second connection portion is disposed with a second width greater than the first width and a second interval greater than the first interval.

公开(公告)号：US20180343739A1

公开(公告)日：2018-11-29

申请号：US15957246

申请日：2018-04-19

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI ,  SHOU-TE YEN

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0243 ,  H05K1/0248 ,  H05K1/113 ,  H05K1/114 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10712 ,  H05K2201/10734

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.

公开(公告)号：US20180279475A1

公开(公告)日：2018-09-27

申请号：US15552970

申请日：2016-02-23

Applicant: JENOPTIK Polymer Systems GmbH

Inventor： Bernd KLOTH ,  Matthias FLUEGEL ,  Roman JAIKOW

IPC: H05K1/14 ,  H05K3/30 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H05K1/18

CPC classification number: H05K1/145 ,  H01L25/0753 ,  H01L25/165 ,  H01L25/167 ,  H01L33/62 ,  H01L2933/0066 ,  H05K1/144 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/042 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10424 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: A light-emitting diode apparatus (100) comprises a light-emitting diode element (102) having a front (106) and a back (128), wherein the front (106) has an emission region (108) for emitting electromagnetic waves (110) and a diode connection contact (112) that is associated with the emission region (108), and comprises a printed circuit board (104) having a passage opening (114) and a plate connection contact (118), wherein the front (106) of the light-emitting diode element (102) is connected to the printed circuit board (104), and wherein the emission region (108) is arranged opposite the passage opening (114) and the diode connection contact (112) is arranged opposite the plate connection contact (118) and is electrically conductively connected to the plate connection contact (118). A cover unit (120) having a recess (122) for holding the light-emitting diode element (102) is connected to the printed circuit board (104), wherein the cover unit (120) is formed from a further printed circuit board.

公开(公告)号：US20180270958A1

公开(公告)日：2018-09-20

申请号：US15924412

申请日：2018-03-19

Applicant: IBIDEN CO. , LTD.

Inventor： Katsutoshi KITAGAWA ,  Takema ADACHI

IPC: H05K1/18 ,  H01L27/146 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K1/183 ,  H01L27/14634 ,  H01L27/14636 ,  H05K1/113 ,  H05K1/181 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/184 ,  H05K3/188 ,  H05K3/424 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/107

Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

公开(公告)号：US20180166200A1

公开(公告)日：2018-06-14

申请号：US15835486

申请日：2017-12-08

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Chuh Hsien Lu ,  Da-Jung Chen

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.

公开(公告)号：US20180116078A1

公开(公告)日：2018-04-26

申请号：US15789184

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju MUN ,  Keon KUK ,  Ji-woon YEOM

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/18 ,  H01L23/552 ,  H05K3/40

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4007 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/163

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

公开(公告)号：US20180063955A1

公开(公告)日：2018-03-01

申请号：US15406360

申请日：2017-01-13

Applicant: Apple Inc.

Inventor： Charles W. WERLEY ,  Haran BALARAM ,  Richard L. WINSLOW

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K1/113 ,  H05K1/181 ,  H05K3/328 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2203/107

Abstract: An electronic device having a circuit board and a battery is disclosed. The circuit board may include a through hole and an electrical pad surrounding the through hole. In order to electrically couple the circuit board to the battery, and in particular, an electrode of the battery, a tab (or plaque) is placed between the electrical pad and the electrode. The tab electrically couples with the electrical pad by a soldering operation. To couple (electrically and mechanically) the tab with the electrode, a welding operation is used. The welding operation may include a laser weld providing thermal energy through a laser beam. In this regard, the laser beam passes through the through hole, thereby (partially) melting the tab and forming a weld between the tab and the electrode. Accordingly, the tab covers the through hole such that the tab is positioned to receive the laser beam.

公开(公告)号：US09881736B2

公开(公告)日：2018-01-30

申请号：US14941513

申请日：2015-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park

IPC: H01G4/228 ,  H01G4/30 ,  H01G4/005 ,  H01G4/06 ,  H01G2/06 ,  H01G4/38 ,  H01G4/224 ,  H05K1/02 ,  H05K1/18 ,  H01G2/02 ,  H01G4/232

CPC classification number: H01G2/065 ,  H01G2/02 ,  H01G4/224 ,  H01G4/232 ,  H01G4/38 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10545 ,  Y02P70/611 ,  Y02T10/7022

Abstract: A multilayer ceramic component includes multilayer ceramic capacitors disposed on opposing surfaces of a board in a thickness direction of the board and metal terminals connected to electrode pads disposed on the board. The metal terminals are partially exposed to an exterior of the multilayer ceramic component.

公开(公告)号：US09839127B2

公开(公告)日：2017-12-05

申请号：US14793384

申请日：2015-07-07

Applicant: Heung Kyu Kwon ,  Kyoung Mook Lim

Inventor： Heung Kyu Kwon ,  Kyoung Mook Lim

IPC: H05K1/18 ,  G01R31/28 ,  G06F1/16 ,  H01L23/552 ,  H01L25/065 ,  H01L23/31 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  G01R31/2884 ,  G06F1/1613 ,  G06F1/1637 ,  H01L23/3121 ,  H01L23/552 ,  H01L25/065 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06596 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0268 ,  H05K1/112 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.