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    Manufacturing method of metal structure of flexible multi-layer substrate
    35.
    发明授权
    Manufacturing method of metal structure of flexible multi-layer substrate 有权
    柔性多层基材金属结构的制造方法

    公开(公告)号：US09398704B2

    公开(公告)日：2016-07-19

    申请号：US13541664

    申请日：2012-07-04

    Applicant: Chih-kuang Yang

    Inventor： Chih-kuang Yang

    IPC: H01R9/00 ,  H05K3/40 ,  H05K1/11 ,  H05K3/04

    CPC classification number: H05K3/4007 ,  H05K1/111 ,  H05K1/118 ,  H05K3/048 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/0594 ,  Y10T29/4913 ,  Y10T29/49165

    Abstract: A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.

    Abstract translation: 一种用于多层基板的金属结构制造方法包括在第一介电层上涂覆光致抗蚀剂层; 对光致抗蚀剂层进行光刻工艺以限定第一金属层的特定位置; 在特定位置去除光致抗蚀剂层; 以及在所述特定位置形成所述第一金属层，其特征在于，所述第一金属层的基极面积比所述第一金属层的顶面积大，并且嵌入基体和所述主体以相同的工序形成并且是整体形成的。 所述制造方法可以用于制造柔性多层基板的焊盘或金属线，并且所制造的金属结构不容易从接触的介电层分层或分离。

    Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
    37.
    发明授权
    Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug 有权
    电容式微加工超声波换能器（CMUT），带有通孔（TSV）基板插头

    公开(公告)号：US09351081B2

    公开(公告)日：2016-05-24

    申请号：US13779210

    申请日：2013-02-27

    Applicant: Texas Instruments Incorporated

    Inventor： Peter B Johnson ,  Ira Oaktree Wygant

    IPC: H02N1/00 ,  H04R19/00 ,  B06B1/02

    CPC classification number: B06B1/0292 ,  B06B2201/76 ,  B81B7/007 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/036 ,  H02N1/006 ,  H04R19/005 ,  H05K2201/09845 ,  H05K2201/09863

    Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) device includes at least one CMUT cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (TSV) extending a full thickness of the first substrate. The TSV is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate. A membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (MEMS) cavity. A metal layer is over the top side substrate contact area and over the movable membrane including coupling of the top side substrate contact area to the movable membrane.

    Abstract translation: 电容式微加工超声波传感器（CMUT）装置包括至少一个CMUT单元，其包括单晶材料的第一基板，其具有包括厚和薄的电介质区域的在其上的图案化电介质层的顶侧，以及贯穿基板通孔 TSV）延伸第一基板的整个厚度。 TSV由单晶材料形成，通过单晶材料中的隔离区电隔离，并且位于第一基板的顶侧接触区域的下方。 膜层结合到厚电介质区域和薄介电区域上，以在微机电系统（MEMS）腔体上提供可移动膜。 金属层在顶侧基板接触区域上方并且在可移动膜上方，包括顶侧基板接触区域与可动膜的耦合。

    FLEX-RIGID WIRING BOARD
    38.
    发明申请
    FLEX-RIGID WIRING BOARD 审中-公开
    FLEX-RIGID接线板

    公开(公告)号：US20160066429A1

    公开(公告)日：2016-03-03

    申请号：US14837143

    申请日：2015-08-27

    Applicant: IBIDEN CO., LTD.

    Inventor： Hirotaka TANIGUCHI ,  Dongdong WANG ,  Michimasa TAKAHASHI

    IPC: H05K1/18 ,  H05K1/14

    CPC classification number: H05K1/0278 ,  H05K1/0281 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4688 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1184 ,  H05K2203/308

    Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.

    Abstract translation: 挠性刚性布线板包括柔性基材结构，从柔性基材结构的相对端延伸的刚性基材结构，嵌入刚性基材结构中的电子部件，层压在第一表面上的第一堆积层 柔性基材结构和刚性基材结构，并具有暴露柔性基材结构的曝光部分，以及层压在柔性基材结构和刚性基材结构的第二表面上的第二堆积层，并具有露出柔性基体 材料结构。 第一和第二积层形成为使得由第一和第二积聚层的暴露部分暴露的柔性基底材料结构形成可弯曲部分，并且刚性基底材料结构和第一和第二积聚层形成不可弯曲部分 连接到可弯曲部分。

    Imprinted bi-layer micro-structure method
    39.
    发明授权
    Imprinted bi-layer micro-structure method 有权
    印刷双层微结构法

    公开(公告)号：US09277642B2

    公开(公告)日：2016-03-01

    申请号：US14012216

    申请日：2013-08-28

    Applicant: Eastman Kodak Company

    Inventor： Ronald Steven Cok

    IPC: H05K1/02 ,  H05K3/46 ,  H05K3/12 ,  H05K3/00 ,  H05K1/09

    CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

    Abstract: A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing first, second, and third different stamps. A curable bottom, connecting layer, and top layer are formed on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer in the central area and the edge area, a connecting-layer micro-channel is imprinted in the connecting layer in the edge area over the bottom-layer micro-channel, an edge micro-channel is imprinted in the top layer in the edge area over the connecting-layer micro-channel, and top-layer micro-channels are imprinted in the top layer over the central area. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.

    Abstract translation: 制造压印微线结构的方法包括提供具有与边缘区域分离的边缘区域和中心区域的基板，并提供第一，第二和第三不同的邮票。 在基板上形成可固化的底部，连接层和顶层。 底层微通道印在中心区域和边缘区域的底层中，连接层微通道被压印在底层微通道上的边缘区域中的连接层中，边缘 微通道印在连接层微通道上的边缘区域的顶层中，顶层微通道印在中心区域的顶层中。 微线形成在每个微通道中。 中心区域的底层微线电连接到边缘区域中的边缘微线，并与顶层微线电隔离。

    Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad
    40.
    发明申请
    Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad 审中-公开
    印刷电路板及其制造方法，以及用于制造印刷电路的装置

    公开(公告)号：US20150382459A1

    公开(公告)日：2015-12-31

    申请号：US14751400

    申请日：2015-06-26

    Applicant: Shih-Chuan Tsai ,  Ching-Chang Yang

    Inventor： Shih-Chuan Tsai ,  Ching-Chang Yang

    IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K3/14 ,  H05K1/11 ,  H05K3/00

    CPC classification number: H05K3/4664 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/465 ,  H05K2201/09845 ,  H05K2203/1572

    Abstract: The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided.

    Abstract translation: 本公开提供了一种印刷电路板及其制造方法，以及一种用于制造印刷电路板的装置。 印刷电路板包括具有上表面的基板; 在衬底的上表面中的第一沟槽; 形成在第一沟槽中并穿透基板的第一通孔; 以及设置在所述第一沟槽和所述第一通孔中的第一导电层，所述第一沟槽电连接到所述第一通孔。 还提供了制造印刷电路板的方法和用于制造印刷电路板的装置。

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