公开(公告)号：US20090166339A1

公开(公告)日：2009-07-02

申请号：US12279486

申请日：2007-02-15

Applicant: Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

Inventor： Bruno Lefevre ,  Christian Schwartz ,  Jean-Yves Moreno

IPC: B23K31/02 ,  B23K1/00

CPC classification number: H05K13/00 ,  B23K3/047 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2201/10515 ,  H05K2201/10848 ,  H05K2203/1115 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

Abstract: The invention relates to a method for producing an electronic module (2) comprising a printed circuit (4) board (3), at least one first type of component (5), and a second type of component (6), said method comprising the following steps: solder is placed on the board; the first type of component is positioned; the solder is melted in order to solder the first type of component; the second type of component is positioned in such a way that it extends above the first type of component and has tongues (7) supported on the board by means of solder; and the solder is melted in order to solder the second type of component.

Abstract translation: 本发明涉及一种用于制造电子模块（2）的方法，该电子模块（2）包括印刷电路板（4），至少一种第一类型的部件（5）和第二类型的部件（6），所述方法包括 以下步骤：将焊料放在板上; 定位第一种类型的部件; 焊料熔化以便焊接第一类型的部件; 第二类型的部件被定位成使得其在第一类型的部件上方延伸并且具有通过焊料支撑在板上的舌部（7）; 并且焊料熔化以便焊接第二类型的部件。

公开(公告)号：US20090091007A1

公开(公告)日：2009-04-09

申请号：US11867821

申请日：2007-10-05

Applicant: John Tellkamp

Inventor： John Tellkamp

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A packaged surface-mount semiconductor device has the outer, un-encapsulated lead segments structured in five adjoining portions: The first portion protrudes from the encapsulation about horizontally; the second portion forms a convex bend downwardly; the third portion is approximately straight downwardly; the fourth portion forms a concave bend upwardly; and the fifth portion is straight horizontally. Each segment has across the width a first groove in the third portion, either on the bottom surface or on the top surface. Preferably, the groove is about 2 leadframe thicknesses vertically over the bottom surface of the fifth lead portion. When stamped, the groove may have an angular outline about 5 and 50 μm deep; when etched, the groove may have an approximately semicircular outline about 50 to 125 μm deep. A second groove may be located in the second segment portion; a third groove may be located in the transition region from the third to the fourth segment portions.

Abstract translation: 封装的表面贴装半导体器件具有构造在五个相邻部分中的外部未封装引线段：第一部分围绕水平从封装突出; 第二部分向下形成凸起的弯曲部分; 第三部分大致直线向下; 第四部分向上形成凹弯; 第五部分是水平的。 每个段在宽度上具有第三部分中的第一凹槽，无论是在底表面上还是在顶表面上。 优选地，凹槽在垂直于第五引线部分的底表面上的约2个引线框厚度。 当冲压时，凹槽可以具有大约5和50毫米深的角轮廓; 当蚀刻时，凹槽可以具有约50至125μm深的约半圆形轮廓。 第二槽可以位于第二段部分中; 第三凹槽可以位于从第三分段部分到第四分段部分的过渡区域中。

公开(公告)号：US20080190653A1

公开(公告)日：2008-08-14

申请号：US11912607

申请日：2005-04-25

Applicant: Ola Tageman ,  Per Ligander

Inventor： Ola Tageman ,  Per Ligander

IPC: H05K1/00

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K3/3426 ,  H05K7/205 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/10848 ,  Y02P70/611 ,  Y10T29/49826

Abstract: The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.

Abstract translation: 本发明涉及电子设备的表面安装组件。 更具体地说，它涉及高频电子部件的安装，以及用于低成本电路板的高效冷却。 特别涉及高效运输热量并消除微波设备中的气隙。

公开(公告)号：US07319304B2

公开(公告)日：2008-01-15

申请号：US10897801

申请日：2004-07-23

Applicant: Balaguru K. Veloo ,  Kevin I. Bertness

Inventor： Balaguru K. Veloo ,  Kevin I. Bertness

IPC: H02J7/00 ,  B23P19/00

CPC classification number: H05K1/0263 ,  B60R16/023 ,  G01R1/203 ,  G01R31/006 ,  G01R31/3696 ,  H02J7/14 ,  H02M2001/0009 ,  H05K3/222 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10022 ,  H05K2201/10272 ,  H05K2201/10848 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53135

Abstract: A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.

Abstract translation: 提供了一种将分流器耦合到能量管理系统的印刷电路板（PCB）的方法。 该方法包括将柔性电连接器耦合到分流器并将柔性电连接器焊接到能量管理系统的PCB上的连接点。 还提供了一种包括使用上述方法耦合到印刷电路板的分流器的能量管理系统。

公开(公告)号：US20070290342A1

公开(公告)日：2007-12-20

申请号：US11763150

申请日：2007-06-14

Applicant: Jun Ishikawa

Inventor： Jun Ishikawa

IPC: H01L23/48

CPC classification number: H01L25/072 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/328 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10848 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The first external electrode has a main body portion a part of which is buried in a side wall of a case and joining portions protruding from an end of the main body portion toward the inside of the case. Each joining portion of the first external electrode is formed to have a thickness smaller than that of the main body portion, and an end portion of each joining portion is directly joined onto a wiring pattern of the insulating substrate through ultrasonic joining. Therefore, a load and ultrasonic vibration necessary for joining the joining portion onto the wiring pattern can be suppressed, which makes it possible to directly join the first external electrode onto the wiring pattern of the insulating substrate without damaging an insulating member of the insulating substrate.

Abstract translation: 第一外部电极具有主体部分，其一部分被埋在壳体的侧壁中，并且从主体部分的端部朝向壳体的内部突出的接合部分。 第一外部电极的每个接合部分形成为具有比主体部分的厚度小的厚度，并且每个接合部分的端部通过超声波接合直接接合到绝缘基板的布线图案上。 因此，可以抑制将接合部分接合到布线图案上所需的负载和超声波振动，这使得可以在不损坏绝缘基板的绝缘构件的情况下将第一外部电极直接接合到绝缘基板的布线图案上。

公开(公告)号：US20060137815A1

公开(公告)日：2006-06-29

申请号：US11355772

申请日：2006-02-16

Applicant: Masato Koike ,  Katsumi Fujimoto

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: B32B37/00 ,  B32B7/12

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的销连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US20040155560A1

公开(公告)日：2004-08-12

申请号：US10735704

申请日：2003-12-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: H02N002/00

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的引脚连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US5369551A

公开(公告)日：1994-11-29

申请号：US148292

申请日：1993-11-08

Applicant: John G. Gore ,  Neal J. Tolar

Inventor： John G. Gore ,  Neal J. Tolar

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/0243 ,  H05K1/141 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3442 ,  H05K3/3447 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613

Abstract: An interface printed circuit board is configured to be placed between a leadless component such as a surface mount package used to house a SAW device and a standard printed circuit board configured for solder joints in a leadless contact with the printed circuit board. The interface device is made using materials having similar characteristic thermal expansion properties as that of the printed circuit to with it is affixed. Solder pads are placed in offset pairs and interface board material is removed such that the combination causes the interface board to flex from the forces caused by the differing expansion coefficients of the solder, the package and the printed circuit boards. The configuration causes the relative movement between the leadless carrier and the printed circuit board to occur along a length of epoxy and glass board material by bending the epoxy and glass as opposed to applying tensional or compressive forces to the solder joints. Such an approach relieves the stress and resulting creep seen at solder joints in the typical solder joint or column. In addition, by segregating the input and output pads and placing a metal shield between them, crosstalk rejection of the components is improved.

Abstract translation: 接口印刷电路板被配置为放置在诸如用于容纳SAW器件的表面安装封装的无引线部件和被配置为与印刷电路板无引线接触的焊接点的标准印刷电路板之间。 接口装置使用具有与印刷电路相似的特性热膨胀特性的材料制成，以便将其固定。 焊盘被放置在偏移对中，并且移除接口板材料，使得组合使得接口板从由焊料，封装和印刷电路板的不同膨胀系数引起的力弯曲。 通过弯曲环氧树脂和玻璃，这种结构使得无引线载体和印刷电路板之间的相对运动沿环氧树脂和玻璃板材料的长度发生，而不是向焊点施加张力或压缩力。 这种方法减轻了典型焊点或柱中焊点处的应力和结果蠕变。 此外，通过分离输入和输出焊盘并在它们之间放置金属屏蔽，组件的串扰抑制被改善。

公开(公告)号：US4333069A

公开(公告)日：1982-06-01

申请号：US206703

申请日：1980-11-14

Applicant: Joseph P. Worth ,  Bert B. Fletcher

Inventor： Joseph P. Worth ,  Bert B. Fletcher

IPC: H01C1/01 ,  H01C1/14 ,  H01C17/28 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01C17/28 ,  H01C1/01 ,  H01C1/14 ,  H05K3/308 ,  H01F2027/295 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/166 ,  H05K3/3447 ,  Y10T29/49082 ,  Y10T29/49087

Abstract: An electrical resistor comprising an elongated resistor body having a resistance wire winding extending between its ends and terminals at each end contact the resistance winding and each comprise a strip of given width having a first end portion extending about and secured with an end of the body, and a second end portion which extends in a direction transverse to the axis of the body and has a tip for being received through an opening in a printed circuit board. Each strip has an intermediate neck portion of reduced width which is positioned proximate to the resistor body and is twisted so that the second portion extends in a plane which is perpendicular to the axis of the body and in the same direction with and spaced from that of the other terminal allowing adjustment of the distance between their tips. The second end portions each have a shoulder proximate to its tip which is seated on the surface of a circuit board, fixing the position of the resistor and stabilizing its mounting thereon.The method of making an electrical resistor comprises the steps of segmenting a continuous wire wound core to provide resistor bodies, and cutting out portions of a continuous substantially plane strip of metal material at spaced locations therealong to provide narrow neck regions, and first and second end portions above and below each neck region.

Abstract translation: 一种电阻器，包括细长电阻体，其具有在其端部之间延伸的电阻线绕组和在每个端部处的端子与电阻绕组接触，并且每个包括具有给定宽度的条带，该第一端部围绕主体的端部延伸并固定， 以及第二端部，该第二端部在横向于所述主体的轴线的方向上延伸并且具有用于通过印刷电路板中的开口接收的尖端。 每个条具有减小的宽度的中间颈部，其位于接近电阻体的位置，并且被扭转，使得第二部分在垂直于主体的轴线并沿与该主体的轴线相同的方向延伸并且与 另一个终端允许调整他们的提示之间的距离。 第二端部各自具有靠近其尖端的肩部，其位于电路板的表面上，固定电阻器的位置并稳定其安装在其上。 制造电阻器的方法包括以下步骤：分割连续绕线芯以提供电阻体，并在其间隔开的位置处切割金属材料连续基本上平面的条的部分以提供窄的颈部区域，以及第一和第二端 每个颈部上方和下方的部分。

公开(公告)号：US3780433A

公开(公告)日：1973-12-25

申请号：US3780433D

申请日：1972-05-01

Applicant: AMP INC

Inventor： LYNCH J

IPC: H01R4/02 ,  H05K3/34 ,  H01R43/00

CPC classification number: H01R12/58 ,  H01R4/02 ,  H05K3/3447 ,  H05K2201/1081 ,  H05K2201/10848 ,  H05K2201/10984 ,  Y10T29/49149

Abstract: A connector post or pin is disclosed which is particularly suitable for use with printed circuit board assemblies. The post includes a coined portion which is designed to permit the pin to be easily inserted into holes of a predetermined size in printed circuit boards, and to increase the quality of a solder joint between the post and the printed circuit board. A solder stripe is placed on each post in the coined region to facilitate soldering of the posts to conductive portions of the printed circuit board. The posts are attached in groups to break-away carrier strips to aid in the rapid assembly of large numbers of posts to printed circuit boards. The posts may also include provisions for coupling them to multilayered printed circuit assemblies. A method of fabricating the coined post is also disclosed which converts a post with normally an interference fit in a printed circuit board aperture to a post which is freely received in the aperture together with masses of solder adhered to said post.

Abstract translation: 公开了一种连接器柱或销，其特别适用于印刷电路板组件。 该柱包括设计成允许销易于插入到印刷电路板中的预定尺寸的孔中的模制部分，并且提高柱和印刷电路板之间的焊接接头的质量。 在打印区域中的每个柱上放置焊料条以便于将柱焊接到印刷电路板的导电部分。 这些柱子分组连接以分离载体条，以帮助将大量柱体快速组装到印刷电路板上。 柱子还可以包括用于将它们耦合到多层印刷电路组件的规定。 还公开了一种制造造型柱的方法，其将通常在印刷电路板孔中的过盈配合的柱转换成自由接收在孔中的柱以及粘附到所述柱的焊料块。